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公开(公告)号:US20220330787A1
公开(公告)日:2022-10-20
申请号:US17681566
申请日:2022-02-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Johannes BÜSING , Jongwook KWON , Sojeong KIM , Changhyun KIM , Hyunjoo KIM , Woojin SHIN
Abstract: Disclosed herein is a dishwasher. The dishwasher includes, a tub provided in the cabinet to form a washing chamber, and a drying apparatus arranged on a side wall of the tub and including a flow path provided to allow air sucked from the washing chamber to flow, a heater arranged in the flow path to heat air in the flow path, and a switch arranged upstream of the heater to turn off the heater in response to air, which is adjacent to the heater, reaching a predetermined temperature.
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公开(公告)号:US20210163296A1
公开(公告)日:2021-06-03
申请号:US17060893
申请日:2020-10-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Van Luan NGUYEN , Keunwook SHIN , Hyeonjin SHIN , Changhyun KIM , Changseok LEE , Yeonchoo CHO
IPC: C01B32/186
Abstract: A method of forming graphene includes: preparing a substrate in a reaction chamber; performing a first growth process of growing a plurality of graphene aggregates apart from each other on the substrate at a first growth rate by using a reaction gas including a carbon source; and performing a second growth process of forming a graphene layer by growing the plurality of graphene aggregates at a second growth rate slower than the first growth rate by using the reaction gas including the carbon source.
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13.
公开(公告)号:US20200294928A1
公开(公告)日:2020-09-17
申请号:US16884590
申请日:2020-05-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyung-Eun BYUN , Keunwook SHIN , Yonghoon KIM , Hyeonjin SHIN , Hyunjae SONG , Changseok LEE , Changhyun KIM , Yeonchoo CHO
IPC: H01L23/532
Abstract: Provided are an interconnect structure and an electronic device including the interconnect structure. The interconnect structure includes a dielectric layer including at least one trench, a conductive wiring filling an inside of the at least one trench, and a cap layer on at least one surface of the conductive wiring. The cap layer includes nanocrystalline graphene. The nanocrystalline includes nano-sized crystals.
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14.
公开(公告)号:US20200217917A1
公开(公告)日:2020-07-09
申请号:US16737219
申请日:2020-01-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jongyoub RYU , Geunwoo KIM , Changhyun KIM , Soohoon LEE , Byoungkab CHOI
Abstract: Provided is an electronic apparatus. The electronic apparatus includes an audio receiver configured to obtain an audio signal of sound output by an external object; a sensor configured to sense a posture of the electronic apparatus; a display; and a processor configured to, based on the audio signal that is obtained by the audio receiver, determine a direction in which the external object is located with respect to the electronic apparatus, and control the display to display a graphical object that corresponds to the external object based on the posture of the electronic apparatus sensed by the sensor and the direction in which the external object is located.
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公开(公告)号:US20200065635A1
公开(公告)日:2020-02-27
申请号:US16408702
申请日:2019-05-10
Applicant: SAMSUNG ELECTRONICS CO., LTD. , SNU R&DB FOUNDATION
Inventor: Bee LIM , Changhyun KIM , Kyoung MU LEE
Abstract: A processor-implemented object detection method is provided. The method receives an input image, generates a latent variable that indicates a feature distribution of the input image, and detects an object in the input image based on the generated latent variable.
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公开(公告)号:US20240178144A1
公开(公告)日:2024-05-30
申请号:US18521994
申请日:2023-11-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Keunwook SHIN , Hyeonjin SHIN , Sangwon KIM , Changhyun KIM , Baekwon PARK , Kyung-Eun BYUN
IPC: H01L23/532
CPC classification number: H01L23/53276 , H01L23/53295
Abstract: An interconnect structure may include a first dielectric layer including a trench, a first conductive layer in the trench and including a plurality of first graphene layers stacked in a direction from an inner surface of the trench toward a center of the trench, a second dielectric layer on the first dielectric layer and including a through hole extending to the trench, and a second conductive layer in the through hole.
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公开(公告)号:US20230180993A1
公开(公告)日:2023-06-15
申请号:US18076708
申请日:2022-12-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Johannes BÜSING , Jongwook KWON , Kyuha LEE , Changhyun KIM , Sungsan KIM , Joowan NAM , Woojin SHIN
CPC classification number: A47L15/486 , A47L15/4287 , A47L15/507
Abstract: A dishwasher includes: a tub including a washing room; and a dryer installed on one side of the tub, the dryer including: a first housing coupled with the tub and communicating with the washing room; a second housing coupled with an other side of the first housing, and forming a flow path together with the first housing so that inside air of the washing room circulates back to the washing room by passing through the flow path; a heater accommodated inside the first housing and the second housing to heat the air passing through the flow path; and a switch module positioned upstream of the heater, configured to detect an inside temperature of the flow path to turn on or off the heater based on the detected inside temperature, and fixed between the first housing and the second housing by coupling of the first housing with the second housing.
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公开(公告)号:US20230114347A1
公开(公告)日:2023-04-13
申请号:US18063909
申请日:2022-12-09
Inventor: Changhyun KIM , Sang-Woo Kim , Kyung-Eun BYUN , Hyeonjin SHIN , Ahrum SOHN , Jaehwan JUNG
IPC: H01L21/02
Abstract: Disclosed herein are a method of forming a transition metal dichalcogenide thin film and a method of manufacturing a device including the same. The method of forming a transition metal dichalcogenide thin film includes: providing a substrate in a reaction chamber; depositing a transition metal dichalcogenide thin film on the substrate using a sputtering process that uses a transition metal precursor and a chalcogen precursor and is performed at a first temperature; and injecting the chalcogen precursor in a gas state and heat-treating the transition metal dichalcogenide thin film at a second temperature that is higher than the first temperature. The substrate may include a sapphire substrate, a silicon oxide (SiO2) substrate, a nanocrystalline graphene substrate, or a molybdenum disulfide (MoS2) substrate.
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公开(公告)号:US20230038735A1
公开(公告)日:2023-02-09
申请号:US17970947
申请日:2022-10-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jisook LEE , Changhyun KIM , Hyunjoo KIM , Hosang PARK , Eungryeol SEO , Wonjae YOON
Abstract: A modular refrigerator including a main cabinet, and a sub-cabinet selectively coupleable to a right side, an upper side, and a left side, of the main cabinet. The main cabinet includes a cooling unit, a first connection duct for cold air generated by the cooling unit to flow toward the right side, a second connection duct for the cold air to flow toward the upper side, and a third connection duct for the cold air to flow toward the left side. The sub-cabinet includes a first branch duct that, when the sub-cabinet is coupled to the right side, communicates with the first connection duct, a second branch duct that, when the sub-cabinet is coupled to the upper side, communicates with the second connection duct, and a third branch duct that, when the sub-cabinet is coupled to the left side, communicates with third connection duct.
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公开(公告)号:US20210355582A1
公开(公告)日:2021-11-18
申请号:US17318238
申请日:2021-05-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyeonjin SHIN , Sangwon KIM , Kyung-Eun BYUN , Eunkyu LEE , Changhyun KIM , Changseok LEE
IPC: C23C16/50 , C23C16/26 , C23C16/32 , C01B32/182 , C01B21/064 , C01B25/00
Abstract: Provided are a conductive structure and a method of controlling a work function of metal. The conductive structure includes a conductive material layer including metal and a work function control layer for controlling a work function of the conductive structure by being bonded to the conductive material layer. The work function control layer includes a two-dimensional material with a defect.
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