Abstract:
A design rule generating method is provided. The method includes receiving a test pattern, providing a plurality of workflows, which correspond to the test pattern and are preset in relation to a lithography model and a mask generation method, and performing simulation on the test pattern according to a workflow selected from the workflows.
Abstract:
A method of forming a pattern includes defining a plurality of patterns, defining a plurality of pitch violating patterns that contact the plurality of patterns and correspond to regions between the patterns, classifying the plurality of pitch violating patterns into a first region and a second region that is adjacent to the first region, selecting one of the first region and the second region, and forming an initial pattern defined as the selected first or second region. The selecting includes performing at least one of i) selecting a region that contact dummy patterns, ii) selecting a region of a same kind as one region, and iii) selecting a region that contacts a concave part of an enclosure from the first region and the second region.
Abstract:
A method of generating electronic circuit layout data can include electronically providing data representing a first standard cell layout including a first scaling enhanced circuit layout in an electronic storage medium. The first scaling enhanced circuit layout included in the first standard cell layout can be electronically defined using a marker layer. The first scaling enhanced circuit layout can be electronically swapped for a second scaling enhanced circuit layout to electronically generate data representing a second standard cell layout in the electronic storage medium. The data representing the second standard cell layout can be electronically verified.
Abstract:
A method of generating electronic circuit layout data can include electronically providing data representing a first standard cell layout including a first scaling enhanced circuit layout in an electronic storage medium. The first scaling enhanced circuit layout included in the first standard cell layout can be electronically defined using a marker layer. The first scaling enhanced circuit layout can be electronically swapped for a second scaling enhanced circuit layout to electronically generate data representing a second standard cell layout in the electronic storage medium. The data representing the second standard cell layout can be electronically verified.
Abstract:
A method of designing a layout of a semiconductor device includes designing layouts of cells, each layout including first conductive lines, the first conductive lines extending in a first direction and being spaced apart from each other in a second direction crossing the first direction, disposing the layouts of the cells to be adjacent to each other in the first direction, such that the first conductive lines in adjacent layouts of the cells are connected to each other, and disposing insulation blocks at a boundary area between adjacent ones of the layouts of the cells or in areas of the layouts of the cells adjacent to the boundary area, such that the insulation blocks block connections between some of the first conductive lines.
Abstract:
A semiconductor device and a method of manufacturing a semiconductor device, the device including gate structures on a substrate; source/drain layers on portions of the substrate that are adjacent the gate structures, respectively; first contact plugs contacting upper surfaces of the source/drain layers, respectively; a second contact plug contacting one of the gate structures, a sidewall of the second contact plug being covered by an insulating spacer; and a third contact plug commonly contacting an upper surface of at least one of the gate structures and at least one of the first contact plugs, at least a portion of a sidewall of the third contact plug not being covered by an insulating spacer.
Abstract:
A method of forming a pattern includes defining a plurality of patterns, defining a plurality of pitch violating patterns that contact the plurality of patterns and correspond to regions between the patterns, classifying the plurality of pitch violating patterns into a first region and a second region that is adjacent to the first region, selecting one of the first region and the second region, and forming an initial pattern defined as the selected first or second region. The selecting includes performing at least one of i) selecting a region that contact dummy patterns, ii) selecting a region of a same kind as one region, and iii) selecting a region that contacts a concave part of an enclosure from the first region and the second region.