公开(公告)号：US20240265839A1

公开(公告)日：2024-08-08

申请号：US18638228

申请日：2024-04-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon LEE ,  Jinyoung KIM ,  Sungyong MIN ,  Kyungwoon JANG ,  Changkyu CHUNG ,  Daesuck HWANG

IPC: G09G3/00 ,  H01L25/075 ,  H01L33/38 ,  H01L33/62

CPC classification number: G09G3/006 ,  H01L25/0753 ,  H01L33/382 ,  H01L33/62 ,  G09G2330/12

Abstract: An electroluminescence inspection apparatus includes a first substrate; a plurality of electrodes provided at a first surface of the first substrate; a driving circuit provided at a second surface of the first substrate opposite of the first surface and configured to apply a current to a plurality of light emitting diodes provided at a second substrate through the plurality of electrodes; and a plurality of wirings configured to electrically connect the plurality of electrodes with the driving circuit. At least one electrode of the plurality of electrodes includes a plurality of protrusions configured to contact the plurality of light emitting diodes of the second substrate.

公开(公告)号：US20230387372A1

公开(公告)日：2023-11-30

申请号：US18205312

申请日：2023-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonsuk LEE ,  Eunhye KIM ,  Sangmoo PARK ,  Jamyeong KOO ,  Sera KWON ,  Byunghoon LEE ,  Changkyu CHUNG

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/58 ,  H01L23/00

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/58 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L2224/30505 ,  H01L2224/30517 ,  H01L2224/3003 ,  H01L2224/3011 ,  H01L2224/32145 ,  H01L2924/12041 ,  H01L2224/2919 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2924/0132

Abstract: Provided is a display assembly including a plurality of light emitting diodes, a plurality of electrodes provided on the plurality of light emitting diodes, a substrate, a plurality of electrode pads provided on the substrate, the plurality of electrode pads being connected to the electrodes provided on the plurality of light emitting diodes, and an adhesive layer fixing the plurality of light emitting diodes to the substrate, wherein the adhesive layer includes a non-conductive polymer resin, a flux agent mixed with the non-conductive polymer resin, and a plurality of conductive particles dispersed in the non-conductive polymer resin and connecting the electrodes of the light emitting diodes and the plurality of electrode pads.

公开(公告)号：US20210111324A1

公开(公告)日：2021-04-15

申请号：US16991133

申请日：2020-08-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Changjoon Lee ,  Kwangrae Jo ,  Sungyong Min ,  Wonsoon Park ,  Kyungwoon Jang ,  Daesuck Hwang

IPC: H01L33/62 ,  G09G3/32 ,  H01L27/15 ,  H01L33/58 ,  H01L33/00 ,  H01L33/48

Abstract: A method of manufacturing a display module includes forming a driving circuit layer on a substrate, the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; forming an adhesive layer on the driving circuit layer; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and forming a black matrix layer on the adhesive layer, between the plurality of LEDs.