公开(公告)号：US20240192604A1

公开(公告)日：2024-06-13

申请号：US18216028

申请日：2023-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehong LIM ,  Youngho HWANG ,  Byungjo KIM ,  Sangki NAM ,  Suyoung YOO ,  Sanghyun LIM ,  Youngkyun IM ,  Hyungkyu CHOI ,  Seok HEO

IPC: G03F7/40

CPC classification number: G03F7/40

Abstract: A post baking apparatus comprising a baking chamber configured to receive a substrate with an exposed photoresist film, a lower heater in the baking chamber under the substrate to heat the exposed photoresist film, an applier applying an electric field or a magnetic field to the exposed photoresist film along a vertical direction, which is substantially perpendicular to an upper surface of the exposed photoresist film, to control diffusions of an acid or a secondary electron, which are generated from the exposed photoresist film, along a horizontal direction, and a controller configured to control an operation of the applier.

公开(公告)号：US20230178396A1

公开(公告)日：2023-06-08

申请号：US17847090

申请日：2022-06-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Ho HWANG ,  Eun Seok SEO ,  Jun O PARK ,  Jae Hong LIM ,  Seok HEO

IPC: H01L21/67 ,  G03F7/16

CPC classification number: H01L21/67248 ,  G03F7/162 ,  G03F7/168

Abstract: Substrate processing apparatuses and methods of manufacturing a semiconductor device using the same may be provided. A substrate processing apparatus includes a heater in a support plate and comprising a first unit configured to heat a first portion of a substrate and a second unit configured to heat a second portion of a substrate, and processing circuitry configured to heat the heater in a transient section such that the first unit heats the first portion of the substrate to a first heating temperature, and the second unit heats the second portion of the substrate to a second heating temperature different from the first heating temperature, the transient section being a section before a temperature of the substrate reaches a steady state, a steady section being a section after the temperature of the substrate reaches the steady state.

公开(公告)号：US20190088515A1

公开(公告)日：2019-03-21

申请号：US15950303

申请日：2018-04-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Won JEONG ,  Yi JIN ,  Chang Gi MIN ,  Jin Woo LEE ,  Seok HEO ,  Yong Won CHOI ,  Yun Jong CHOI

IPC: H01L21/67 ,  G05B19/418

Abstract: A method for controlling a semiconductor manufacturing facility includes measuring output change amounts of differential pressure sensors in the facility when pressure conditions change by a number of fans. The fans are then classified into different groups and subgroups and control sequences of the subgroups are determined based on the change amounts. Difference values are then calculated, and a control signal is generated to adjust the rotation speed of the fans.

公开(公告)号：US20170178945A1

公开(公告)日：2017-06-22

申请号：US15348208

申请日：2016-11-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won-Guk SEO ,  Yong-Won CHOI ,  Sang-Jin LEE ,  Yong-Bum JUNG ,  Seok HEO

IPC: H01L21/687 ,  C23C16/50 ,  C23C16/455 ,  B05D1/00 ,  H01L21/67 ,  C23C16/46

CPC classification number: H01L21/68707 ,  B05D1/005 ,  C23C16/45544 ,  C23C16/46 ,  C23C16/463 ,  C23C16/50 ,  C23C16/54 ,  C23C16/56 ,  H01L21/67103 ,  H01L21/67161 ,  H01L21/67178 ,  H01L21/67196 ,  H01L21/67742

Abstract: A substrate processing system includes an index module including wafer carriers. First and second heat processing units are disposed adjacent to the index module. Each of the first and second heat processing units includes a plurality of first heat processing plates sequentially stacked. First and second transfer robots are disposed adjacent to the first and second heat processing units, respectively. Each of the first and second transfer robots is movable along a vertical transfer path and to rotate. First and second coating units are disposed adjacent to first sides of the first and second transfer robots, respectively. Each of the first and second coating units includes a plurality of coating devices sequentially stacked. First and second bake units are disposed adjacent to second sides of the first and second transfer robots, respectively. Each of the first and second bake units includes a plurality of second heat processing plates sequentially stacked.