公开(公告)号：US20240319592A1

公开(公告)日：2024-09-26

申请号：US18491310

申请日：2023-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changheon LEE ,  Haengdeog KOH ,  Yoonhyun KWAK ,  Mijeong KIM ,  Sunyoung LEE ,  Kyuhyun IM ,  Jinwon JEON ,  Jungha CHAE ,  Sunghyun HAN

IPC: G03F7/004 ,  G03F7/038

CPC classification number: G03F7/0042 ,  G03F7/0048 ,  G03F7/0382

Abstract: Provided are a resist composition and a method of forming a pattern using the same, wherein the resist composition may include an organometallic compound represented by Formula 1 below, and a polymer including a repeating unit represented by Formula 2 below.




For a description of M11, R11, R12, n, A21, L21 to L23, A21 to a23, R21 to R22, b22, and p in Formula 1 and Formula 2, the specification is referred to.

公开(公告)号：US20230173798A1

公开(公告)日：2023-06-08

申请号：US18162801

申请日：2023-02-01

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Hyunjeong JEON ,  A Ra JO ,  Jungha CHAE ,  Sun Jin SONG ,  Boreum JEONG

IPC: B32B27/08 ,  B32B27/28

CPC classification number: B32B27/08 ,  B32B27/281 ,  B32B2255/26 ,  B32B2307/412 ,  B32B2457/20 ,  B32B2307/418 ,  B32B2255/10 ,  B32B2250/03

Abstract: Disclosed are a laminated film including a light transmitting substrate; a hard coating layer; and an optical enhancement layer disposed between the light transmitting substrate and the hard coating layer or at a position facing the hard coating layer with the light transmitting substrate therebetween, wherein the light transmitting substrate includes a polyimide, a poly(amide-imide) copolymer, or a combination thereof, and the optical enhancement layer includes a copolymer comprising a polyimide, and a display device including the laminated film.

公开(公告)号：US20200377658A1

公开(公告)日：2020-12-03

申请号：US16994636

申请日：2020-08-16

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Jungha CHAE ,  Kyeong-sik JU

IPC: C08G73/14 ,  C08L79/08 ,  C08G73/10

Abstract: A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, a dicarbonyl compound represented by Chemical Formula 3, and a tetracarboxylic acid dianhydride represented by Chemical Formula 4: wherein, in Chemical Formulae 1 to 4, L1, R1 to R3, R10, R12, R13, a, b, c, d, A, X, n7 and n8 are the same as defined in the specification.

公开(公告)号：US20180148543A1

公开(公告)日：2018-05-31

申请号：US15816079

申请日：2017-11-17

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Jungha CHAE ,  Chanjae AHN ,  Kyeong-sik JU

IPC: C08G73/14 ,  C08J5/18

CPC classification number: C08G73/14 ,  C08J5/18 ,  C08J2379/08

Abstract: A polyimide film having tensile modulus of greater than or equal to about 5 gigapascals, and yellowness index of less than 2.5, when measured at a thickness of the film between 50 micrometers to 100 micrometers, wherein the polyimide film is a reaction product of a combination including an aromatic dianhydride and an aromatic diamine, wherein the aromatic dianhydride includes 4,4′-oxydiphthalic anhydride.

公开(公告)号：US20170342224A1

公开(公告)日：2017-11-30

申请号：US15602616

申请日：2017-05-23

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Jungha CHAE ,  Chanjae AHN ,  Kyeong-sik JU

IPC: C08J5/18 ,  C08G73/14 ,  G06F1/16

Abstract: A poly(amide-imide) copolymer film having a tensile modulus of greater than or equal to 5.4 GPa, and a yellowness index of less than or equal to 3.6, wherein the poly(amide-imide) copolymer film is a reaction product of an aromatic dianhydride including biphenyl tetracarboxylic dianhydride and 4,4′-hexafluoroisopropylidene diphthalic dianhydride, an aliphatic dianhydride including 1,2,3,4-cyclobutane tetracarboxylic dianhydride, an aromatic diamine including 2,2-bis(trifluoromethyl) benzidine, and an aromatic dicarbonyl compound including terephthaloyl dichloride.

公开(公告)号：US20240094633A1

公开(公告)日：2024-03-21

申请号：US18150012

申请日：2023-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungha CHAE ,  Haengdeog KOH ,  Yoonhyun KWAK ,  Minsang KIM ,  Hana KIM ,  Hyeran KIM ,  Youngmin NAM ,  Changheon LEE ,  Kyuhyun IM

IPC: G03F7/004 ,  C07C65/30 ,  G03F7/20

CPC classification number: G03F7/0045 ,  C07C65/30 ,  G03F7/2006

Abstract: Provided are a carboxylate salt represented by Formula 1, a photoresist composition including the carboxylate salt represented by Formula 1, and a method of forming a pattern by using the photoresist composition






wherein, in Formula 1, A11, R11 to R15, b15, n11, n12, and M+ are described in the specification.

公开(公告)号：US20240043592A1

公开(公告)日：2024-02-08

申请号：US18068365

申请日：2022-12-19

Applicant: Samsung Electronics Co., Ltd.,

Inventor： Minsang KIM ,  Haengdeog KOH ,  Yoonhyun KWAK ,  Chanjae AHN ,  Jungha CHAE ,  Sungwon CHOI ,  Minyoung HA

IPC: C08F220/18 ,  C07C381/12 ,  G03F7/039 ,  G03F7/038 ,  C08F212/14

CPC classification number: C08F220/1807 ,  C07C381/12 ,  G03F7/039 ,  G03F7/038 ,  C08F212/24

Abstract: Provided are a polymer including a repeating unit represented by Formula 1, a photoresist composition including the polymer, and a method of forming a pattern by using the photoresist composition:




wherein the details of R11, L11, a11, A11−, and B11+in Formula 1 are provided in the present specification.

公开(公告)号：US20190048145A1

公开(公告)日：2019-02-14

申请号：US16059541

申请日：2018-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Jungha CHAE ,  Kyeong-sik JU

IPC: C08G73/14 ,  C08L79/08

Abstract: A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, a dicarbonyl compound represented by Chemical Formula 3, and a tetracarboxylic acid dianhydride represented by Chemical Formula 4: wherein, in Chemical Formulae 1 to 4, L1, R1 to R3, R10, R12 , R13, a, b, c, d, A, X, n7 and n8 are the same as defined in the specification.

公开(公告)号：US20190048144A1

公开(公告)日：2019-02-14

申请号：US16059487

申请日：2018-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Jungha CHAE ,  Kyeong-sik JU

IPC: C08G73/14 ,  C08L79/08

Abstract: A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, a dicarbonyl compound represented by Chemical Formula 3, and a tetracarboxylic acid dianhydride represented by Chemical Formula 4: wherein, in Chemical Formulae 1 to 4, L1, R1 to R3, R10, R12, R13, a, b, c, d, A, X, n7 and n8 are the same as defined in the specification.

公开(公告)号：US20180305498A1

公开(公告)日：2018-10-25

申请号：US15962104

申请日：2018-04-25

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Jungha CHAE ,  Chanjae AHN ,  Kyeong-Sik JU

IPC: C08G73/14 ,  C08J5/18

CPC classification number: C08G73/14 ,  C08J5/18 ,  C08J2379/08

Abstract: A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, a dicarbonyl compound represented by Chemical Formula 3, and a tetracarboxylic acid dianhydride represented by Chemical Formula 4: wherein, in Chemical Formulae 1 to 4, L1, L2, Ra to Rd, R2, R3, R10, R12, R13, n7 and n8, and X are the same as defined in the specification.