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公开(公告)号：US12028963B2
公开(公告)日：2024-07-02
申请号：US17541440
申请日：2021-12-03
发明人： Thomas Gottwald
IPC分类号： H05K1/02
CPC分类号： H05K1/021 , H05K2201/066
摘要： Printed circuit board module (30) having a printed circuit board (50) and a heatsink (40), and, provided between the printed circuit board (50) and the heatsink (40), a two-dimensional heat-conducting element (10) comprising a ceramic carrier (12) coated with a phase change material (14, 16). In the printed circuit board (50) or the heatsink (40), a through-bore (59) may be provided to accommodate a screw (80) and one end of the screw (86) may mesh into a receiving hole (49) which preferably has a mating thread and is formed in the heatsink (40) or the printed circuit board (50), wherein a screw head (84) of the screw (80) especially has a sprung washer element (90) beneath it.
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公开(公告)号：US10602606B2
公开(公告)日：2020-03-24
申请号：US15747820
申请日：2016-08-09
摘要： A method for producing a radio-frequency antenna in a conductor structural element with an encompassing layer sequence, including: providing a rigid carrier having an underside and a top side; defining an antenna assignment section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the antenna assignment section is exposed; placing a radio-frequency substrate above the antenna assignment section with formation of a cavity between the rigid carrier and the radio-frequency substrate; aligning and fixing the radio-frequency substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the radio-frequency substrate with the cavity being left free; cutting the antenna assignment section out of the rigid carrier from the outer underside (remote from the layer construction) of the rigid carrier.
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3.发明授权公开(公告)号：US10673123B2
公开(公告)日：2020-06-02
申请号：US15636893
申请日：2017-06-29
IPC分类号： H01Q1/22 , G01S7/03 , G01S7/02 , G06K19/077 , H01Q1/38
摘要： A method for producing a radio frequency transmitting/receiving element comprising at least one radio frequency antenna and at least one radio frequency chip, and to a corresponding radio frequency transmitting/receiving element made by the method. The method comprises the following steps: providing a temporary rigid carrier; applying a conductor pattern structure comprising the antenna structure of the at least one radio frequency antenna and connection contacts—connected thereto via leads—for the at least one radio frequency chip; arranging the at least one radio frequency chip on the connection contacts of the conductor pattern structure; applying an electrically insulating layer on the conductor pattern structure, such that the at least one radio frequency chip is surrounded by the electrically insulating layer; and removing the temporary rigid carrier.
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公开(公告)号：US10462905B2
公开(公告)日：2019-10-29
申请号：US16280762
申请日：2019-02-20
发明人： Thomas Gottwald , Christian Rössle
摘要： A printed circuit board element (LP) having at least one electronic switching element (12.1, 12.2, 12.3) integrated in the printed circuit board element (LP), which switching element comprises two semiconductor switches (14, 16) introduced into a layer sequence of the printed circuit board element (LP) and at least two busbars (20, 22, 24) formed to contact the semiconductor switches (14, 16), wherein the busbars (20, 22, 24) run substantially above one another in the layer sequence of the printed circuit board element (LP) and at least one intermediate circuit capacitor (C; C1, C2, C3, C4) arranged between the two busbars (20, 22) is introduced into the layer sequence of the printed circuit board element (LP).
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公开(公告)号：US10121737B2
公开(公告)日：2018-11-06
申请号：US15634824
申请日：2017-06-27
发明人： Thomas Gottwald , Christian Roessle
IPC分类号： H01L23/498 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/495 , H01L23/58 , H01L23/00 , H01L25/07 , H01L25/00 , H01L23/367
摘要： The invention relates to an electronic component, namely a printed circuit board element comprising a first semiconductor component (14) which is arranged on an upper side of an electrically conductive intermediate plate (16) such that a connector pad (18) of the semiconductor component (14) is electrically contacted with the intermediate plate (16) and comprising a second semiconductor component (15) which is arranged on a lower side of the intermediate plate (16). The second semiconductor component (15) comprises a first connector pad (17) and a second connector pad (19), wherein both connector pads (17, 19) are aligned in the direction of the intermediate plate (16) and wherein the first connector pad (17) is contacted with the intermediate plate (16), and wherein the second connector pad (19) is not contacted with the intermediate plate (16). Moreover, the invention relates to a method for producing such a printed circuit board element.
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公开(公告)号：US09848499B2
公开(公告)日：2017-12-19
申请号：US15311234
申请日：2015-05-21
发明人： Thomas Gottwald , Bernd Reisslöhner , Thomas Rall , Roland Brey , Gerald Hauer , Tobias Steckermeier
CPC分类号： H05K3/4644 , H05K1/02 , H05K1/0203 , H05K1/0204 , H05K3/0044 , H05K3/0058 , H05K2201/09036 , H05K2201/10416 , H05K2203/061 , H05K2203/167
摘要： A method of producing a printed circuit board (10) with a plurality of inlays (21, 22, 23, 24), having the following steps: supplying a plurality of inlays (21, 22, 23, 24), of which at least one inlay has at least one positioning element (21.1, 21.2; 22.1 to 22.7; 23.1, 23.2; 24.1, 24.2); building up a layer sequence from a plurality of printed-circuit-board layers, with at least one recess (14) for accommodating inlays, wherein, prior to the step of the plurality of inlays (21, 22, 23, 24) being inserted, the recess (14) is defined in an uppermost layer (12) by a frame made of non-conductive printed-circuit-board material; inserting the plurality of inlays (21, 22, 23, 24) into the recess (14) defined by the frame; covering the inlays (21, 22, 23, 24) with a non-conductive printed-circuit-board material; laminating the layer sequence, and removing at least the positioning elements (21.1, 21.2; 22.1 to 22.7; 23.1, 23.2; 24.1, 24.2) which establish a conductive contact between neighboring inlays.
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公开(公告)号：US10964635B2
公开(公告)日：2021-03-30
申请号：US16415480
申请日：2019-05-17
发明人： Thomas Gottwald , Christian Rössle
IPC分类号： H05K1/18 , H01L23/498 , H01L21/48 , H01L23/00 , H01L21/56 , H01L23/15 , H01L23/13 , H01L23/049
摘要： A power-electronic metal-ceramic module (10) comprising a metal-ceramic substrate (12) made of a ceramic carrier (14) having a metal top and bottom ply (16, 18), which is joined on or in the metal top ply (16) and/or the metal bottom ply (18) with a metal layer (16, 18, 22, 23) forming a frame (24) for accommodating at least one electronic component (30) and at least one electronic component (30) accommodated in the frame (24).
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8.发明授权公开(公告)号：US10777503B2
公开(公告)日：2020-09-15
申请号：US15973869
申请日：2018-05-08
发明人： Thomas Gottwald , Christian Rössle
IPC分类号： H01L23/00 , H01L23/528 , H01L23/538 , H01L21/48 , H01L23/535 , H05K1/11 , H05K1/18 , H05K3/42 , H05K3/40
摘要： A method for contacting a metallic contact pad embedded in a printed circuit board layer sequence, comprising the steps of producing a first hole matrix having a plurality of holes in a surface of the printed circuit board layer sequence in order to partly expose the metallic contact pad, of applying a metal layer in order to at least partly fill the holes of the first hole matrix, of producing a second hole matrix having a plurality of holes in the surface of the printed circuit board layer sequence in order to partly expose the metallic contact pad, wherein the holes of the second hole matrix are arranged in a manner offset relative to the holes of the first hole matrix, and of applying a metal layer in order to at least partly fill the holes of the second hole matrix, and a correspondingly produced printed circuit board.
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公开(公告)号：US10600705B2
公开(公告)日：2020-03-24
申请号：US15747674
申请日：2016-08-10
IPC分类号： H01L23/31 , H01L23/538 , H02M7/00 , H01L23/00 , H05K1/18
摘要： An electronic switching element includes at least one semiconductor switch inserted into a layer sequence of a conductor structure element; and at least two busbars which are configured to contact-connect the at least one semiconductor switch, wherein the at least two busbars run substantially above one another in the layer sequence of the conductor structure element.
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10.发明授权公开(公告)号：US10424536B2
公开(公告)日：2019-09-24
申请号：US15974474
申请日：2018-05-08
发明人： Thomas Gottwald , Christian Rössle
IPC分类号： H01L23/495 , H01L23/532 , G01R1/20 , H05K1/18 , H01L23/492 , H01L23/62
摘要： Electronic component having a first lead frame consisting of an electrically conductive material. The first lead frame carries a first semiconductor component. In the plane of the lead frame a shunt element is arranged, wherein the shunt element comprises a resistor body arranged between a first terminal contact and a second terminal contact. An electrically conducting connection extends from a terminal of the first semiconductor component through the first lead frame to the first terminal contact of the shunt element. A current measurement with good accuracy is facilitated.
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