Abstract:
A method for generating a model of a transistor includes: initializing hyper-parameters; training the neural network in accordance with the hyper-parameters and training data relating transistor input state values to transistor output state values to compute neural network parameters; determining whether the transistor output state values of the training data match an output of the neural network; porting the neural network to a circuit simulation code to generate a ported neural network; simulating a test circuit using the ported neural network to simulate behavior of a transistor of the test circuit to generate simulation output; determining whether a turnaround time of the generation of the simulation output is satisfactory; in response to determining that the turnaround time is unsatisfactory, re-training the neural network based on updated hyper-parameters; and in response to determining that the turnaround time is satisfactory, outputting the ported neural network as the model of the transistor.
Abstract:
In a method of circuit yield analysis, the method includes: detecting a plurality of failed samples respectively located at a plurality of failure regions in a multi-dimensional parametric space; clustering the failed samples to identify the failure regions; filtering features of the failed samples to determine a parameter component that is a non-principal component in affecting circuit yield; applying a dimensional reduction method on a dimension corresponding to the parameter component; and constructing a final importance sampling (IS) distribution function using a mixed Gaussian (mGaussian) function corresponding to all of the failure regions containing a rare failure event.
Abstract:
A method for selecting transistor design parameters. A first set of simulations is used to calculate leakage current at a plurality of sets of design parameter values, and the results are fitted with a first response surface methodology model. The first model is used to generate a function that returns a value of a selected design parameter, for which a leakage current specification is just met. A second set of simulations is used to calculate effective drive current for a plurality of sets of design parameter values, and the results are fitted with a second response surface methodology model. The second model is used, together with the first, to search for a set of design parameter values at which a worst-case effective drive current is greatest, subject to the constraint of meeting the worst-case leakage current specification.
Abstract:
A method of circuit yield analysis for evaluating rare failure events existing in multiple disjoint failure regions defined by a multi-dimensional parametric space, the method including performing initial sampling to detect failed samples respectively located at multiple failure regions in the multi-dimensional parametric space, performing clustering to identify the failure regions, performing feature filtering to determine which parameter component is a non-principal component in affecting circuit yield, applying a dimensional reduction method on a dimension corresponding to the parameter component, optimizing an importance sampling (IS) distribution function corresponding to each of the failure regions, and constructing a final importance sampling (IS) distribution function using a mixed Gaussian (mGaussian) function corresponding to all of the failure regions.
Abstract:
A system for reconstructing wafer maps of semiconductor wafers includes: a processor; and memory having instructions stored thereon that, when executed by the processor, cause the processor to: receive test data of a wafer at sparse sampling locations of the wafer, the sparse sampling locations being selected based on a probing mask; and compute a reconstructed wafer map by performing compressed sensing with Zernike polynomials on the test data at sparse locations of the wafer.
Abstract:
Neural signal amplifiers include an operational amplifier and a feedback network coupled between an output and an input thereof. The feedback network includes a tunnel field effect transistor (“TFET”) pseudo resistor that exhibits bi-directional conductivity. A drain region of the TFET may be electrically connected to the gate electrode thereof to provide a bi-directional resistor having good symmetry in terms of resistance as a function of voltage polarity.
Abstract:
A method of circuit yield analysis for evaluating rare failure events includes performing initial sampling to detect failed samples respectively located at one or more failure regions in a multi-dimensional parametric space, generating a distribution of failed samples at discrete values along each dimension, identifying the failed samples, performing a transform to project the failed samples into all dimensions in a transform space, and classifying a type of failure region for each dimension in the parametric space.
Abstract:
A method of circuit yield analysis for evaluating rare failure events includes performing initial sampling to detect failed samples respectively located at one or more failure regions in a multi-dimensional parametric space, generating a distribution of failed samples at discrete values along each dimension, identifying the failed samples, performing a transform to project the failed samples into all dimensions in a transform space, and classifying a type of failure region for each dimension in the parametric space.
Abstract:
A computer implemented method for determining performance of a semiconductor device is provided. The method includes providing a technology computer aided design data set corresponding to nominal performance of the semiconductor device, identifying a plurality of process variation sources that correspond to process variations that occur during the manufacturing of the semiconductor device, generating a nominal value look-up table of electrical parameters of the semiconductor device using nominal values of each of the plurality of process variation sources, and generating a plurality of process variation look-up tables of electrical parameters of the semiconductor device using variation values corresponding to each of the plurality of process variation sources that are identified as corresponding to the semiconductor device.