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公开(公告)号：US09991409B2
公开(公告)日：2018-06-05
申请号：US14968359
申请日：2015-12-14
Applicant: STMicroelectronics Pte Ltd
Inventor： Yonggang Jin , Wee Chin Judy Lim
IPC: H01L31/16 , H01L31/0232 , H01L31/18 , H03K17/94 , H03K17/96 , H01L31/167 , G01S17/02 , G01S7/481 , H01L25/16 , G01V8/12
CPC classification number: H01L31/16 , G01S7/4813 , G01S17/026 , G01V8/12 , H01L21/568 , H01L25/167 , H01L31/0232 , H01L31/02327 , H01L31/167 , H01L31/18 , H01L31/186 , H01L2224/04105 , H01L2224/18 , H01L2224/19 , H01L2924/3511 , H03K17/941 , H03K17/9631 , H03K17/9638 , H03K2217/96023 , Y10T156/1052 , Y10T156/1064
Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.
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公开(公告)号：US09723186B2
公开(公告)日：2017-08-01
申请号：US14183937
申请日：2014-02-19
Applicant: STMicroelectronics Pte Ltd.
Inventor： Loic Pierre Louis Renard , Wee Chin Judy Lim
CPC classification number: H04N5/2254 , H04N5/217 , H04N5/2257 , H04N5/3572 , H04N17/002 , Y10T29/49128
Abstract: A low-cost resin lens is disclosed for use in miniature cameras. The resin lens features a low profile that is particularly well-suited to consumer products such as smart phones. The resin lens is mounted to an integrated circuit die that is attached to a standard four-layer substrate. The integrated circuit die includes electronic and/or optoelectronic circuits to support digital image capture, transfer, and processing. Image correction software adjusts the image to correct for distortion introduced by the resin lens.
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13.发明申请公开(公告)号：US20160099373A1
公开(公告)日：2016-04-07
申请号：US14968359
申请日：2015-12-14
Applicant: STMicroelectronics Pte Ltd
Inventor： Yonggang Jin , Wee Chin Judy Lim
IPC: H01L31/16 , H01L31/18 , H01L31/0232 , H01L25/16
CPC classification number: H01L31/16 , G01S7/4813 , G01S17/026 , G01V8/12 , H01L21/568 , H01L25/167 , H01L31/0232 , H01L31/02327 , H01L31/167 , H01L31/18 , H01L31/186 , H01L2224/04105 , H01L2224/18 , H01L2224/19 , H01L2924/3511 , H03K17/941 , H03K17/9631 , H03K17/9638 , H03K2217/96023 , Y10T156/1052 , Y10T156/1064
Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.
Abstract translation: 光学检测传感器用作包括光学系统和选择性透射结构的接近检测传感器。 诸如激光的电磁辐射可以通过选择性透射结构的透射部分发射。 可以检测反射光束以确定物体的存在。 传感器通过将透射结构封装在第一密封体中并将光学系统封装在第二密封体内而形成。 然后将第一和第二密封剂体接合在一起。 在晶片规模中组装由连接的密封体产生的结构被切割以形成光学检测传感器。
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Patent Agency Ranking
公开(公告)号：US10403661B2
公开(公告)日：2019-09-03
申请号：US15619649
申请日：2017-06-12
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jean-Michel Grebet , Wee Chin Judy Lim
IPC: H01L27/146 , H01L31/0203
Abstract: An image sensing device includes an interconnect layer and a number of grid array contacts arranged on a bottom side of the interconnect layer. An image sensor integrated circuit (IC) is carried by the interconnect layer and has an image sensing surface. A number of electrical connections are coupled between the image sensor IC and an upper side of the interconnect layer. A transparent plate overlies the image sensing surface of the image sensor IC. A cap is carried by the interconnect layer and has an opening overlying transparent plate and the image sensing surface. The cap has an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity and the cap defines an air vent coupled to the internal cavity.
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公开(公告)号：US10381504B2
公开(公告)日：2019-08-13
申请号：US15969908
申请日：2018-05-03
Applicant: STMicroelectronics Pte Ltd
Inventor： Yonggang Jin , Wee Chin Judy Lim
IPC: H01L31/16 , H01L31/0232 , H01L31/18 , H03K17/94 , H03K17/96 , H01L31/167 , G01S17/02 , G01S7/481 , H01L25/16 , G01V8/12 , H01L21/56
Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.
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公开(公告)号：US09691801B2
公开(公告)日：2017-06-27
申请号：US14578718
申请日：2014-12-22
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jean-Michel Grebet , Wee Chin Judy Lim
IPC: H01L27/146 , H01L31/0203
CPC classification number: H01L27/14618 , H01L27/14636 , H01L27/14683 , H01L31/0203 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/00014
Abstract: An image sensing device may include an interconnect layer and grid array contacts carried by the interconnect layer, and an image sensor IC carried by the interconnect layer and coupled to the grid array contacts, the image sensor IC having an image sensing surface. The image sensing device may include a transparent plate carried by the image sensor IC and aligned with the image sensing surface, and a cap carried by the interconnect layer and having an opening aligned with the image sensing surface. The cap may have an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity, and the cap may define an air vent coupled to the internal cavity.
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公开(公告)号：US09244334B2
公开(公告)日：2016-01-26
申请号：US13853598
申请日：2013-03-29
Applicant: STMicroelectronics Pte Ltd.
Inventor： Hk Looi , Wee Chin Judy Lim , Cheng-Hai Cheh , Bs Aw , David Gani , Tin-Tun Maung , Choon Lee Lai
CPC classification number: G03B3/10 , G02B7/08 , G02B7/09 , H02K41/031 , Y10T29/4913
Abstract: Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.
Abstract translation: 这里描述的触点的各种实施例包括相对于彼此成角度的不同部分和制造包括这种触点的装置的方法。 在一些实施例中，模块可以包括设置在壳体内的接触件的第一部分和设置在壳体外部的第二部分，其中第二部分相对于第一部分成角度。 制造这样的器件可以包括沉积导电材料以将触点电连接到衬底的接触焊盘。 在一些实施例中，用于沉积导电材料的沉积工艺可以具有最小尺寸，其限定一旦沉积的导电材料的最小尺寸。 在一些这样的实施例中，接触针的末端与接触垫之间的距离可以大于沉积过程的最小尺寸。
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18.发明申请公开(公告)号：US20140293558A1
公开(公告)日：2014-10-02
申请号：US13852373
申请日：2013-03-28
Applicant: STMICROELECTRONICS PTE LTD.
Inventor： Wee Chin Judy Lim
CPC classification number: H05K1/0215 , H05K9/0024 , H05K9/0039 , H05K2201/2018 , Y10T29/49124
Abstract: A lens mount is attached to a circuit board and covers electrical components on the circuit board. An electrically insulating device is positioned between the lens mount and the circuit board. The circuit board includes a grounding pad adjacent the electrically insulating device. The lens mount includes an aperture aligned with the grounding pad and the electrically insulating device. A conductive glue is dispensed into the aperture to electrically ground the lens mount to the grounding pad. The electrically insulating device seals the conductive glue from the electrical components. A method of grounding a lens mount to a circuit board is provided.
Abstract translation: 镜头座安装在电路板上并覆盖电路板上的电气部件。 电绝缘装置位于透镜支架和电路板之间。 电路板包括邻近电绝缘装置的接地垫。 透镜座包括与接地垫和电绝缘装置对准的孔。 将导电胶分配到孔中以将透镜安装座电接地到接地垫。 电绝缘装置将导电胶从电气部件密封。 提供了一种将透镜座连接到电路板的方法。
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