Abstract:
A chemical vapor deposition source that includes at least one plate to which first and second electrical connection posts are coupled. The chemical vapor deposition source also includes a filament having a first end and a second end. The first end of the filament is electrically connected to the first electrical connection post and the second end of the filament is electrically connected to the second electrical connection post. The chemical vapor deposition source further includes at least one filament holder electrically insulated from the at least one plate. The at least one filament holder holds a portion of the filament between the first end and the second end.
Abstract:
A device includes a housing unit and a number of magnets. The housing unit includes a number of holes therein. The magnets are positioned in the holes. The magnets have a same pole orientation. It is appreciated that the magnets are positioned in the holes to form a mechanically balanced and magnetically unbalanced structure.
Abstract:
A method includes moving a sensor and an article at a first speed to position the sensor into a reference position relative to an article fixture. The sensor and the article are moved at a second speed as the sensor approaches the reference position. It is determined when the sensor is in the reference position, wherein the sensor is configured to be in the reference position when a contact is established between the sensor and a surface of the article fixture. The article is moved by a predetermined increment relative to the reference position to position the article in a target position in response to determining that the sensor is in the reference position.
Abstract:
Provided herein is an apparatus including a loader configured to position a workpiece in a holding fixture. In some embodiments, the holding fixture includes an opening configured to removably receive the workpiece therein and hold the workpiece in a target position within the opening. The apparatus also includes position detecting means configured to translate a sensor to a predetermined location relative to the holding fixture and further configured to translate the workpiece by a predetermined increment relative to the predetermined location to position the workpiece in the target position.
Abstract:
The embodiments disclose an apparatus including at least two carbon source deposition tools for emitting electrons, at least two reflective polarity rear button permanent magnets integrated into the carbon source deposition tools for reflecting emitted electrons, and at least two paired polarity Helmholtz coils integrated into the carbon source deposition tools for forming uniform parallel magnetic field lines for confining the emitted electrons to uniformly deposit carbon onto the surfaces of a two-sided media disk.
Abstract:
A plasma etching source installable into at least one of multiple compartments of a sputter deposition tool. The plasma etching source includes a first mounting plate and at least one electrode plate coupled to the first mounting plate. A gas inlet is included in the first mounting plate of the plasma etching source.
Abstract:
The embodiments disclose an apparatus including at least two carbon source deposition tools for emitting electrons, at least two reflective polarity rear button permanent magnets integrated into the carbon source deposition tools for reflecting emitted electrons, and at least two paired polarity Helmholtz coils integrated into the carbon source deposition tools for forming uniform parallel magnetic field lines for confining the emitted electrons to uniformly deposit carbon onto the surfaces of a two-sided media disk.
Abstract:
A system includes a cooling plate coupled to a first disk holder and to a second disk holder. The first disk holder and the second disk holder are each shaped to be removably coupled to respective inner diameter surfaces of disks such that, when coupled, each disk is positioned a distance from the cooling plate.
Abstract:
A method includes moving a sensor and an article at a first speed to position the sensor into a reference position relative to an article fixture. The sensor and the article are moved at a second speed as the sensor approaches the reference position. It is determined when the sensor is in the reference position, wherein the sensor is configured to be in the reference position when a contact is established between the sensor and a surface of the article fixture. The article is moved by a predetermined increment relative to the reference position to position the article in a target position in response to determining that the sensor is in the reference position.
Abstract:
A plasma etching source installable into at least one of multiple compartments of a sputter deposition tool. The plasma etching source includes a first mounting plate and at least one electrode plate coupled to the first mounting plate. A gas inlet is included in the first mounting plate of the plasma etching source.