公开(公告)号：US20240170416A1

公开(公告)日：2024-05-23

申请号：US18429080

申请日：2024-01-31

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/00 ,  H01L23/28 ,  H01L23/66 ,  H01L25/00 ,  H01L21/60

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/28 ,  H01L23/66 ,  H01L24/94 ,  H01L25/50 ,  H01L2021/60112

Abstract: A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.

公开(公告)号：US11784133B2

公开(公告)日：2023-10-10

申请号：US17136197

申请日：2020-12-29

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L21/00 ,  H01L23/552 ,  H01L21/311 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L21/31144 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/66 ,  H01L24/09 ,  H01L24/17

Abstract: A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.

公开(公告)号：US20200373249A1

公开(公告)日：2020-11-26

申请号：US16991370

申请日：2020-08-12

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/28 ,  H01L25/00 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.

公开(公告)号：US10784210B2

公开(公告)日：2020-09-22

申请号：US16234156

申请日：2018-12-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/28 ,  H01L21/56 ,  H01L21/78 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L21/60

Abstract: A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.

公开(公告)号：US20200211977A1

公开(公告)日：2020-07-02

申请号：US16234233

申请日：2018-12-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01R43/20 ,  H01R43/26 ,  H01R12/79 ,  H01R12/52

Abstract: A semiconductor device has a substrate including a terminal and an insulating layer formed over the terminal. An electrical component is disposed over the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the insulating layer over the terminal is exposed from the encapsulant. A shielding layer is formed over the encapsulant and terminal. A portion of the shielding layer is removed to expose the portion of the insulating layer. The portion of the insulating layer is removed to expose the terminal. The portion of the shielding layer and the portion of the insulating layer can be removed by laser ablation.

公开(公告)号：US20200211976A1

公开(公告)日：2020-07-02

申请号：US16234156

申请日：2018-12-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/28 ,  H01L23/00 ,  H01L25/00 ,  H01L21/56

Abstract: A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.