摘要:
A method of manufacturing a joined-type semiconductor device having a gate structure. The semiconductor device includes a first and second semiconductor substrates each having a substrate body, and a first and a second main surfaces which are opposite to each other. A gate structure is formed in the first main surface of the first substrate. A highly-doped semiconductor layer is formed in the first main surface of the second substrate and has an impurity-concentration which is higher than that of the substrate body of the second substrate. The first main surfaces of the two substrates are joined with each other, by subjecting the two substrates to a heat treatment so that impurities in the highly-doped semiconductor layer of the second substrate are driven into the surface region of the first substrate, and a diffusion layer is thereby formed in the first main surface of the first substrate.
摘要:
In a surface of a silicon substrate of one conductivity type, there are formed a plurality of depressions or recesses, gate regions of opposite conductivity type are formed at bottoms of respective recesses, gate electrodes are provided on respective gate regions, and an electrically conductive block is joined to the surface of the semiconductor substrate. Between the surface of the semiconductor substrate and the electrically conductive block a contact region having a high impurity concentration and/or an electrically conductive material layer may be provided in order to improve electrical and mechanical properties of the contact between the semiconductor substrate and the electrically conductive block. The gate region can have a high impurity concentration and a distance between a channel region and the electrically conductive block can be very small.
摘要:
A field controlled thyristor is disclosed which comprises a first emitter region exposed to one main surface of a semiconductor substrate and having a first conductivity type, a second emitter region exposed to the other main surface of the substrate and having a second conductivity type, a base region connecting the first and the second emitter region, and a gate region provided in the base region. The gate region consists of a slab-like first portion disposed parallel to both the emitter and a second portion connecting the first slab-like portion with one of the main surfaces of the semiconductor substrate. The impurity concentration of the base region is higher in the portion of the base region nearer to the emitter region having the same conductivity type as that of the base region than in the portion of the base region nearer to the emitter region having the opposite conductivity type to that of the base region. The field controlled thyristor has a high forward blocking voltage gain (anode-cathode voltage/gate bias voltage), a large current rating, and a high switching power capability and its switching time is very short.
摘要:
A normally-off semiconductor device with gate regions formed in a high-quality base is manufactured by forming a P.sup.+ layer in a lower surface of an N.sup.- substrate, selectively forming P.sup.+ gate regions in an upper surface of the N.sup.- substrate, forming intergate P.sup.+ regions in the upper surface of the N.sup.- substrate between the P.sup.+ gate regions, forming an N.sup.+ layer in an upper surface of an N.sup.- substrate, joining the N.sup.- substrate and the N.sup.- substrate to each other by heating them at about 800.degree. C. in a hydrogen atmosphere while the upper surface of the N.sup.- substrate and a lower surface of the N.sup.- substrate are being held against each other, and forming an anode electrode and a cathode electrode.
摘要翻译:通过在N基板的下表面中形成P +层,在N基板的上表面中选择性地形成P +栅极区域,制造在高品质基底上形成有栅极区域的常关半导体器件,形成栅极 P +栅极区域之间的N衬底的上表面中的P +区域,在N衬底的上表面中形成N +层,通过将N-衬底和N衬底彼此加热,以约800 在N基板的上表面和N基板的下表面彼此保持的同时,形成阳极电极和阴极电极。
摘要:
A semiconductor controlled rectifier comprising a semiconductor substrate consisting of four layers doped alternately with p- and n-type impurities, a pair of main electrodes kept in ohmic contact with the outermost p- and n-type layers, an N auxiliary region in the intermediate p-type layer with an auxiliary contact thereto, and a gate electrode in contact with the intermediate p-type layer, wherein a portion of the gate electrode is disposed adjacent to the auxiliary region, where there are localized regions forming low resistance paths between the gate electrode and the auxiliary electrode.
摘要:
A semiconductor controlled rectifier comprising a semiconductor substrate having four layers of PNPN types, a pair of main electrodes respectively in ohmic contact with the opposite outer layers, a gate electrode provided to the intermediate P-type layer, a N-type auxiliary region formed in the P-type intermediate layer at such a location that the gate electrode is positioned between the outer N-type layer and the auxiliary region, an auxiliary electrode in contact with the auxiliary region and the P-type intermediate layer, and means for short-circuiting a part of a PN junction formed between the N-type outer layer and the P-type intermediate layer.
摘要:
A semiconductor controlled rectifying device comprising a substrate having a four-layer structure wherein first and second regions are formed in one of the outermost layers of the structure and wherein a gate electrode is provided between the first and second regions.
摘要:
A semiconductor controlled rectifier comprising a four-layer semicondcutor substrate of pnpn structure, a pair of main electrodes in contact with the outer p-type and n-type layers respectively, and a gate electrode in contact with one of the intermediate layers forming a pn junction between it and the outer layer adjacent thereto, wherein gate current supplied from the gate electrode flows into the outer layer adjacent to the intermediate layer having the gate electrode thereon across a portion of the pn junction which portion is parallel with the surface of the said outer layer in contact with the main electrode.
摘要:
A gate structure including semiconductor regions each having a high impurity-concentration and being formed within respective one of recessed portions provided in a surface of a first semiconductor substrate, and then a second semiconductor substrate is brought into contact with the surface of the first semiconductor substrate. The gate structure may be formed such that each of the recessed portions is completely or partially filled with the gate structure. When the gate structure includes electrically good-conductive films of a high melting point metal or the like each formed in respective one of the recessed portions, the gate resistance can be further decreased.
摘要:
After selectively forming P.sub.+ -type gate regions 14 in the upper surface of a first N.sup.- -type semiconductor substrate 10, gate electrodes 30 are selectively formed on the P.sup.+ -type gate regions. A P.sup.+ -type layer 12 is formed in the lower surface of the N.sup.- -type substrate 10. Recessed portions 26 which can house the gate electrodes are formed in the lower surface of the second N.sup.- -type semiconductor substrate 20 and an N.sup.+ -type layer 22 is formed in the upper surface thereof. After removing impurities from the surfaces of the first and second semiconductor substrates 10 and 20 by RCA cleaning, the surfaces are cleaned with a pure water and are dried by a spinner. Then the substrates 10 and 20 are joined to each other by heating the substrates 10 and 20 at 700.degree.-1100.degree. C. in an H.sub.2 atmosphere, while the upper surface of the first semiconductor substrate 10 is brought into contact with projected portions 29 on the lower surface of the second semiconductor substrate 20. Thus there can be obtained a static induction thyristor, static induction transistor or gate turn-off thyristor, in each of which gate regions and gate electrodes are buried within a semiconductor substrate.