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公开(公告)号：US20160126432A1
公开(公告)日：2016-05-05
申请号：US14991540
申请日：2016-01-08
发明人： Yong Min KWON , Jung Jin KIM , Hak Hwan KIM , Sung Jun IM
CPC分类号： H01L33/56 , H01L27/153 , H01L33/0095 , H01L33/06 , H01L33/32 , H01L33/382 , H01L33/60 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
摘要： A method of manufacturing a semiconductor light emitting device package includes providing a wafer and forming, on the wafer, a semiconductor laminate comprising a plurality of light emitting devices. Electrodes are formed in respective light emitting device regions of the semiconductor laminate. A curable resin is applied to a surface of the semiconductor laminate on which the electrodes are formed. A support structure is formed for supporting the semiconductor laminate by curing the curable resin. Through holes are formed in the support structure to expose the electrodes therethrough. Connection electrodes are formed in the support structure to be connected to the exposed electrodes.
摘要翻译： 制造半导体发光器件封装的方法包括提供晶片并在晶片上形成包括多个发光器件的半导体层叠体。 电极形成在半导体层叠体的各个发光器件区域中。 将可固化树脂施加到其上形成有电极的半导体层叠体的表面上。 形成用于通过固化可固化树脂来支撑半导体层压体的支撑结构。 在支撑结构中形成通孔以使电极暴露于其中。 在支撑结构中形成连接电极以连接到暴露的电极。
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公开(公告)号：US20170069681A1
公开(公告)日：2017-03-09
申请号：US15200616
申请日：2016-07-01
发明人： Dong Kuk LEE , Yong Min KWON , Hyung Kun KIM
IPC分类号： H01L27/15 , H01L33/54 , H01L33/20 , H01L33/46 , H01L33/60 , H01L33/50 , H01L33/62 , H01L33/38
CPC分类号： H01L27/153 , H01L33/20 , H01L33/38 , H01L33/385 , H01L33/46 , H01L33/505 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2933/0016 , H01L2933/0025 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
摘要： A light emitting device package and a method of manufacturing the light emitting device package are provided. The light emitting package includes a light emitting stack including a first conductivity-type semiconductor layer, an active layer, a second conductivity-type semiconductor layer sequentially stacked, and having a first surface provided by the first conductivity-type semiconductor layer and a second surface provided by the second conductivity-type semiconductor layer and opposing the first surface; a first electrode structure disposed on a portion of the first surface and connected to the first conductivity-type semiconductor layer; a sealing portion disposed adjacent to the light emitting stack; an insulating layer disposed between the light emitting stack and the sealing portion; and a first metal pad disposed on the second surface and passing through the insulating layer at a side of the light emitting stack to connect to the first electrode structure.
摘要翻译： 提供发光器件封装和制造发光器件封装的方法。 发光封装包括发光堆叠，其包括依次层叠的第一导电型半导体层，有源层，第二导电型半导体层，并且具有由第一导电型半导体层提供的第一表面和第二表面 由所述第二导电型半导体层提供并与所述第一表面相对; 第一电极结构，设置在所述第一表面的一部分上并连接到所述第一导电型半导体层; 设置在所述发光叠层附近的密封部; 设置在所述发光层与所述密封部之间的绝缘层; 以及第一金属焊盘，其设置在所述第二表面上并且在所述发光叠层的一侧穿过所述绝缘层以连接到所述第一电极结构。
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公开(公告)号：US20160351755A1
公开(公告)日：2016-12-01
申请号：US15166254
申请日：2016-05-26
发明人： Dong Kuk LEE , Yong Min KWON , Hyung Kun KIM , Dae Yeop HAN
CPC分类号： H01L33/60 , H01L33/007 , H01L33/32 , H01L33/382 , H01L33/486 , H01L33/56 , H01L2933/0016 , H01L2933/005
摘要： In one embodiment, a light emitting device package includes a light emitting device including a substrate and a light emitting structure including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer, stacked on the substrate; a reflective conductive layer provided on the light emitting structure; and a first electrode and a second electrode overlying the reflective conductive layer separated from each other in a first region. The first electrode and the second electrode are electrically insulated from the reflective metal layer and penetrate through the reflective metal layer to be electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively.
摘要翻译： 在一个实施例中，发光器件封装包括发光器件，其包括衬底和堆叠在衬底上的包括第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构; 设置在发光结构上的反射导电层; 以及覆盖在第一区域中彼此分离的反射导电层的第一电极和第二电极。 第一电极和第二电极与反射金属层电绝缘，并且穿过反射金属层分别电连接到第一导电类型半导体层和第二导电类型半导体层。
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公开(公告)号：US20150357250A1
公开(公告)日：2015-12-10
申请号：US14606954
申请日：2015-01-27
发明人： Min Ki KIM , Jung Jin KIM , Yong Min KWON
CPC分类号： H01L33/005 , G01J2001/4252 , G01J2003/466 , G01R31/2635 , H01L24/97 , H01L33/0095 , H01L33/486 , H01L33/62 , H01L2224/14 , H01L2224/16225 , H01L2933/0033 , H01L2933/0041
摘要： A method of manufacturing a light emitting device package includes forming a plurality of light emitting devices by growing a plurality of semiconductor layers on a wafer, and measuring color characteristics of light emitted from each of the plurality of light emitting devices. For each of the plurality of light emitting devices, a type and an amount of wavelength conversion material is determined for color compensating the light emitting device based on a difference between the measured color characteristics and target color characteristics. A wavelength conversion layer is formed on at least two light emitting devices among the plurality of light emitting devices, the wavelength conversion layer having the type and the amount of wavelength conversion material determined for the at least two light emitting devices. The plurality of light emitting devices is then divided into individual light emitting device packages.
摘要翻译： 制造发光器件封装的方法包括通过在晶片上生长多个半导体层来形成多个发光器件，并测量从多个发光器件中的每一个发射的光的颜色特性。 对于多个发光器件中的每一个，基于测量的颜色特性和目标颜色特性之间的差异，确定波长转换材料的类型和量用于对发光器件进行颜色补偿。 波长转换层形成在多个发光器件中的至少两个发光器件上，波长转换层具有为至少两个发光器件确定的类型和波长转换材料的量。 然后将多个发光器件分成单独的发光器件封装。
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公开(公告)号：US20190019779A1
公开(公告)日：2019-01-17
申请号：US15827843
申请日：2017-11-30
发明人： Yong Min KWON , Kyoung Jun KIM
IPC分类号： H01L25/075 , H01L25/16 , H01L33/06 , H01L33/30 , H01L33/32 , H01L33/58 , H01L33/62 , H01L27/02
摘要： A light emitting device package is provided. The light emitting device package includes three light emitting diode (LED) chips configured to emit light having different wavelengths, each of the three LED chips including a light emitting structure having a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer; a through electrode portion disposed adjacent to the three LED chips; a molding portion encapsulating respective side surfaces of the three LED chips and the through electrode portion; a transparent electrode layer disposed on a first surface of the molding portion, the three LED chips, and the through electrode portion; and three individual electrodes exposed through a second surface of the molding portion and disposed on the three LED chips, respectively.
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公开(公告)号：US20150243853A1
公开(公告)日：2015-08-27
申请号：US14516548
申请日：2014-10-16
发明人： Nam Goo CHA , Yong Min KWON , Kyoung Jun KIM
CPC分类号： H01L33/486 , H01L33/0079 , H01L33/0095 , H01L33/16 , H01L33/62 , H01L2224/16225 , H01L2224/94 , H01L2933/0033 , H01L2933/0066
摘要： A method of manufacturing a light emitting diode (LED) package may include forming a light emitting structure having a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer on a growth substrate, forming first and second electrodes connected to the first and second conductivity-type semiconductor layers, respectively, bonding a first surface of a light transmissive substrate opposite to a second surface thereof to the light emitting structure, identifying positions of the first and second electrodes that are seen through the second surface of the light transmissive substrate, forming one or more through holes in the light transmissive substrate to correspond to the first and second electrodes, and forming first and second via electrodes by filling the through holes with a conductive material.
摘要翻译： 制造发光二极管（LED）封装的方法可以包括在生长衬底上形成具有第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构，形成连接的第一和第二电极 分别将第一和第二导电型半导体层与其第二表面相反的第一表面与发光结构接合，识别通过第二表面的第二表面的第一和第二电极的位置 所述透光基板在所述透光基板中形成一个或多个通孔，以对应于所述第一和第二电极，以及通过用导电材料填充所述通孔来形成第一和第二通孔电极。
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7.发明申请公开(公告)号：US20150228867A1
公开(公告)日：2015-08-13
申请号：US14542159
申请日：2014-11-14
发明人： Jung Jin KIM , Yong Min KWON , Min Young SON , Sung Kyong OH
CPC分类号： H01L33/505 , H01L24/97 , H01L33/54 , H01L2224/16225 , H01L2924/181 , H01L2924/1815 , H01L2933/0041 , H01L2924/00012
摘要： A light emitting diode package includes a package body having first and second electrode structures, a light emitting diode chip having a surface, on which first and second electrodes are disposed. The light emitting diode chip is disposed on the first and second electrode structures of the package body. A sheet-type wavelength conversion layer having a substantially constant thickness is disposed on an upper surface of the light emitting diode chip, and an encapsulating portion is disposed to surround the light emitting diode chip and the wavelength conversion layer. The encapsulating portion has an upper surface substantially parallel to the wavelength conversion layer. Side surfaces of the encapsulating portion have a plurality of side slope sections inclined toward the upper surface of the encapsulating portion.
摘要翻译： 发光二极管封装包括具有第一和第二电极结构的封装体，具有表面的发光二极管芯片，第一和第二电极设置在该表面上。 发光二极管芯片设置在封装主体的第一和第二电极结构上。 在发光二极管芯片的上表面上设置具有基本恒定厚度的片状波长转换层，并且封装部分设置成围绕发光二极管芯片和波长转换层。 封装部分具有基本上平行于波长转换层的上表面。 封装部的侧面具有朝向封装部的上表面倾斜的多个侧倾部。
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公开(公告)号：US20170365739A1
公开(公告)日：2017-12-21
申请号：US15410033
申请日：2017-01-19
发明人： Ki Won PARK , Yong Min KWON , Hyung Kun KIM , Dong Kuk LEE , Dae Yeop HAN
IPC分类号： H01L33/22 , H01L33/06 , H01L33/32 , H01L27/15 , H01L33/62 , H01L33/54 , H01L33/50 , H01L33/38 , H01L33/00
CPC分类号： H01L33/22 , H01L27/153 , H01L33/0025 , H01L33/0075 , H01L33/06 , H01L33/325 , H01L33/38 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2933/0016 , H01L2933/0041 , H01L2933/005
摘要： A semiconductor light emitting device package includes a light emitting structure having a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first surface, and a second surface, a first electrode and a second electrode disposed on the second surface of the light emitting structure; an insulating layer, a first metal pad and a second metal pad disposed on the insulating layer, and each having a surface with a first fine uneven pattern so as to have a first surface roughness, a first bonding pad and a second bonding pad disposed on the first metal pad and the second metal pad, respectively, and each having a surface with a second fine uneven pattern so as to have a second surface roughness, and an encapsulant encapsulating the first bonding pad, the second bonding pad, the first metal pad, and the second metal pad.
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公开(公告)号：US20140377894A1
公开(公告)日：2014-12-25
申请号：US14297199
申请日：2014-06-05
发明人： Yong Min KWON , Jung Jin KIM , Hak Hwan KIM , Sung Jun IM
CPC分类号： H01L33/56 , H01L27/153 , H01L33/0095 , H01L33/06 , H01L33/32 , H01L33/382 , H01L33/60 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
摘要： A method of manufacturing a semiconductor light emitting device package includes providing a wafer and forming, on the wafer, a semiconductor laminate comprising a plurality of light emitting devices. Electrodes are formed in respective light emitting device regions of the semiconductor laminate. A curable resin is applied to a surface of the semiconductor laminate on which the electrodes are formed. A support structure is formed for supporting the semiconductor laminate by curing the curable resin. Through holes are formed in the support structure to expose the electrodes therethrough. Connection electrodes are formed in the support structure to be connected to the exposed electrodes.
摘要翻译： 制造半导体发光器件封装的方法包括提供晶片并在晶片上形成包括多个发光器件的半导体层叠体。 电极形成在半导体层叠体的各个发光器件区域中。 将可固化树脂施加到其上形成有电极的半导体层叠体的表面上。 形成用于通过固化可固化树脂来支撑半导体层压体的支撑结构。 在支撑结构中形成通孔以使电极暴露于其中。 在支撑结构中形成连接电极以连接到暴露的电极。
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公开(公告)号：US20190019780A1
公开(公告)日：2019-01-17
申请号：US15941299
申请日：2018-03-30
发明人： Kyoung Jun KIM , Yong Min KWON , Geun Woo KO , Pun Jae CHOI , Dong Ho KIM
IPC分类号： H01L25/075 , H01L33/62 , H01L33/54 , H01L33/56
摘要： A light emitting device package includes: a plurality of light emitting chips configured to emit respective wavelength lights, each chip comprising electrodes at a bottom of the chip to form a flip-chip structure; a plurality of wirings directly connected to the electrodes of the chips, respectively; a plurality of electrode pads disposed below the chips and directly connected to the wirings, respectively; and a molding member integrally formed in a single layer structure to cover upper surfaces and side surfaces of the chips, and including a translucent material having a predetermined transmittance, wherein the wirings are disposed below a lower surface of the molding member.
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