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公开(公告)号：US20140344602A1
公开(公告)日：2014-11-20
申请号：US14275311
申请日：2014-05-12
发明人： Min Young SON , Seung Won LEE , Shi Hwa LEE , Jae Don LEE , Chae Seok IM , Min Kyu JEONG
IPC分类号： G06F1/32
CPC分类号： G06F1/3234 , G06F1/3243 , G06F1/329 , G06F8/4432 , Y02B70/16 , Y02D10/152 , Y02D10/24 , Y02D10/41
摘要： A processing apparatus for managing power based on data is provided. The processing apparatus may obtain, in response to an access request from a processor for particular data stored in a memory, existing power information having a predefined correspondence to the particular data, and control a power mode of the processor based on the existing power information.
摘要翻译： 提供了一种用于基于数据管理电力的处理装置。 处理装置可以响应于处理器对存储在存储器中的特定数据的访问请求而获得具有与特定数据的预定对应关系的现有功率信息，并且基于现有功率信息来控制处理器的功率模式。
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公开(公告)号：US20140306261A1
公开(公告)日：2014-10-16
申请号：US14251170
申请日：2014-04-11
发明人： Sung Jun IM , Min Young SON , Yong Min KWON , Hak Hwan KIM
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L21/486 , H01L23/49827 , H01L23/5384 , H01L33/486 , H01L33/54 , H01L2224/0557 , H01L2224/13 , H01L2225/06541 , H01L2225/06548 , H01L2933/0033
摘要： There is provided an electronic device package including an electronic device including a first electrode and a second electrode disposed on a surface thereof, a package substrate having a first surface having the electronic device mounted thereon and a second surface opposed to the first surface. The package substrate includes a first electrode pattern and a second electrode pattern electrically connected to the first electrode and the second electrode on the first surface, respectively. The package substrate further includes at least one via hole disposed outside of a region for mounting the electronic device and an irregular portion disposed on the first surface to be adjacent to the via hole.
摘要翻译： 提供了一种电子器件封装，其包括电子器件，其包括设置在其表面上的第一电极和第二电极，具有安装在其上的电子器件的第一表面和与第一表面相对的第二表面的封装衬底。 封装衬底包括分别电连接到第一电极和第一表面上的第二电极的第一电极图案和第二电极图案。 封装基板还包括设置在用于安装电子器件的区域的外侧的至少一个通孔和设置在与通孔相邻的第一表面上的不规则部分。
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公开(公告)号：US20140203451A1
公开(公告)日：2014-07-24
申请号：US14063806
申请日：2013-10-25
发明人： Yong Min KWON , Seo Hyun MOON , Sung Jun IM , Min Young SON
IPC分类号： H01L23/48
CPC分类号： H01L23/481 , H01L23/49827 , H01L23/49838 , H01L33/38 , H01L2924/0002 , Y02E10/50 , H01L2924/00
摘要： The present application provides an electronic device package. The package includes a packaging substrate having first and second surfaces opposing one another. First and second electrode patterns are formed on the first surface and first and second external terminals connected to the first and second electrode patterns. The second electrode pattern is electrically insulated from the first electrode pattern and surrounds the first electrode pattern An electronic device is mounted on the first surface of the packaging substrate and includes first and second electrodes disposed on a surface thereof facing the packaging substrate. The first and second electrodes are positioned on the first and second electrode patterns, respectively.
摘要翻译： 本申请提供了一种电子设备包装。 该包装包括具有彼此相对的第一和第二表面的包装衬底。 第一和第二电极图案形成在第一表面上，第一和第二外部端子连接到第一和第二电极图案。 第二电极图案与第一电极图案电绝缘并且包围第一电极图案电子器件安装在封装基板的第一表面上，并且包括设置在面向封装基板的表面上的第一和第二电极。 第一和第二电极分别位于第一和第二电极图案上。
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公开(公告)号：US20150348906A1
公开(公告)日：2015-12-03
申请号：US14581221
申请日：2014-12-23
发明人： Jong Kil PARK , Min Young SON
IPC分类号： H01L23/522 , H01L23/528
CPC分类号： H01L23/49827 , H01L24/97 , H01L33/486 , H01L33/54 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/16225 , H01L2224/97 , H01L2924/181 , H01L2924/00012
摘要： An electronic device package may include a package body, an electronic device, and at least one conductive via. The package body includes a first surface and a second surface opposite to the first surface. The electronic device is disposed on the first surface. The at least one conductive via extends through the package body and includes a first end located in a mounting region of the first surface corresponding to a region on which the electronic device is disposed. The first end may have a first dimension measured along a first direction greater than a second dimension measured along a second direction substantially perpendicular to the first direction.
摘要翻译： 电子器件封装可以包括封装体，电子器件和至少一个导电通孔。 包装体包括与第一表面相对的第一表面和第二表面。 电子设备设置在第一表面上。 所述至少一个导电通孔延伸穿过所述封装主体并且包括位于所述第一表面的安装区域中的第一端，所述第一端对应于所述电子设备所在的区域。 第一端可以具有沿着第一方向测量的大于沿着基本上垂直于第一方向的第二方向测量的第二尺寸的第一尺寸。
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公开(公告)号：US20140032976A1
公开(公告)日：2014-01-30
申请号：US13890675
申请日：2013-05-09
发明人： Young Sam SHIN , Seung Won LEE , Shi Hwa LEE , Min Young SON , Jae Don LEE
IPC分类号： G06F11/34
CPC分类号： G06F11/3409 , G06F11/0721 , G06F11/0763
摘要： An apparatus and method for detecting an error occurring when an application program is executed in a computer environment is provided. The error detection apparatus may measure a deterministic progress index (DPI) and a program counter (PC) value when an instruction is executed, set, as a verification set, a DPI and a PC value measured when the instruction is executed without causing an error, set, as a measurement set, the DPI and the PC value measured when an instruction is executed, and detect a runtime error of the instruction by comparing the measurement set to the verification set.
摘要翻译： 提供了一种用于检测在计算机环境中执行应用程序时发生的错误的装置和方法。 错误检测装置可以在执行指令时设置指令执行确定性进度指标（DPI）和程序计数器（PC）值，作为验证集，执行指令时测量的DPI和PC值，而不引起错误 ，作为测量集，设置执行指令时测量的DPI和PC值，并通过将测量集与验证集进行比较来检测指令的运行时间错误。
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6.发明申请公开(公告)号：US20130154136A1
公开(公告)日：2013-06-20
申请号：US13714469
申请日：2012-12-14
发明人： Tae Jun KIM , Sang Bok YUN , Min Young SON , Choong Hwan KWON , Sung Ho PARK
IPC分类号： B29D11/00
CPC分类号： B29D11/0074 , B29D11/00605
摘要： A method of forming a plurality of reflectors for a light emitting device (LED) package includes receiving a first fluid material at at least a first source opening of an upper mold of a transfer apparatus; passing the first fluid material through a transfer passageway of the upper mold; expelling the first fluid material from the transfer passageway through a plurality of openings in a lower internal surface of a transfer chamber of the transfer passageway; depositing the first fluid material on a lead frame, disposed on a lower mold of the transfer apparatus, through the plurality of openings; forming the first fluid material into a plurality of molded structures using the upper mold and the lower mold; and hardening each of the molded structures to form a plurality of reflectors.
摘要翻译： 形成用于发光器件（LED）封装的多个反射器的方法包括：在传送设备的上模的至少第一源开口处接收第一流体材料; 使第一流体材料通过上模的传送通道; 通过所述传送通道的传送室的下内表面中的多个开口排出所述第一流体材料从所述传送通道; 通过所述多个开口将第一流体材料沉积在设置在所述传送装置的下模具上的引线框架上; 使用上模具和下模具将第一流体材料形成为多个模制结构; 并且硬化每个模制结构以形成多个反射器。
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公开(公告)号：US20170308410A1
公开(公告)日：2017-10-26
申请号：US15646747
申请日：2017-07-11
发明人： Min Young SON , Shi Hwa LEE , Seung Won LEE , Jeong Joon YOO , Jae Don LEE , Young Sam SHIN , Hee Jin AHN
CPC分类号： G06F9/5088 , G06F8/447 , G06F9/45558 , G06F11/3466 , G06F2009/4557
摘要： A virtual architecture generating apparatus and method, a runtime system, a multi-core system, and methods of operating the runtime system and the multi-core system may include analyzing a requirement of an application, a feature of the application, and a requirement of a system enabling an execution of the application, and include generating a virtual architecture corresponding to the application, based on a physical architecture of a reconfigurable processor, the analyzed requirements and the analyzed feature.
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8.发明申请公开(公告)号：US20150228867A1
公开(公告)日：2015-08-13
申请号：US14542159
申请日：2014-11-14
发明人： Jung Jin KIM , Yong Min KWON , Min Young SON , Sung Kyong OH
CPC分类号： H01L33/505 , H01L24/97 , H01L33/54 , H01L2224/16225 , H01L2924/181 , H01L2924/1815 , H01L2933/0041 , H01L2924/00012
摘要： A light emitting diode package includes a package body having first and second electrode structures, a light emitting diode chip having a surface, on which first and second electrodes are disposed. The light emitting diode chip is disposed on the first and second electrode structures of the package body. A sheet-type wavelength conversion layer having a substantially constant thickness is disposed on an upper surface of the light emitting diode chip, and an encapsulating portion is disposed to surround the light emitting diode chip and the wavelength conversion layer. The encapsulating portion has an upper surface substantially parallel to the wavelength conversion layer. Side surfaces of the encapsulating portion have a plurality of side slope sections inclined toward the upper surface of the encapsulating portion.
摘要翻译： 发光二极管封装包括具有第一和第二电极结构的封装体，具有表面的发光二极管芯片，第一和第二电极设置在该表面上。 发光二极管芯片设置在封装主体的第一和第二电极结构上。 在发光二极管芯片的上表面上设置具有基本恒定厚度的片状波长转换层，并且封装部分设置成围绕发光二极管芯片和波长转换层。 封装部分具有基本上平行于波长转换层的上表面。 封装部的侧面具有朝向封装部的上表面倾斜的多个侧倾部。
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公开(公告)号：US20140019782A1
公开(公告)日：2014-01-16
申请号：US13903256
申请日：2013-05-28
发明人： Min Young SON , Young Sam SHIN , Chae Seok IM , Seung Won LEE , Shi Hwa LEE , Jae Don LEE
IPC分类号： G06F1/26
CPC分类号： G06F1/26 , G06F1/3203 , G06F1/3234 , G06F8/4432 , Y02D10/41
摘要： Provided is an apparatus and method for managing power based on data. The apparatus may include a code segment searching unit configured to search for at least one code segment in which a power type is inserted, a block determining unit configured to determine at least one block based on the at least one found code segment, and a power mode control unit configured to control the at least one determined block to operate in a power mode corresponding to the power type.
摘要翻译： 提供了一种基于数据来管理电力的装置和方法。 该装置可以包括：代码段搜索单元，被配置为搜索其中插入有电源类型的至少一个代码段;块确定单元，被配置为基于至少一个找到的代码段来确定至少一个块;以及功率 模式控制单元，被配置为控制所述至少一个确定的块以与所述功率类型对应的功率模式操作。
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公开(公告)号：US20130342549A1
公开(公告)日：2013-12-26
申请号：US13918210
申请日：2013-06-14
发明人： Jae Don LEE , Min Kyu JEONG , Min Young SON , Shi Hwa LEE , Seung Won LEE
IPC分类号： G06T15/80
CPC分类号： G06T15/80 , G06T15/005
摘要： An apparatus and method for processing rendering data that may group vertex data that is received from a host computer, and may assign a shader processing unit to process a vertex shader among one or more shader processing units, and process the grouped vertex data using the assigned shader processing unit.
摘要翻译： 一种用于处理可以对从主计算机接收的顶点数据进行分组的渲染数据的装置和方法，并且可以分配着色器处理单元来处理一个或多个着色器处理单元之间的顶点着色器，并且使用所分配的处理单元来处理分组的顶点数据 着色器处理单元。
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