公开(公告)号：US12302495B2

公开(公告)日：2025-05-13

申请号：US17900687

申请日：2022-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonkyung Chung ,  Jichul Kim ,  Jinyong Park ,  Gyeongmin Jin

IPC: H05K1/11 ,  H04M1/02 ,  H05K1/02 ,  H05K3/34

Abstract: According to an embodiment, an electronic device may include a first printed circuit board (PCB), a second PCB having a shape corresponding to the first PCB, and an interposer surrounding a space between the first PCB and the second PCB and including multiple pads, wherein the interposer may include a first surface in contact with the first PCB, a second surface in contact with the second PCB, a first lateral surface facing the space, and a second lateral surface opposite to the first lateral surface, and a first point exposed through the second lateral surface, a second point exposed through one of the first lateral surface or the second lateral surface, and a heat conduction pattern disposed on the first surface in an area between the multiple pads to connect the first point and the second point.

公开(公告)号：US12279371B2

公开(公告)日：2025-04-15

申请号：US17886327

申请日：2022-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyeongmin Jin ,  Jichul Kim ,  Yongjae Song ,  Jaeyeon Ra ,  Chagyu Song

IPC: H05K1/14 ,  H05K1/02

Abstract: Disclosed is a printed circuit board assembly comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; and an interposer arranged between the first printed circuit board and the second printed circuit board, wherein the second printed circuit board includes a first part and a second part extending in a first direction from a part of the first part and wherein a length of the second part in a second direction perpendicular to the first direction is less than a length in the second direction of the first part, and wherein the direction of a first conductive pattern formed on the first part and the direction of a second conductive pattern formed on the second part are substantially perpendicular to each other.

公开(公告)号：US11600608B2

公开(公告)日：2023-03-07

申请号：US17204225

申请日：2021-03-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jichul Kim ,  Chajea Jo ,  Sang-Uk Han ,  Kyoung Soon Cho ,  Jae Choon Kim ,  Woohyun Park

IPC: H01L25/18 ,  H01L27/146 ,  H01L23/00 ,  H01L25/00 ,  H01L23/367 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L23/18

Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.

公开(公告)号：US10985152B2

公开(公告)日：2021-04-20

申请号：US16503121

申请日：2019-07-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jichul Kim ,  Chajea Jo ,  Sang-Uk Han ,  Kyoung Soon Cho ,  Jae Choon Kim ,  Woohyun Park

IPC: H01L25/18 ,  H01L27/146 ,  H01L23/00 ,  H01L25/00 ,  H01L23/367 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L23/18

Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.

公开(公告)号：US10658266B2

公开(公告)日：2020-05-19

申请号：US15495324

申请日：2017-04-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Choon Kim ,  Jichul Kim ,  Jin-Kwon Bae ,  Eunseok Cho

IPC: H01L23/38 ,  F25B21/02 ,  H01L35/32 ,  H01L25/10 ,  H01L25/18 ,  H01L23/00

Abstract: A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.

公开(公告)号：US10198049B2

公开(公告)日：2019-02-05

申请号：US15459403

申请日：2017-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heungkyu Kwon ,  Jae Choon Kim ,  Eunseok Cho ,  Jichul Kim

IPC: G06F1/20 ,  G06F9/52 ,  G01K1/08 ,  G01K1/16 ,  G01J5/10 ,  G05B15/02

Abstract: A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.