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11.发明申请公开(公告)号：US20200010705A1
公开(公告)日：2020-01-09
申请号：US16459925
申请日：2019-07-02
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor： Hiroto FUKUSHIMA , Akihiko HANYA
Abstract: An object of the present invention is to provide a composition for sintering capable of suppressing a crack from occurring in a wiring after sintering. Provided is the composition for sintering including silver nanoparticles, an organic dispersant for coating the silver nanoparticles, and a solvent. When the composition for sintering is heated, a weight loss rate in a range of 260° C. to 600° C. is 2.92% or less.
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公开(公告)号：US20190281705A1
公开(公告)日：2019-09-12
申请号：US16296547
申请日：2019-03-08
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor： Akihiko HANYA
Abstract: Provided is a circuit board for reducing a likelihood of so-called through-hole disconnection, and enhancing connection reliability on both sides of a substrate via a through-hole. The circuit board has a substrate with the through-hole, a first conductive part covering an opening of the through-hole on one surface of the substrate in a manner blocking the opening, having a portion inserted into the through-hole from the one surface, and a second conductive part covering a second opening of the through-hole on the other surface of the substrate in a manner blocking the second opening, having a portion inserted into the through-hole from the other surface. The portion of the first conductive part inserted in the through-hole has a columnar shape forming a columnar portion having a diameter smaller than the through-hole. The portion of the second conductive part inserted in the through-hole has a shape that fills a gap between the columnar portion of the first conductive part and an inner surface of the through-hole. Both of the first and the second conductive parts comprise conductive particles being sintered.
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公开(公告)号：US20180090469A1
公开(公告)日：2018-03-29
申请号：US15710605
申请日：2017-09-20
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor： Akihiko HANYA
IPC: H01L25/075 , H01L33/62 , H01L25/00
CPC classification number: H01L25/075 , H01L24/16 , H01L24/81 , H01L25/0756 , H01L25/50 , H01L33/62 , H01L2224/16225 , H01L2933/0066
Abstract: A light-emitting device having a plurality of light-emitting elements closely adjacently disposed in spite of using only one substrate is provided.One or more light-emitting elements are flip-chip mounted on each of upper surface and lower surface of a substrate. The light-emitting elements are disposed so that the light-emitting elements on the upper surface of the substrate and the light-emitting elements on the lower surface of the substrate are closely adjacent to each other when they are seen from above the substrate. The light-emitting elements mounted on the upper surface of the substrate have light-emitting surfaces as the upper surfaces, and the light-emitting elements mounted on the lower surfaces of the substrate have light-emitting surfaces on the substrate side. The substrate transmits at least lights emitted by the light-emitting elements mounted on the lower surface of the substrate.
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公开(公告)号：US20180090035A1
公开(公告)日：2018-03-29
申请号：US15710565
申请日：2017-09-20
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor： Akihiko HANYA , Kosaburo ITO , Yoshiyuki ABE
CPC classification number: G09F7/002 , B60S1/026 , E04D13/103 , F21V33/00 , H05K1/0306 , H05K1/167 , H05K2201/0108 , H05K2201/0145 , H05K2201/0154 , H05K2201/0162 , H05K2201/10106
Abstract: A thin light-transmitting substrate showing high thermal conduction efficiency, and having a function of raising surface temperature thereof is provided.The light-transmitting substrate of the present invention comprises a substrate that transmits at least a light of a predetermined wavelength, and a conductor pattern that is disposed on the substrate, and generates heat to raise temperature of the surface of the substrate when it is supplied with an electric current. The conductor pattern is directly disposed on the substrate without any adhesive layer.
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