PHOTONIC INTEGRATED APPARATUS
    12.
    发明申请

    公开(公告)号:US20250067930A1

    公开(公告)日:2025-02-27

    申请号:US18597121

    申请日:2024-03-06

    Abstract: A photonic integrated apparatus includes a substrate, a dielectric layer disposed on the substrate and including an opening exposing a part of the substrate, a photonic source contacting a partial area of the substrate through the opening, a waveguide disposed on the dielectric layer, and a photonic steering device disposed on the dielectric layer and configured to steer light emitted from the photonic source to the waveguide.

    BACKLIGHT UNIT USING MICRO OPTICAL SWITCH AND 3D IMAGE DISPLAY DEVICE
    17.
    发明申请
    BACKLIGHT UNIT USING MICRO OPTICAL SWITCH AND 3D IMAGE DISPLAY DEVICE 有权
    使用微光开关和3D图像显示装置的背光单元

    公开(公告)号:US20170059761A1

    公开(公告)日:2017-03-02

    申请号:US15090959

    申请日:2016-04-05

    CPC classification number: G02B6/005 G02B6/0051 G02B6/0053 G02B6/0055 G02B27/22

    Abstract: A backlight unit using a micro optical switch and a three-dimensional (3D) image display device are provided. The backlight unit includes a light source configured to irradiate light, a light guide plate configured to guide the irradiated light, an optical switch array including micro optical switches disposed above the light guide plate for each of cells of the backlight unit, and a lens array disposed above and corresponding to the optical switch array. Each of the micro optical switches includes a substrate, a first electrode layer disposed on the substrate and including first holes, and a second electrode layer spaced apart from the first electrode layer and including second holes not facing the first holes.

    Abstract translation: 提供了使用微型光学开关和三维(3D)图像显示装置的背光单元。 背光单元包括被配置为照射光的光源,被配置为引导照射的光的导光板,包括设置在导光板上方的微型光开关的光开关阵列,用于背光单元的每个单元,以及透镜阵列 设置在光开关阵列上方并对应于光开关阵列。 每个微型光学开关包括基板,设置在基板上并包括第一孔的第一电极层和与第一电极层间隔开的第二电极层,并且包括不面向第一孔的第二孔。

    CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER MODULE USING WIRE-BONDING
    18.
    发明申请
    CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER MODULE USING WIRE-BONDING 有权
    使用电线连接的电容式微型超声波传感器模块

    公开(公告)号:US20160016197A1

    公开(公告)日:2016-01-21

    申请号:US14665555

    申请日:2015-03-23

    CPC classification number: B06B1/0292 H01L2224/48091 H01L2924/00014

    Abstract: Provided are capacitive micromachined ultrasonic transducer (CMUT) modules. A CMUT module includes a CMUT chip which includes a plurality of first electrode pads on a first surface thereof; a flexible printed circuit (FPC) which is disposed on the first surface of the CMUT chip, the FPC including a plurality of first holes which are configured to expose the plurality of first electrode pads; a plurality of second electrode pads formed on the FPC so as to correspond to the plurality of first electrode pads; and a plurality of wires which connect each respective one of the plurality of first electrode pads to the corresponding one of the plurality of second electrode pads.

    Abstract translation: 提供电容微加工超声波换能器(CMUT)模块。 CMUT模块包括CMUT芯片,其在其第一表面上包括多个第一电极焊盘; 柔性印刷电路(FPC),其设置在所述CMUT芯片的所述第一表面上,所述FPC包括被配置为暴露所述多个第一电极焊盘的多个第一孔; 多个第二电极焊盘,形成在所述FPC上,以对应于所述多个第一电极焊盘; 以及将多个第一电极焊盘中的每一个连接到多个第二电极焊盘中的相应一个的多条电线。

Patent Agency Ranking