公开(公告)号：US20150228867A1

公开(公告)日：2015-08-13

申请号：US14542159

申请日：2014-11-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung Jin KIM ,  Yong Min KWON ,  Min Young SON ,  Sung Kyong OH

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  F21V29/70

CPC classification number: H01L33/505 ,  H01L24/97 ,  H01L33/54 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0041 ,  H01L2924/00012

Abstract: A light emitting diode package includes a package body having first and second electrode structures, a light emitting diode chip having a surface, on which first and second electrodes are disposed. The light emitting diode chip is disposed on the first and second electrode structures of the package body. A sheet-type wavelength conversion layer having a substantially constant thickness is disposed on an upper surface of the light emitting diode chip, and an encapsulating portion is disposed to surround the light emitting diode chip and the wavelength conversion layer. The encapsulating portion has an upper surface substantially parallel to the wavelength conversion layer. Side surfaces of the encapsulating portion have a plurality of side slope sections inclined toward the upper surface of the encapsulating portion.

Abstract translation: 发光二极管封装包括具有第一和第二电极结构的封装体，具有表面的发光二极管芯片，第一和第二电极设置在该表面上。 发光二极管芯片设置在封装主体的第一和第二电极结构上。 在发光二极管芯片的上表面上设置具有基本恒定厚度的片状波长转换层，并且封装部分设置成围绕发光二极管芯片和波长转换层。 封装部分具有基本上平行于波长转换层的上表面。 封装部的侧面具有朝向封装部的上表面倾斜的多个侧倾部。