公开(公告)号：US20170221744A1

公开(公告)日：2017-08-03

申请号：US15484736

申请日：2017-04-11

Applicant: Seagate Technology LLC

Inventor： Daniel Peinovich ,  Samuel Lewis Tanaka ,  Thomas Larson Greenberg

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/68

CPC classification number: H01L21/67703 ,  H01L21/67259 ,  H01L21/67766 ,  H01L21/67778 ,  H01L21/68 ,  H01L21/68707 ,  Y10T29/49998

Abstract: A method includes moving a sensor and an article at a first speed to position the sensor into a reference position relative to an article fixture. The sensor and the article are moved at a second speed as the sensor approaches the reference position. It is determined when the sensor is in the reference position, wherein the sensor is configured to be in the reference position when a contact is established between the sensor and a surface of the article fixture. The article is moved by a predetermined increment relative to the reference position to position the article in a target position in response to determining that the sensor is in the reference position.

公开(公告)号：US20160203956A1

公开(公告)日：2016-07-14

申请号：US14916081

申请日：2014-01-17

Applicant: SEAGATE TECHNOLOGY LLC

Inventor： Samuel Lewis Tanaka ,  Thomas Larson Greenberg

IPC: H01J37/32 ,  H01J37/34 ,  C23C14/34

CPC classification number: C23C14/34 ,  C23C14/022 ,  C23C14/56 ,  H01J37/32009 ,  H01J37/32403 ,  H01J37/3244 ,  H01J37/32532 ,  H01J37/32862 ,  H01J37/32889 ,  H01J37/34 ,  H01J2237/334

Abstract: A plasma etching source installable into at least one of multiple compartments of a sputter deposition tool. The plasma etching source includes a first mounting plate and at least one electrode plate coupled to the first mounting plate. A gas inlet is included in the first mounting plate of the plasma etching source.

Abstract translation: 等离子体蚀刻源可以安装到溅射沉积工具的多个隔间中的至少一个中。 等离子体蚀刻源包括第一安装板和联接到第一安装板的至少一个电极板。 等离子体蚀刻源的第一安装板中包括气体入口。