Abstract:
A display device includes a substrate, a semiconductor layer disposed on the substrate, a first insulating layer disposed on the semiconductor layer, a first conductive layer disposed on the first insulating layer and electrically connected to the semiconductor layer via a first contact hole, which is defined through the first insulating layer, a second insulating layer disposed on the first conductive layer, and a second conductive layer disposed on the second insulating layer and electrically connected to the first conductive layer via a second contact hole, which is defined through the second insulating layer, where the first and second contact holes overlap each other, and a residual layer, which includes a portion of the second insulating layer, is disposed in the first contact hole.
Abstract:
A manufacturing method of a display device according to some embodiments includes: forming a protrusion pattern on a carrier glass; coating a polymer on the protrusion pattern to form a polymer layer; forming a stacked structure on the polymer layer, including a transistor and an organic light emitting element connected to the transistor; and separating the carrier glass and the protrusion pattern from the polymer layer, wherein an opening penetrating the polymer layer is formed during the separation of the protrusion pattern.
Abstract:
A display device includes a substrate, a semiconductor layer disposed on the substrate, a first insulating layer disposed on the semiconductor layer, a first conductive layer disposed on the first insulating layer and electrically connected to the semiconductor layer via a first contact hole, which is defined through the first insulating layer, a second insulating layer disposed on the first conductive layer, and a second conductive layer disposed on the second insulating layer and electrically connected to the first conductive layer via a second contact hole, which is defined through the second insulating layer, where the first and second contact holes overlap each other, and a residual layer, which includes a portion of the second insulating layer, is disposed in the first contact hole.
Abstract:
The present disclosure provides a thin film transistor array. In an exemplary embodiment, the thin film transistor array includes: a substrate; a gate line including a gate pad and disposed on the substrate; a gate insulating layer disposed on the gate line and the gate pad; a data line including a data pad and disposed on the gate insulating layer; a first passivation layer disposed on the data line; a first electrode disposed on the first passivation layer; a second passivation layer disposed on the first electrode; and a second electrode disposed on the second passivation layer. The gate pad is exposed through a first contact hole, and the gate insulating layer, the first passivation layer, and the second passivation layer include at least a portion of the first contact hole.