公开(公告)号：US20240174902A1

公开(公告)日：2024-05-30

申请号：US18404861

申请日：2024-01-04

申请人： Samsung Electronics Co., Ltd.

发明人： Mun Ja KIM ,  Byungchul YOO ,  Haeshin LEE ,  Chang Young JEONG ,  Yunhan LEE

IPC分类号： C09J129/04 ,  C08K3/04 ,  C08K3/36 ,  C08K5/05 ,  G03F1/64

CPC分类号： C09J129/04 ,  C08K3/042 ,  C08K3/36 ,  C08K5/05 ,  G03F1/64 ,  C08H6/00

摘要： An adhesive composition, a method for preparing the same, a reticle assembly including the same, and a method for fabricating the reticle assembly including the same are provided. The adhesive composition includes a polyphenol compound including tannic acid, a polymer including polyvinyl alcohol, and a solvent including water and alcohol.

公开(公告)号：US20230408905A1

公开(公告)日：2023-12-21

申请号：US18299301

申请日：2023-04-12

申请人： Samsung Electronics Co., Ltd.

发明人： Mun Ja KIM ,  Ki Bong NAM ,  Jin Ho YEO ,  Byungchul YOO ,  Ji Beom YOO ,  Changyoung JEONG

IPC分类号： G03F1/62

CPC分类号： G03F1/62

摘要： A method of manufacturing a pellicle for an extreme ultraviolet exposure includes forming a graphite-containing layer on a catalyst substrate; surface-treating a first surface of the graphite-containing layer to form a first treatment layer; and forming a first passivation layer on the first treatment layer, wherein the forming of the first treatment layer includes removing a C—O—C bond included in the graphite-containing layer through the surface-treating of the first surface.

公开(公告)号：US20220135855A1

公开(公告)日：2022-05-05

申请号：US17516428

申请日：2021-11-01

申请人： Samsung Electronics Co., Ltd.

发明人： Mun Ja KIM ,  Byungchul YOO ,  Haeshin LEE ,  Chang Young JEONG ,  Yunhan LEE

IPC分类号： C09J129/04 ,  C08K3/36 ,  C08K3/04 ,  G03F1/64 ,  C08K5/05

摘要： An adhesive composition, a method for preparing the same, a reticle assembly including the same, and a method for fabricating the reticle assembly including the same are provided. The adhesive composition includes a polyphenol compound including tannic acid, a polymer including polyvinyl alcohol, and a solvent including water and alcohol.

公开(公告)号：US20180136554A1

公开(公告)日：2018-05-17

申请号：US15606170

申请日：2017-05-26

申请人： Samsung Electronics Co., Ltd.

发明人： Ji Beom YOO ,  Sung Won KWON ,  Dong Wook SHIN ,  Mun Ja KIM ,  Jin Su KIM ,  Hwan Chul JEON

IPC分类号： G03F1/62 ,  H01L21/027 ,  G03F1/80 ,  G03F7/20

CPC分类号： G03F1/62 ,  G03F1/22 ,  G03F1/80 ,  G03F7/2004 ,  H01L21/0274

摘要： A method for fabricating a semiconductor device includes forming a pellicle including an amorphous carbon layer, attaching the pellicle onto a reticle, and forming a photoresist pattern by utilizing EUV light transmitted through the pellicle and reflected by the reticle. The forming the pellicle includes forming a first dielectric layer on a first side of the substrate, forming the amorphous carbon layer on the first dielectric layer, forming a second dielectric layer on a second side of the substrate opposite to the first side of the substrate, etching the second dielectric layer overlapping the first region of the substrate to form a mask pattern, and forming a support including the second region of the substrate and the remaining part of the first dielectric layer. The forming the support includes etching the first region of the substrate and the first dielectric layer on the first region.