Polymer, resist composition and patterning process
    13.
    发明授权
    Polymer, resist composition and patterning process 有权
    聚合物,抗蚀剂组合物和图案化工艺

    公开(公告)号:US06670094B2

    公开(公告)日:2003-12-30

    申请号:US10000221

    申请日:2001-12-04

    IPC分类号: G03F7038

    摘要: A polymer comprising recurring units of formula (1-1) or (1-2) wherein R1 and R2 are H or C1-15 alkyl, R1 and R2, taken together, may form a ring; R3 is H, C1-15 alkyl, acyl or alkylsulfonyl or C2-15 alkoxycarbonyl or alkoxyalkyl which may have halogen substituents, not all R1, R2 and R3 are hydrogen; and k=0 or 1, and having a Mw of 1,000-500,000 is novel. A resist composition comprising the polymer as a base resin is sensitive to high-energy radiation, has excellent sensitivity, resolution, etching resistance, and minimized swell and lends itself to micropatterning with electron beams or deep-UV.

    摘要翻译: 包含式(1-1)或(1-2)的重复单元的聚合物,其中R 1和R 2是H或C 1-15烷基,R 1和R 2一起可以一起 形成戒指 R 3为H,C 1-15烷基,酰基或烷基磺酰基或可具有卤素取代基的C 2-5烷氧基羰基或烷氧基烷基,并不全部为R 1,R 2和R 3为氢; 并且k = 0或1,并且具有1,000-500,000的Mw是新颖的。 包含作为基础树脂的聚合物的抗蚀剂组合物对高能辐射敏感,具有优异的灵敏度,分辨率,耐腐蚀性和最小化的溶胀,并且使其自身具有电子束或深UV的微图形化。

    Polymers, resist compositions and patterning process
    14.
    发明授权
    Polymers, resist compositions and patterning process 有权
    聚合物,抗蚀剂组合物和图案化工艺

    公开(公告)号:US07718342B2

    公开(公告)日:2010-05-18

    申请号:US11645751

    申请日:2006-12-27

    摘要: A polymer is provided comprising recurring units having formulas (1), (2), (3), (4), (5), and (6) in amounts of 1-60 mol % (1), 1-60 mol % (2), 1-50 mol % (3), 0-60 mol % (4), 0-30 mol % (5), and 0-30 mol % (6), and having a Mw of 3,000-30,000 and a Mw/Mn of 1.5-2.5. R1, R3, R4, R7, R9, and R11 are H or CH3, Y is methylene or O, R2 is CO2R10 when Y is methylene and R2 is H or CO2R10 when Y is O, R10 is C1-C15 alkyl which may be separated by O, R5 and R6 are H or OH, R8 is a tertiary ester type acid-labile protective group, and R12 is OH-containing fluoroalkyl. A resist composition comprising the polymer has a high resolution and is improved in line edge roughness and I/G bias.

    摘要翻译: 提供的聚合物包含具有式(1),(2),(3),(4),(5)和(6)的重复单元,其含量为1-60mol%(1),1-60mol% (2),1-50mol%(3),0-60mol%(4),0-30mol%(5)和0-30mol%(6),Mw为3,000〜 Mw / Mn为1.5-2.5。 R 1,R 3,R 4,R 7,R 9和R 11为H或CH 3,Y为亚甲基或O,当Y为亚甲基时,R 2为CO 2 R 10,当Y为O时,R 2为H或CO 2 R 10,R 10为C 1 -C 15烷基 由O分隔,R 5和R 6是H或OH,R 8是叔酯型酸不稳定保护基,R 12是含OH的氟代烷基。 包含聚合物的抗蚀剂组合物具有高分辨率并且在线边缘粗糙度和I / G偏压方面得到改善。

    Photo acid generator, chemical amplification resist material
    15.
    发明授权
    Photo acid generator, chemical amplification resist material 有权
    照片酸发生器,化学放大抗蚀材料

    公开(公告)号:US07211367B2

    公开(公告)日:2007-05-01

    申请号:US11373925

    申请日:2006-03-13

    IPC分类号: G03F7/031

    摘要: A high resolution resist material comprising an acid generator is provided so that high sensitivity and high resolution for high energy rays of 300 nm or less, small line-edge roughness, and excellence in heat stability and storage stability are obtained. Moreover, a pattern formation method using this resist material are provided. Specifically, a novel compound of the following general formula (1); and a positive resist material comprising this compound preferably as a photo acid generator, and a base resin; are provided. This positive resist material may contain a basic compound or a dissolution inhibitor. Further, the present invention provides a pattern formation method comprising the steps of applying this positive resist material on a substrate, then heat-treating the material, exposing the treated material to a high energy ray having a wavelength of 300 nm or less via a photo mask, optionally heat-treating the exposed material, and developing the material using a developer

    摘要翻译: 提供了包含酸产生器的高分辨率抗蚀剂材料,从而获得了300nm以下的高能量射线的高灵敏度和高分辨率,小的线边缘粗糙度,以及热稳定性和储存稳定性方面的优异性。 此外,提供了使用该抗蚀剂材料的图案形成方法。 具体地,下述通式(1)的新化合物; 以及优选含有该化合物作为光酸发生剂的正性抗蚀剂材料和基础树脂; 被提供。 该正性抗蚀剂材料可含有碱性化合物或溶解抑制剂。 此外,本发明提供了一种图案形成方法,包括以下步骤:将该正性抗蚀剂材料涂布在基板上,然后对该材料进行热处理,通过照片将经处理的材料暴露于波长为300nm以下的高能量射线 掩模,任选地热处理暴露的材料,以及使用显影剂显影材料

    Positive resist composition and patterning process
    19.
    发明授权
    Positive resist composition and patterning process 有权
    正抗蚀剂组成和图案化工艺

    公开(公告)号:US08795942B2

    公开(公告)日:2014-08-05

    申请号:US12000284

    申请日:2007-12-11

    CPC分类号: G03F7/0397 G03F7/0045

    摘要: There is disclosed a resist composition that remarkably improves the resolution of photolithography using a high energy beam such as ArF excimer laser light as a light source, and exhibits excellent resistance to surface roughness and side lobe under use of a halftone phase shift mask; and a patterning process using the resist composition. The positive resist composition at least comprises (A) a resin component comprising a repeating unit represented by the following general formula (1); (B) a photoacid generator generating sulfonic acid represented by the following general formula (2) upon exposure to a high energy beam; and (C) an onium salt where a cation is sulfonium represented by the following general formula (3), or ammonium represented by the following general formula (4); and an anion is represented by any one of the following general formulae (5) to (7).

    摘要翻译: 公开了一种抗蚀剂组合物,其使用诸如ArF准分子激光器的高能束作为光源显着地提高了光刻的分辨率,并且在使用半色调相移掩模的情况下表现出优异的抗表面粗糙度和侧凸的性能; 以及使用抗蚀剂组合物的图案化工艺。 正型抗蚀剂组合物至少包含(A)包含由以下通式(1)表示的重复单元的树脂组分; (B)在暴露于高能量束时产生由以下通式(2)表示的磺酸的光酸产生剂; 和(C)鎓盐,其中阳离子是由以下通式(3)表示的锍或由以下通式(4)表示的铵; 并且阴离子由以下通式(5)至(7)中的任一个表示。