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公开(公告)号：US20220208819A1
公开(公告)日：2022-06-30
申请号：US17556604
申请日：2021-12-20
Applicant: STMICROELECTRONICS LTD , STMICROELECTRONICS PTE LTD
Inventor： David GANI , Yiying KUO
IPC: H01L27/146 , H01L23/498
Abstract: The present disclosure is directed to a package that includes a transparent layer that is on and covers a sensor of a die as well as a plurality of electrical connections that extend from a first surface of the package to the second surface of the package opposite to the first surface. In at least one embodiment of a package, the electrical connections each include a conductive structure that extends through the transparent layer to a first side of a corresponding contact pad of the die, and at least one electrical that extends into the second surface of the die to a second side of the corresponding contact pad that is opposite to the first side. In at least another embodiment of a package, the electrical connections include a conductive structure that extends through a molding compound to a first side of a corresponding contact pad of the die, and at least one electrical via that extends into the second surface of the die to a second side of the corresponding contact pad opposite to the first side.
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公开(公告)号：US20210066198A1
公开(公告)日：2021-03-04
申请号：US16987002
申请日：2020-08-06
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Yong CHEN , David GANI
IPC: H01L23/538 , H01L25/065 , H01L23/00
Abstract: The present disclosure is directed to a package that includes openings that extend into the package. The openings are filled with a conductive material to electrically couple a first die in the package to a second die in the package. The conductive material that fills the openings forms electrical interconnection bridges between the first die and the second die. The openings in the package may be formed using a laser and a non-doped molding compound, a doped molding compound, or a combination of doped or non-doped molding compounds.
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公开(公告)号：US20230230949A1
公开(公告)日：2023-07-20
申请号：US18153937
申请日：2023-01-12
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Yong CHEN , David GANI
IPC: H01L23/00
CPC classification number: H01L24/24 , H01L24/16 , H01L24/73 , H01L2924/35121 , H01L2224/2402 , H01L2224/2405 , H01L2224/24226 , H01L2224/16058 , H01L2224/16059 , H01L2224/16227 , H01L2224/16238 , H01L2224/73209
Abstract: A semiconductor package includes a die and a first lamination layer on the die with openings through the first lamination layer. A redistribution layer is on the first lamination layer and extends through the openings to the die. A plurality of conductive extensions are on the redistribution layer with each stud including a first surface on the redistribution layer, a second surface opposite to the first surface, and a sidewall between the first surface and the second surface. A second lamination layer is on the redistribution layer and the first lamination layer with the die encapsulated in molding compound. The second lamination layer is removed around the conductive extensions to expose the second surface and at least a portion of the sidewall of each stud to improve solder bond strength when mounting the package to a circuit board.
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公开(公告)号：US20210305438A1
公开(公告)日：2021-09-30
申请号：US17187510
申请日：2021-02-26
Applicant: STMICROELECTRONICS LTD , STMICROELECTRONICS PTE LTD
Inventor： David GANI , Yiying KUO
IPC: H01L31/0203 , H01L31/02 , H01L31/18 , H01L31/0392
Abstract: The present disclosure is directed to a package, such as a wafer level chip scale package (WLCSP), with a die coupled to a central portion of a transparent substrate. The transparent substrate includes a central portion having and a peripheral portion surrounding the central portion. The package includes a conductive layer coupled to a contact of the die within the package that extends from the transparent substrate to an active surface of the package. The active surface is utilized to mount the package within an electronic device or to a printed circuit board (PCB) accordingly. The package includes a first insulating layer separating the die from the conductive layer, and a second insulating layer on the conductive layer.
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公开(公告)号：US20190154801A1
公开(公告)日：2019-05-23
申请号：US15818465
申请日：2017-11-20
Applicant: STMICROELECTRONICS PTE LTD
Inventor： David GANI
CPC classification number: G01S7/4808 , G01J1/4204 , G01S7/4813 , G01S7/4814 , G01S7/4816 , G01S7/4876 , G01S7/493 , G01S7/497 , G01S17/026 , G01S17/08
Abstract: A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.
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Patent Agency Ranking
16.发明申请公开(公告)号：US20160133662A1
公开(公告)日：2016-05-12
申请号：US14535423
申请日：2014-11-07
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Dave Alexis DELACRUZ , David GANI
IPC: H01L27/146
CPC classification number: H01L27/14625 , G03B3/10 , G03B17/02 , G03B29/00 , H01L27/14618 , H01L27/14685
Abstract: An image sensor device may include an interconnect layer, an image sensor IC on the interconnect layer, and a barrel adjacent the interconnect layer and having first electrically conductive traces. The image sensor device may include a liquid crystal focus cell carried by the barrel and having cell layers, and second electrically conductive contacts. A pair of adjacent cell layers may have different widths. The image sensor device may include an electrically conductive adhesive body coupling at least one of the second electrically conductive contacts to a corresponding one of the first electrically conductive traces.
Abstract translation: 图像传感器装置可以包括互连层，互连层上的图像传感器IC，以及与互连层相邻并且具有第一导电迹线的镜筒。 图像传感器装置可以包括由筒体承载并具有单元层的液晶聚焦单元和第二导电触点。 一对相邻的单元层可以具有不同的宽度。 图像传感器装置可以包括将至少一个第二导电触点耦合到第一导电迹线中的对应的一个的导电粘合体。
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公开(公告)号：US20230307302A1
公开(公告)日：2023-09-28
申请号：US18184436
申请日：2023-03-15
Applicant: STMICROELECTRONICS LTD , STMICROELECTRONICS PTE LTD
Inventor： David GANI , Hui-Tzu Wang
IPC: H01L23/04 , H01L25/065 , H01L23/00
CPC classification number: H01L23/04 , H01L25/0655 , H01L24/32 , H01L2924/16151 , H01L2924/16788 , H01L2224/32225
Abstract: A semiconductor package includes a silicon substrate with an active surface and an inactive surface. A semiconductor device, such as an image, light, or optical sensor, is formed in the active surface and disposed on the substrate. A glass plate is coupled to the substrate with adhesive. The glass plate includes a sensor area that corresponds to the area of the semiconductor device and holes through the glass plate that are generally positioned around the sensor area of the glass plate. During formation of the package, the holes through the glass plate allow gas released by the adhesive to escape the package and prevent formation of a gas bubble.
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公开(公告)号：US20220107392A1
公开(公告)日：2022-04-07
申请号：US17551001
申请日：2021-12-14
Applicant: STMICROELECTRONICS PTE LTD
Inventor： David GANI
Abstract: A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.
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19.发明申请公开(公告)号：US20210020555A1
公开(公告)日：2021-01-21
申请号：US16927776
申请日：2020-07-13
Inventor： Laurent HERARD , David PARKER , David GANI
IPC: H01L23/498 , H01L21/48
Abstract: The present disclosure provides devices and methods in which a semiconductor chip has a reduced size and thickness. The device is manufactured by utilizing a sacrificial or dummy silicon wafer. A recess is formed in the dummy silicon wafer where the semiconductor chip is mounted in the recess. The space between the dummy silicon wafer and the chip is filled with underfill material. The dummy silicon wafer and the backside of the chip are etched using any suitable etching process until the dummy silicon wafer is removed, and the thickness of the chip is reduced. With this process, the overall thickness of the semiconductor chip can be thinned down to less than 50 μm in some embodiments. The ultra-thin semiconductor chip can be incorporated in manufacturing flexible/rollable display panels, foldable mobile devices, wearable displays, or any other electrical or electronic devices.
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公开(公告)号：US20190267302A1
公开(公告)日：2019-08-29
申请号：US16270927
申请日：2019-02-08
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Yun LIU , David GANI
Abstract: A semiconductor package having a die with a sidewall protected by molding compound, and methods of forming the same are disclosed. The package includes a die with a first surface opposite a second surface and sidewalls extending between the first and second surfaces. A redistribution layer is formed on the first surface of each die. An area of the first surface of the die is greater than an area of the redistribution layer, such that a portion of the first surface of the die is exposed. When molding compound is formed over the die and the redistribution layer to form a semiconductor package, the molding compound is on the first surface of the die between an outer edge of the redistribution layer and an outer edge of the first surface. The molding compound is also on the sidewalls of the die, which provides protection against chipping or cracking during transport.
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