CIRCUIT BOARD, ELECTRONIC CIRCUIT DEVICE, AND PRODUCTION METHOD OF CIRCUIT BOARD

    公开(公告)号:US20190281705A1

    公开(公告)日:2019-09-12

    申请号:US16296547

    申请日:2019-03-08

    Inventor: Akihiko HANYA

    Abstract: Provided is a circuit board for reducing a likelihood of so-called through-hole disconnection, and enhancing connection reliability on both sides of a substrate via a through-hole. The circuit board has a substrate with the through-hole, a first conductive part covering an opening of the through-hole on one surface of the substrate in a manner blocking the opening, having a portion inserted into the through-hole from the one surface, and a second conductive part covering a second opening of the through-hole on the other surface of the substrate in a manner blocking the second opening, having a portion inserted into the through-hole from the other surface. The portion of the first conductive part inserted in the through-hole has a columnar shape forming a columnar portion having a diameter smaller than the through-hole. The portion of the second conductive part inserted in the through-hole has a shape that fills a gap between the columnar portion of the first conductive part and an inner surface of the through-hole. Both of the first and the second conductive parts comprise conductive particles being sintered.

    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR PRODUCING THE SAME

    公开(公告)号:US20180090469A1

    公开(公告)日:2018-03-29

    申请号:US15710605

    申请日:2017-09-20

    Inventor: Akihiko HANYA

    Abstract: A light-emitting device having a plurality of light-emitting elements closely adjacently disposed in spite of using only one substrate is provided.One or more light-emitting elements are flip-chip mounted on each of upper surface and lower surface of a substrate. The light-emitting elements are disposed so that the light-emitting elements on the upper surface of the substrate and the light-emitting elements on the lower surface of the substrate are closely adjacent to each other when they are seen from above the substrate. The light-emitting elements mounted on the upper surface of the substrate have light-emitting surfaces as the upper surfaces, and the light-emitting elements mounted on the lower surfaces of the substrate have light-emitting surfaces on the substrate side. The substrate transmits at least lights emitted by the light-emitting elements mounted on the lower surface of the substrate.

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