公开(公告)号：US20060274561A1

公开(公告)日：2006-12-07

申请号：US10658804

申请日：2003-09-09

申请人： Sayeed Ahmed ,  Fred Flett ,  Ajay Patwardhan ,  Douglas Maly

发明人： Sayeed Ahmed ,  Fred Flett ,  Ajay Patwardhan ,  Douglas Maly

IPC分类号： H02M7/5387

CPC分类号： H02M7/53871 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30107 ,  H02M7/003 ,  H02M7/487 ,  H01L2924/00014

摘要： A tri-level inverter power module has an architecture employing a high degree of modularity that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.

公开(公告)号：US20060062023A1

公开(公告)日：2006-03-23

申请号：US10945850

申请日：2004-09-21

申请人： Ajay Patwardhan ,  Douglas Maly ,  Fred Flett ,  Sayeed Ahmed ,  Pablo Rodriguez ,  Kanghua Chen ,  Gerardo Jimenez

发明人： Ajay Patwardhan ,  Douglas Maly ,  Fred Flett ,  Sayeed Ahmed ,  Pablo Rodriguez ,  Kanghua Chen ,  Gerardo Jimenez

IPC分类号： H02J1/00

CPC分类号： H02M7/797 ,  H02M7/757

摘要： A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.

摘要翻译： 一种电力转换器，包括电耦合在正和负DC总线端子与一组相位端子之间的DC / AC桥式电路，DC / DC桥式电路电耦合到正负DC总线端子和一组DC桥式端子。 功率转换器可以被配置为控制到DC桥接端子和/或从DC桥接端子的转移和控制向AC相端子和/或从AC相端子的功率传递。

公开(公告)号：US20050162875A1

公开(公告)日：2005-07-28

申请号：US11010561

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02M1/00

CPC分类号： H05K7/1432 ,  H02M7/003

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

摘要翻译： 功率转换器（如配置为逆变器的电源模块）采用模块化方法。 在一些方面，半导体器件直接热耦合到导热衬底上，而不会介入电介质或绝缘结构。 另外或替代地，半导体器件在从半导体器件传输的热量遇到具有相应高热阻抗的电介质或电绝缘结构之前，热耦合到具有相对较大表面积的导热衬底。

公开(公告)号：US06906404B2

公开(公告)日：2005-06-14

申请号：US10642391

申请日：2003-08-14

申请人： Douglas K. Maly ,  Sayeed Ahmed ,  Ajay V. Patwardhan ,  Fred Flett

发明人： Douglas K. Maly ,  Sayeed Ahmed ,  Ajay V. Patwardhan ,  Fred Flett

IPC分类号： H01L23/552 ,  H01L25/07 ,  H02M7/00 ,  H01L23/02

CPC分类号： H01L24/49 ,  H01L23/552 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H02M7/003 ,  H01L2924/00 ,  H01L2224/45099

摘要： A power module employs at least one capacitor electrically coupled across the input terminals to reduce voltage overshoot. The capacitor may be surface mounted to a high side collector plating area and a low side emitter plating area. The power module may employ a lead frame and terminals accessible from an exterior of a module housing, for making electrical couplings to externally located power sources and/or loads.

摘要翻译： 功率模块采用至少一个电容器电耦合在输入端子之间以减少电压过冲。 电容器可以表面安装到高侧集电极电镀区域和低侧发射极电镀区域。 功率模块可以采用引线框架和从模块壳体的外部可接近的端子，用于将电耦合到外部定位的电源和/或负载。

公开(公告)号：US07505294B2

公开(公告)日：2009-03-17

申请号：US10658804

申请日：2003-09-09

申请人： Sayeed Ahmed ,  Fred Flett ,  Ajay V. Patwardhan ,  Douglas K. Maly

发明人： Sayeed Ahmed ,  Fred Flett ,  Ajay V. Patwardhan ,  Douglas K. Maly

IPC分类号： H05K7/02 ,  H02M7/5387

CPC分类号： H02M7/53871 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30107 ,  H02M7/003 ,  H02M7/487 ,  H01L2924/00014

摘要： A tri-level inverter power module has an architecture employing a high degree of modularity that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications.

摘要翻译： 三电平逆变器功率模块具有采用高度模块化的架构，其允许基本功率模块快速，容易地并且经济地配置以解决各种各样的应用。

公开(公告)号：US07443692B2

公开(公告)日：2008-10-28

申请号：US10664808

申请日：2003-09-17

申请人： Ajay V. Patwardhan ,  Douglas K. Maly ,  Sayeed Ahmed ,  Fred Flett

发明人： Ajay V. Patwardhan ,  Douglas K. Maly ,  Sayeed Ahmed ,  Fred Flett

IPC分类号： H01R9/00

CPC分类号： H02M7/003 ,  H02M1/126 ,  H02M1/32

摘要： A power converter utilizes a high frequency capacitor and a bulk capacitor coupled across the DC terminals to reduce high frequency effect and voltage overshoot, leading to space and cost savings in power converter design. Each capacitor may be physically coupled adjacent the gate driver board via clips, clamps, and/or fasteners.

摘要翻译： 电源转换器利用高频电容器和耦合在直流端子上的大容量电容器来减少高频效应和电压过冲，从而节省电力转换器设计的空间和成本。 每个电容器可以通过夹子，夹具和/或紧固件物理耦合在栅极驱动器板附近。

公开(公告)号：US07289343B2

公开(公告)日：2007-10-30

申请号：US11010560

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02M1/00

CPC分类号： H02M7/003 ,  H02M2001/327 ,  H05K7/20272 ,  Y10T307/74

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

摘要翻译： 功率转换器（如配置为逆变器的电源模块）采用模块化方法。 在一些方面，半导体器件直接热耦合到导热衬底上，而不会介入电介质或绝缘结构。 另外或替代地，半导体器件在从半导体器件传输的热量遇到具有相应高热阻抗的电介质或电绝缘结构之前，热耦合到具有相对较大表面积的导热衬底。

公开(公告)号：US07180763B2

公开(公告)日：2007-02-20

申请号：US10945850

申请日：2004-09-21

申请人： Ajay V. Patwardhan ,  Douglas K. Maly ,  Fred Flett ,  Sayeed Ahmed ,  Pablo Rodriguez ,  Kanghua Chen ,  Gerardo Jimenez

发明人： Ajay V. Patwardhan ,  Douglas K. Maly ,  Fred Flett ,  Sayeed Ahmed ,  Pablo Rodriguez ,  Kanghua Chen ,  Gerardo Jimenez

IPC分类号： H02M1/00

CPC分类号： H02M7/797 ,  H02M7/757

摘要： A power converter comprising a DC/AC bridge circuit electrically coupled between positive and negative DC bus terminals and a set of phase terminals, a DC/DC bridge circuit electrically coupled to the positive and negative DC bus terminals and a set of DC bridge terminals. The power converter may be configured to control the transfer of power to and/or from the DC bridge terminals and to control the transfer of power to and/or from the AC phase terminals.

摘要翻译： 一种电力转换器，包括电耦合在正和负DC总线端子与一组相位端子之间的DC / AC桥式电路，DC / DC桥式电路电耦合到正负DC总线端子和一组DC桥式端子。 功率转换器可以被配置为控制到DC桥接端子和/或从DC桥接端子的转移和控制向AC相端子和/或从AC相端子的功率传递。

公开(公告)号：US20050152100A1

公开(公告)日：2005-07-14

申请号：US11003542

申请日：2004-12-03

申请人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas Maly ,  Ajay Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02M1/00 ,  H02B5/00 ,  H02M7/00 ,  H05K7/14

CPC分类号： H05K7/1432 ,  H02M7/003 ,  Y10T307/74

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

公开(公告)号：US07301755B2

公开(公告)日：2007-11-27

申请号：US11010561

申请日：2004-12-13

申请人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

发明人： Pablo Rodriguez ,  Douglas K. Maly ,  Ajay V. Patwardhan ,  Kanghua Chen ,  Sayeed Ahmed ,  Gerardo Jimenez ,  Fred Flett

IPC分类号： H02H7/122 ,  H05K7/20

CPC分类号： H05K7/1432 ,  H02M7/003

摘要： Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.