公开(公告)号：US20210233891A1

公开(公告)日：2021-07-29

申请号：US16899149

申请日：2020-06-11

Applicant: SK hynix Inc.

Inventor： Won Duck JUNG

IPC: H01L25/065

Abstract: A semiconductor package includes a package substrate, a base module disposed on the package substrate and configured to include an intermediate chip, bonding wires connecting the intermediate chip to the package substrate, a lower-left chip disposed between the base module and the package substrate, and an upper-left chip disposed on the base module. The base module further includes an encapsulant encapsulating the intermediate chip, through vias electrically connected to the upper-left chip, and redistributed lines (RDLs) connecting the intermediate chip to the through vias and extending to provide connection parts which are spaced apart from the through vias and are connected to the lower-left chip.

公开(公告)号：US20180247897A1

公开(公告)日：2018-08-30

申请号：US15856695

申请日：2017-12-28

Applicant: SK hynix Inc.

Inventor： Won Duck JUNG ,  Sang Joon LIM ,  Sung Mook LIM

IPC: H01L23/552 ,  H01L23/482 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L23/4824 ,  H01L24/02 ,  H01L24/10 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: Disclosed is a semiconductor package. The semiconductor package may include a substrate a semiconductor chip mounted over a surface of the substrate such that an active surface of the semiconductor chip faces the surface of the substrate. The semiconductor chip and substrate may be configured for shielding or scattering electromagnetic waves.