公开(公告)号：US20160209440A1

公开(公告)日：2016-07-21

申请号：US15081507

申请日：2016-03-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giulio RICOTTI ,  Alberto PAGANI ,  Fulvio Vittorio FONTANA ,  Ubaldo MASTROMATTEO

IPC: G01P15/11 ,  G01P15/097 ,  G01C19/5783

CPC classification number: G01P15/11 ,  B81B7/008 ,  B81B2201/025 ,  B81B2207/012 ,  B81C1/0023 ,  G01C19/5783 ,  G01P15/0802 ,  G01P15/097 ,  G01P15/105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An inertial sensor having a body with an excitation coil and a first sensing coil extending along a first axis. A suspended mass includes a magnetic-field concentrator, in a position corresponding to the excitation coil, and configured for displacing by inertia in a plane along the first axis. A supply and sensing circuit is electrically coupled to the excitation coil and to the first sensing coil, and is configured for generating a time-variable flow of electric current that flows in the excitation coil so as to generate a magnetic field that interacts with the magnetic-field concentrator to induce a voltage/current in the sensing coil. The integrated circuit is configured for measuring a value of the voltage/current induced in the first sensing coil so as to detect a quantity associated to the displacement of the suspended mass along the first axis.

公开(公告)号：US20160172311A1

公开(公告)日：2016-06-16

申请号：US14565934

申请日：2014-12-10

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto PAGANI ,  Giovanni GIRLANDO ,  Federico Giovanni ZIGLIOLI ,  Alessandro FINOCCHIARO

IPC: H01L23/00 ,  G01R31/28 ,  H01L23/528 ,  H01L21/768 ,  H01L21/762

CPC classification number: H01L23/562 ,  G01R31/2872 ,  H01L21/76224 ,  H01L22/14 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An IC may include a semiconductor substrate having circuitry formed in the substrate, an interconnect layer above the semiconductor substrate and having an antenna coupled to the circuitry, and a seal ring around a periphery of the interconnect layer. The IC may include an electrically insulating trench extending vertically into the semiconductor substrate and extending laterally across the semiconductor substrate from adjacent one side to adjacent another side.

Abstract translation: IC可以包括具有形成在衬底中的电路的半导体衬底，在半导体衬底上方的互连层，并且具有耦合到电路的天线以及围绕互连层周围的密封环。 IC可以包括垂直延伸到半导体衬底中的电绝缘沟槽，并且从相邻的一侧横向跨越半导体衬底延伸到相邻的另一侧。

公开(公告)号：US20200321457A1

公开(公告)日：2020-10-08

申请号：US16376482

申请日：2019-04-05

Applicant: STMicroelectronics S.r.l.

Inventor： Alessandro Paolo BRAMANTI ,  Alberto PAGANI

IPC: H01L29/778 ,  H01L29/417 ,  G01R31/26

Abstract: Embodiments are directed to electrically confined ballistic devices, circuits, and networks. One such device includes a heterostructure that has a first semiconductor layer, a second semiconductor layer, and a two-dimensional electrode gas (2DEG) layer between the first and second semiconductor layers. The device further includes an input electrode electrically coupled to the 2DEG layer and an output electrode electrically coupled to the 2DEG layer. A first confinement electrode is positioned on the heterostructure. The first confinement electrode, in use, generates first space charge regions which at least partially define a boundary of the ballistic device within the 2DEG layer between the input electrode and the output electrode in response to a first voltage.

公开(公告)号：US20190312136A1

公开(公告)日：2019-10-10

申请号：US16377080

申请日：2019-04-05

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandro Paolo BRAMANTI ,  Alberto PAGANI

IPC: H01L29/76 ,  H01L29/10 ,  H01L29/423

Abstract: A device includes a particle propagation channel, a particle deflector, a particle source, and a particle sink. The particle deflector facilitates ballistic transport of particles from a particle inflow portion through a particle flow deflection portion to a particle outflow portion. The particle deflector is arranged at the particle flow deflection portion and is activatable to deflect particles in the flow deflection portion and is configured to selectively prevent the particles from reaching the particle outflow portion. The particle source and particle sink are configured to cause a current path of the particles through the device.

公开(公告)号：US20150260597A1

公开(公告)日：2015-09-17

申请号：US14656391

申请日：2015-03-12

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto PAGANI

IPC: G01L9/00

CPC classification number: G01L9/0054 ,  G01L9/0052 ,  G01L27/002 ,  Y10T29/42

Abstract: A microelectromechanical sensing structure having a membrane region including a membrane that undergoes deformation as a function of a pressure and a first actuator that is controlled in a first operating mode and a second operating mode, the first actuator being such that, when it operates in the second operating mode, it contacts the membrane region and deforms the membrane in a way different from when it operates in the first operating mode.

Abstract translation: 一种微机电传感结构，其具有包括作为压力的函数变形的膜的膜区域和被控制在第一操作模式和第二操作模式的第一致动器，所述第一致动器使得当其在 第二操作模式，其接触膜区域并使膜以与第一操作模式中的操作不同的方式变形。

公开(公告)号：US20140333336A1

公开(公告)日：2014-11-13

申请号：US14339406

申请日：2014-07-23

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto PAGANI

IPC: G01R1/067

CPC classification number: G01R1/06761 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06733 ,  G01R1/06766 ,  G01R1/07 ,  G01R1/07314 ,  G01R31/312

Abstract: An embodiment of a test apparatus for executing a test of a set of electronic devices having a plurality of electrically conductive terminals, the test apparatus including a plurality of electrically conductive test probes for exchanging electrical signals with the terminals, and coupling means for mechanically coupling the test probes with the electronic devices. In an embodiment, the coupling means includes insulating means for keeping each one of at least part of the test probes electrically insulated from at least one corresponding terminal during the execution of the test. Each test probe and the corresponding terminal form a capacitor for electro-magnetically coupling the test probe with the terminal.

Abstract translation: 一种用于执行具有多个导电端子的电子装置的测试的测试装置的实施例，所述测试装置包括用于与端子交换电信号的多个导电测试探针，以及用于机械耦合 用电子设备测试探头。 在一个实施例中，耦合装置包括绝缘装置，用于在执行测试期间将至少部分测试探针中的每一个与至少一个相应的端子电绝缘。 每个测试探头和相应的端子形成用于将测试探头与端子电磁耦合的电容器。

公开(公告)号：US20140182390A1

公开(公告)日：2014-07-03

申请号：US14108951

申请日：2013-12-17

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto PAGANI ,  Federico Giovanni Ziglioli ,  Bruno Murari

IPC: G01L1/18 ,  H01L27/20

CPC classification number: G01L1/18 ,  H01L27/20

Abstract: The integrated electronic device is for detecting a local parameter related to a force observed in a given direction, within a solid structure. The device includes at least one sensor configured to detect the above-mentioned local parameter at least in the given direction through piezo-resistive effect. At least one damping element, integrated in the device, is arranged within a frame-shaped region that is disposed around the at least one sensor and belongs to a substantially planar region comprising a plane passing through the sensor and perpendicular to the given direction. Such at least one damping element is configured to damp forces acting in the planar region and substantially perpendicular to the given direction.

Abstract translation: 集成电子装置用于在固体结构内检测与在给定方向上观察到的力有关的局部参数。 该装置包括至少一个传感器，其配置成至少在给定方向上通过压阻效应来检测上述局部参数。 集成在装置中的至少一个阻尼元件布置在围绕至少一个传感器设置的框状区域中，并且属于基本上平面的区域，该区域包括通过传感器并垂直于给定方向的平面。 这样的至少一个阻尼元件构造成阻碍作用在平面区域中并基本垂直于给定方向的力。

公开(公告)号：US20140070834A1

公开(公告)日：2014-03-13

申请号：US14080112

申请日：2013-11-14

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto PAGANI

IPC: G01R1/04

CPC classification number: G01R31/2889 ,  B62M25/04 ,  G01R1/0491 ,  G01R1/06727 ,  G01R1/07342

Abstract: An embodiment of a probe card adapted for testing at least one integrated circuit integrated on a corresponding at least one die of a semiconductor material wafer, the probe card including a board adapted for the coupling to a tester apparatus, and a plurality of probes coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units, each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test, the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested.

Abstract translation: 适于测试集成在半导体材料晶片的对应的至少一个管芯上的至少一个集成电路的探针卡的实施例，所述探针卡包括适于耦合到测试仪器的板，以及耦合到 所述板，其中所述探针卡包括多个可更换的基本单元，每个所述基座单元包括用于接触被测集成电路的外部可接近端子的所述探针中的至少一个，所述多个可更换基本单元被布置为对应于 涉及包含待测试的集成电路的半导体材料晶片上的至少一个管芯的布置。

公开(公告)号：US20160245709A1

公开(公告)日：2016-08-25

申请号：US14626153

申请日：2015-02-19

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alberto PAGANI ,  Federico Giovanni ZIGLIOLI ,  Bruno MURARI

IPC: G01L1/20

CPC classification number: G01L5/0038 ,  F16B31/028 ,  G01L1/18 ,  G01L1/20

Abstract: A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a cavity. The IC die may include pressure sensing circuitry responsive to bending associated with the cavity, and an IC interface coupled to the pressure sensing circuitry.

Abstract translation: 压力感测装置可以包括构造成分配施加在彼此定位的第一和第二部件之间的负载的主体和由主体承载的压力传感器。 压力传感器可以包括支撑体和安装有支撑体并且限定空腔的IC模具。 IC芯片可以包括响应于与空腔相关联的弯曲的压力感测电路，以及耦合到压力感测电路的IC接口。

公开(公告)号：US20160041046A1

公开(公告)日：2016-02-11

申请号：US14780819

申请日：2014-03-27

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto PAGANI

IPC: G01L1/14 ,  G01L1/26

CPC classification number: G01L1/142 ,  G01L1/144 ,  G01L1/148 ,  G01L1/26 ,  G01L25/00

Abstract: The integrated electronic device detects the pressure related to a force applied in a predetermined direction within a solid structure. The device includes an integrated element that is substantially orthogonal to the direction of application of the force. First and second conductive elements are configured to face an operating surface. A measure module includes first and second measurement terminals which are electrically connected to the first and second conductive elements, respectively. A detecting element is arranged in the predetermined direction such that the operating surface is sandwiched between the first and second conductive elements and this detecting element. An insulating layer galvanically insulates the first and second conductive elements. A layer of dielectric material is sandwiched between the detecting element and the insulating layer, and is elastically deformable following the application of the force to change an electromagnetic coupling between the detecting element and the first and second conductive elements.

Abstract translation: 集成电子设备检测与固体结构内的预定方向上施加的力相关的压力。 该装置包括基本上与力的施加方向正交的集成元件。 第一和第二导电元件构造成面对操作表面。 测量模块包括分别电连接到第一和第二导电元件的第一和第二测量端子。 检测元件沿预定方向布置，使得操作表面被夹在第一和第二导电元件和该检测元件之间。 绝缘层使第一和第二导电元件电绝缘。 介电材料层被夹在检测元件和绝缘层之间，并且随着施加力而弹性变形，以改变检测元件与第一和第二导电元件之间的电磁耦合。