公开(公告)号：US10531204B2

公开(公告)日：2020-01-07

申请号：US16137439

申请日：2018-09-20

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Brioschi ,  Marco Omar Ghidoni

IPC: B06B1/02 ,  B81B7/02 ,  B81B7/04 ,  B81C1/00 ,  H04R1/44 ,  H04R3/00 ,  H04R7/06 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

公开(公告)号：US20190028815A1

公开(公告)日：2019-01-24

申请号：US16137439

申请日：2018-09-20

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Brioschi ,  Marco Omar Ghidoni

IPC: H04R19/04 ,  H04R7/06 ,  H04R31/00 ,  H04R19/00 ,  H04R3/00 ,  B81C1/00 ,  B06B1/02 ,  H04R1/44 ,  B81B7/04

CPC classification number: H04R19/04 ,  B06B1/0292 ,  B81B7/02 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2201/047 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/44 ,  H04R3/005 ,  H04R7/06 ,  H04R19/005 ,  H04R31/003 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

公开(公告)号：US10091587B2

公开(公告)日：2018-10-02

申请号：US15377627

申请日：2016-12-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Brioschi ,  Marco Omar Ghidoni

IPC: H04R25/00 ,  H04R19/04 ,  B06B1/02 ,  B81C1/00 ,  H04R3/00 ,  H04R19/00 ,  B81B7/04 ,  H04R1/44 ,  H04R7/06 ,  H04R31/00

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.