公开(公告)号：US10229895B2

公开(公告)日：2019-03-12

申请号：US14772597

申请日：2014-03-12

申请人： Schweizer Electronic AG

发明人： Thomas Gottwald ,  Alexander Neumann

IPC分类号： H05K3/46 ,  H05K1/18 ,  H05K3/30 ,  H01L25/00 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L25/07 ,  H01L21/48

摘要： An electronic sub-assembly (36) comprising at least one electronic component (14) embedded in a sequence of layers, wherein the electronic component (14) is arranged in a recess of an electrically conductive central layer (16) and directly adjoins a resin layer (12, 20) on each side.

公开(公告)号：US10154593B2

公开(公告)日：2018-12-11

申请号：US15375578

申请日：2016-12-12

申请人： Schweizer Electronic AG

发明人： Thomas Gottwald ,  Christian Rössle

IPC分类号： H05K1/00 ,  H05K1/18 ,  H01L23/64 ,  H02K9/22 ,  H05K3/46 ,  H02K11/30 ,  H02K11/33 ,  H05K1/02 ,  H05K3/30 ,  H01G2/06 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H01L23/00

摘要： An electronic assembly group comprising a printed circuit board structure in a multilayer configuration that has at least two electrically conductive layers. The electronic assembly group also comprises an additional passive component that is connected to the two electrically conductive layers, each of which has at least one segment that extends beyond the multilayer structure to form connection regions, the passive component making contact directly at the connection regions.

公开(公告)号：US10555419B2

公开(公告)日：2020-02-04

申请号：US15748100

申请日：2016-08-10

申请人： Schweizer Electronic AG

发明人： Thomas Gottwald ,  Christian Rössle

IPC分类号： H05K1/18 ,  H05K1/02 ,  H02K3/46 ,  H05K3/46 ,  H01Q1/38 ,  H05K1/11

摘要： Method for producing a conductor structural element with a layer sequence having an internal layer substrate, including the steps: providing a rigid carrier having an underside and a top side; defining a cut-out section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the cut-out section is exposed; placing an internal layer substrate above the cut-out section with formation of a cavity between the rigid carrier and the internal layer substrate; aligning and fixing the internal layer substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the internal layer substrate with the cavity being left free; producing a cut-out by cutting the cut-out section out of the rigid carrier from the outer underside of the rigid carrier.

公开(公告)号：US09913378B2

公开(公告)日：2018-03-06

申请号：US14772329

申请日：2014-03-11

申请人： Schweizer Electronic AG

发明人： Thomas Gottwald ,  Alexander Neumann

IPC分类号： H05K7/10 ,  H05K7/12 ,  H05K1/18 ,  H01L23/14 ,  H01L23/367 ,  H01L23/538 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/42

CPC分类号： H05K1/181 ,  H01L23/142 ,  H01L23/3677 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/111 ,  H05K3/0047 ,  H05K3/0094 ,  H05K3/284 ,  H05K3/32 ,  H05K3/42 ,  H05K2201/09036 ,  H01L2924/00

摘要： Electronic sub-assembly comprising a carrier layer and a mounting area with at least one electronic component, wherein the carrier layer has at least in portions a material with a low coefficient of thermal expansion to adjust the coefficient of thermal expansion of the carrier layer, and wherein at least one compensation layer is provided on the carrier layer adjacent to the installation area, on which compensation layer an electrically insulating, thermally conductive layer and at least one electrically conductive layer are provided.