公开(公告)号：US20210328403A1

公开(公告)日：2021-10-21

申请号：US17229710

申请日：2021-04-13

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Fabien QUERCIA ,  Jean-Michel RIVIERE

IPC: H01S5/02345 ,  H01L23/00

Abstract: Electronic device comprising a support substrate having a mounting face and an electronic chip having a rear face bonded on the mounting face by a volume of adhesive, wherein the support substrate comprises a plurality of wedging elements projecting from the mounting face so as to hold the chip bearing on contact areas of the wedging elements in a position substantially parallel to the mounting face of the support substrate.

公开(公告)号：US20210066271A1

公开(公告)日：2021-03-04

申请号：US17006092

申请日：2020-08-28

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Remi BRECHIGNAC ,  Jean-Michel RIVIERE

IPC: H01L25/16 ,  H01L33/62 ,  H01L31/02 ,  H01L31/0203 ,  H01L33/52

Abstract: An opaque dielectric carrier and confinement substrate is formed by a stack of layers laminated on each other. The stack includes a solid back layer and a front frame having a peripheral wall and an intermediate partition which delimits two cavities located on top of the solid back layer and on either side of the intermediate partition. Electronic integrated circuit (IC) chips are located inside the cavities and mounted on top of the solid back layer. Each IC chip includes an integrated optical element. Electrical connections are provided between the IC chips and back electrical contacts of the solid back layer. Transparent encapsulation blocks are molded in the cavities to embed the IC chips.

公开(公告)号：US20200072446A1

公开(公告)日：2020-03-05

申请号：US16552419

申请日：2019-08-27

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Romain COFFY ,  Jean-Michel RIVIERE

IPC: F21V17/10 ,  F21V23/00 ,  F21V17/06 ,  F21V17/08 ,  F21V3/04

Abstract: The present disclosure relates to a light-emitting device comprising: a light source mounted on a substrate; a wire for providing a supply voltage or activation signal to the light source, a cap covering the light source and having a diffuser adapted to diffuse light generated by the light source; and either: a volume of glue fixing an intermediate section of the wire to the cap; or an arm fixed to the cap and extending between the intermediate section of the wire and the substrate.

公开(公告)号：US20200033537A1

公开(公告)日：2020-01-30

申请号：US16519753

申请日：2019-07-23

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Florian PERMINJAT ,  Jean-Michel RIVIERE

IPC: G02B6/30

Abstract: An electronic chip includes an integrated optical-wave guide having an end section that extends parallel to a face of the electronic chip. A local groove provided in the electronic chip extends adjacent to the end section of the integrated optical-wave guide. An elongate optical cable includes an optical-wave guide and has an end portion that is at least partially engaged in the local groove. The end portion of the elongate optical cable is configured to support an optical coupling of the optical-wave guide to the integrated optical-wave guide via lateral coupling in a zone of the local groove. An exterior package is provided to house the electronic chip.

公开(公告)号：US20190319160A1

公开(公告)日：2019-10-17

申请号：US16377379

申请日：2019-04-08

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jean-Michel RIVIERE

IPC: H01L31/167 ,  H01L31/02 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/0232 ,  G01V8/20

Abstract: A main carrier wafer includes a first integrated network of electronic connections between front and back faces. A first electronic chip is mounted to the front face of the main carrier wafer and connected to the network of electronic connections of the main carrier wafer. A secondary carrier wafer includes a platform that extends over the first chip and a base the protrudes backwards with respect to the platform to a back end face facing the main wafer. A second integrated network of electronic connections is provided within the secondary carrier wafer. A second electronic chip is mounted on top of the platform and connected to the second integrated network. The second integrated network is further connected to the main carrier wafer at the back end face.

公开(公告)号：US20210135038A1

公开(公告)日：2021-05-06

申请号：US17071694

申请日：2020-10-15

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Remi BRECHIGNAC ,  Jean-Michel RIVIERE

IPC: H01L31/16 ,  H01L23/00

Abstract: An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated in a transparent block. An opaque conductive layer is applied to a top surface and a side surface of the transparent block. The receiver is mounted to the opaque conductive layer at the top surface. An electrical connection is made between the receiver and the opaque conductive layer. A conductive strip is also mounted to the side surface of the transparent block and isolated from the opaque conductive layer. A further electrical connection is made between the receiver and the conductive strip.

公开(公告)号：US20200303565A1

公开(公告)日：2020-09-24

申请号：US16896780

申请日：2020-06-09

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine SAXOD ,  Veronique FERRE ,  Agnes BAFFERT ,  Jean-Michel RIVIERE

IPC: H01L31/0203 ,  H01L21/56 ,  H01L31/0232 ,  H01L31/16

Abstract: An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.

公开(公告)号：US20200168582A1

公开(公告)日：2020-05-28

申请号：US16692720

申请日：2019-11-22

Applicant: STMicroelectronics Pte Ltd ,  STMicroelectronics (Grenoble 2) SAS

Inventor： David GANI ,  Jean-Michel RIVIERE

IPC: H01L25/065 ,  H01L23/498 ,  H01L23/48 ,  H01L23/528

Abstract: An electronic device includes a support substrate to which a first electronic chip and a second electronic chip are mounted in a position situated on top of one another. First electrical connection elements are interposed between the first electronic chip and the support substrate. Second electrical connection elements are interposed between the second electronic chip and the support substrate and are situated at a distance from a periphery of the first electronic chip. Third electrical connection elements are interposed between the first electronic chip and the second electronic chip.

公开(公告)号：US20190376666A1

公开(公告)日：2019-12-12

申请号：US16432561

申请日：2019-06-05

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Romain COFFY ,  Jean-Michel RIVIERE

IPC: F21V15/01 ,  F21V19/00

Abstract: A housing for a light source mounted on a substrate, the housing comprising: a barrel having first and second conducting columns; and a diffuser having a through-hole or partial hole filled with a conductive plug, the conductive plug electrically bridging a gap in an electrical connection between the first and second conducting columns.

公开(公告)号：US20190355864A1

公开(公告)日：2019-11-21

申请号：US16409714

申请日：2019-05-10

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Alexandre COULLOMB ,  Romain COFFY ,  Jean-Michel RIVIERE

IPC: H01L31/16

Abstract: A device includes a substrate and an optoelectronic chip buried in the substrate. The substrate may include an opening above a first optical transduction region of the first optoelectronic chip and above a second optical transduction region of a second optoelectronic chip.