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32 条记录 (耗时 0.04 秒)

    Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry
    11.
    发明授权
    Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry 有权
    用于控制抛光选择性和化学机械抛光浆料的辅助剂

    公开(公告)号：US08147711B2

    公开(公告)日：2012-04-03

    申请号：US12086155

    申请日：2006-12-08

    申请人： Jung Hee Lee ,  Jong Pil Kim ,  Gi Ra Yi ,  Kwang Ik Moon ,  Chang Bum Ko ,  Soon Ho Jang ,  Seung Beom Cho ,  Young Jun Hong

    发明人： Jung Hee Lee ,  Jong Pil Kim ,  Gi Ra Yi ,  Kwang Ik Moon ,  Chang Bum Ko ,  Soon Ho Jang ,  Seung Beom Cho ,  Young Jun Hong

    IPC分类号： C09K13/00

    CPC分类号： C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/31053

    摘要： Disclosed is an adjuvant for controlling polishing selectivity when polishing a cationically charged material simultaneously with an anionically charged material. CMP slurry comprising the adjuvant is also disclosed. The adjuvant comprises: (a) a polyelectrolyte that forms an adsorption layer on the cationically charged material in order to increase the polishing selectivity of the anionically charged material; (b) a basic material; and (c) a fluorine-based compound. when the adjuvant for controlling polishing selectivity of CMP slurry according to the present invention is applied to a CMP process, it is possible to increase the polishing selectivity of a silicon oxide layer, to obtain a uniform particle size of CMP slurry, to stabilize variations in viscosity under an external force and to minimize generation of microscratches during a polishing process. Therefore, the adjuvant for CMP slurry according to the present invention can improve reliability and productivity during the fabrication of very large scale integrated semiconductors.

    摘要翻译： 公开了用于在与阴离子充电材料同时研磨阳离子充电材料时控制抛光选择性的佐剂。 还公开了包含佐剂的CMP浆料。 助剂包括：（a）在阳离子充电材料上形成吸附层的聚电解质，以增加阴离子充电材料的抛光选择性; （b）基本材料; 和（c）氟系化合物。 当将用于控制根据本发明的CMP浆料的抛光选择性的佐剂应用于CMP工艺时，可以增加氧化硅层的抛光选择性，以获得CMP浆料的均匀粒度，以稳定化 在外力下的粘度并且在抛光过程中最小化微细纹的产生。 因此，根据本发明的用于CMP浆料的助剂可以在制造非常大规模的集成半导体期间提高可靠性和生产率。

    Adjuvant for Controlling Polishing Selectivity and Chemical Mechanical Polishing Slurry
    12.
    发明申请
    Adjuvant for Controlling Polishing Selectivity and Chemical Mechanical Polishing Slurry 有权
    控制抛光选择性和化学机械抛光浆料的辅助剂

    公开(公告)号：US20090267020A1

    公开(公告)日：2009-10-29

    申请号：US12086155

    申请日：2006-12-08

    申请人： Jung Hee Lee ,  Jong Pil Kim ,  Gi Ra Yi ,  Kwang Ik Moon ,  Chang Bum Ko ,  Soon Ho Jang ,  Seung Beom Cho ,  Young Jun Hong

    发明人： Jung Hee Lee ,  Jong Pil Kim ,  Gi Ra Yi ,  Kwang Ik Moon ,  Chang Bum Ko ,  Soon Ho Jang ,  Seung Beom Cho ,  Young Jun Hong

    IPC分类号： C09K3/14

    CPC分类号： C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/31053

    摘要： Disclosed is an adjuvant for controlling polishing selectivity when polishing a cationically charged material simultaneously with an anionically charged material. CMP slurry comprising the adjuvant is also disclosed. The adjuvant comprises: (a) a polyelectrolyte that forms an adsorption layer on the cationically charged material in order to increase the polishing selectivity of the anionically charged material; (b) a basic material; and (c) a fluorine-based compound. when the adjuvant for controlling polishing selectivity of CMP slurry according to the present invention is applied to a CMP process, it is possible to increase the polishing selectivity of a silicon oxide layer, to obtain a uniform particle size of CMP slurry, to stabilize variations in viscosity under an external force and to minimize generation of microscratches during a polishing process. Therefore, the adjuvant for CMP slurry according to the present invention can improve reliability and productivity during the fabrication of very large scale integrated semiconductors.

    摘要翻译： 公开了用于在与阴离子充电材料同时研磨阳离子充电材料时控制抛光选择性的佐剂。 还公开了包含佐剂的CMP浆料。 助剂包括：（a）在阳离子充电材料上形成吸附层的聚电解质，以增加阴离子充电材料的抛光选择性; （b）基本材料; 和（c）氟系化合物。 当将用于控制根据本发明的CMP浆料的抛光选择性的佐剂应用于CMP工艺时，可以增加氧化硅层的抛光选择性，以获得CMP浆料的均匀粒度，以稳定化 在外力下的粘度并且在抛光过程中最小化微细纹的产生。 因此，根据本发明的用于CMP浆料的助剂可以在制造非常大规模的集成半导体期间提高可靠性和生产率。

    Semiconductor devices including etching stop films
    13.
    发明授权
    Semiconductor devices including etching stop films 有权
    半导体器件包括蚀刻停止膜

    公开(公告)号：US09209087B2

    公开(公告)日：2015-12-08

    申请号：US13243338

    申请日：2011-09-23

    申请人： Jong Pil Kim ,  Woncheol Jeong

    发明人： Jong Pil Kim ,  Woncheol Jeong

    IPC分类号： H01L31/18 ,  H01L21/8238

    CPC分类号： H01L27/092 ,  H01L21/823807 ,  H01L21/823814 ,  H01L23/528 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor device may include a substrate including an NMOS region and a PMOS region. A gate structure can include a gate pattern and a spacer pattern, where the gate structure is on the substrate. A first etching stop film can be on the substrate in the NMOS region and a second etching stop film can be on the substrate in the PMOS region. A contact hole can penetrate the first and second etching stop films and a contact plug can be in the contact hole. A thickness of the first etching stop film can be greater than a thickness of the second etching stop film. Related methods are also disclosed.

    摘要翻译： 半导体器件可以包括包括NMOS区和PMOS区的衬底。 栅极结构可以包括栅极图案和间隔物图案，其中栅极结构在衬底上。 第一蚀刻停止膜可以在NMOS区域的衬底上，并且第二蚀刻停止膜可以在PMOS区域中的衬底上。 接触孔可以穿透第一和第二蚀刻停止膜，并且接触插塞可以在接触孔中。 第一蚀刻停止膜的厚度可以大于第二蚀刻停止膜的厚度。 还公开了相关方法。

    TRANSFORMER HAVING RESONANT INDUCTANCE
    14.
    发明申请
    TRANSFORMER HAVING RESONANT INDUCTANCE 有权
    具有谐振电感的变压器

    公开(公告)号：US20100033993A1

    公开(公告)日：2010-02-11

    申请号：US12212123

    申请日：2008-09-17

    申请人： Don Sik Kim ,  Gun Woo Moon ,  Kyu Min Cho ,  Young Do Kim ,  In Ho Cho ,  Hak Ryong Kim ,  Jong Pil Kim ,  Dong Joong Kim ,  Tae Won Heo ,  Sang Cheol Bong

    发明人： Don Sik Kim ,  Gun Woo Moon ,  Kyu Min Cho ,  Young Do Kim ,  In Ho Cho ,  Hak Ryong Kim ,  Jong Pil Kim ,  Dong Joong Kim ,  Tae Won Heo ,  Sang Cheol Bong

    IPC分类号： H02M3/335 ,  H01F27/28

    CPC分类号： H02M3/337 ,  H01F27/38 ,  H02M2007/4811 ,  Y02B70/1433

    摘要： Provided is a transformer having resonant inductance, the transformer including a core that includes a first leg formed in one side thereof, a second leg which is formed in the other side thereof so as to be electromagnetically coupled to the first leg, and a third leg which is formed between the first and second legs so as to be electromagnetically coupled to the first and second legs; a primary winding that is wound around one side of the third leg; a secondary winding that is wound around the other side of the third leg so as to induce power through electromagnetic induction with the primary winding; and a resonant inductance winding that is wound around the outside of the core so as not to be magnetically induced by magnetic fluxes generated from the primary and secondary windings.

    摘要翻译： 提供一种具有谐振电感的变压器，该变压器包括一芯部，该芯部包括形成在其一侧的第一支脚，另一侧形成为与第一支脚电磁耦合的第二支脚;以及第三支脚 其形成在第一和第二腿之间，以便电磁耦合到第一和第二腿; 缠绕在第三条腿一侧的初级绕组; 缠绕在第三腿的另一侧的次级绕组，以便通过与初级绕组的电磁感应来引起电力; 以及缠绕在芯的外侧的谐振电感绕组，以便不被从初级和次级绕组产生的磁通磁感应。

    Adjuvant for CMP slurry
    15.
    发明授权
    Adjuvant for CMP slurry 有权
    CMP浆料的辅料

    公开(公告)号：US08062395B2

    公开(公告)日：2011-11-22

    申请号：US11783742

    申请日：2007-04-11

    申请人： Gi Ra Yi ,  Jong Pil Kim ,  Young Jun Hong

    发明人： Gi Ra Yi ,  Jong Pil Kim ,  Young Jun Hong

    IPC分类号： B24D3/02 ,  C09C1/68 ,  C09K3/14

    CPC分类号： H01L21/31053 ,  C09G1/02 ,  C09K3/1463

    摘要： Disclosed is an adjuvant in use for a process of polishing a cationically charged material and an anionically charged material at the same time with abrasive particles, which is absorbed onto the cationically charged material thereby to restrain the cationically charged material from being polished, resulting in raising a polishing selectivity of the anionically charged material, wherein the adjuvant comprises polymer particles having a core-shell structure with a nano-scale particle size smaller than that of the abrasive particles, surfaces of which are anionically charged. CMP (chemical mechanical polishing) slurry comprising the above adjuvant and abrasive particles is also disclosed.

    摘要翻译： 公开了一种用于对阳离子充电材料和阴离子充电材料同时研磨磨料颗粒的方法的辅助剂，其被吸收到阳离子充电材料上，从而限制阳离子充电材料的抛光，从而提高 阴离子充电材料的抛光选择性，其中所述助剂包含具有小于磨料颗粒的纳米级粒径的核 - 壳结构的聚合物颗粒，其表面是阴离子充电的。 还公开了包含上述助剂和磨料颗粒的CMP（化学机械抛光）浆料。

    LOAD SHARING DEVICE AND PARALLEL POWER SUPPLY THEREWITH
    17.
    发明申请
    LOAD SHARING DEVICE AND PARALLEL POWER SUPPLY THEREWITH 有权
    负载共享器件和并联电源

    公开(公告)号：US20110001359A1

    公开(公告)日：2011-01-06

    申请号：US12545721

    申请日：2009-08-21

    申请人： Gun Woo Moon ,  Sang Cheol Bong ,  Kang Hyun Yi ,  Ki Bum Park ,  Dong Seong Oh ,  Chong Eun Kim ,  Jong Pil Kim ,  Dong Joong Kim ,  Tae Won Heo ,  Don Sik Kim

    发明人： Gun Woo Moon ,  Sang Cheol Bong ,  Kang Hyun Yi ,  Ki Bum Park ,  Dong Seong Oh ,  Chong Eun Kim ,  Jong Pil Kim ,  Dong Joong Kim ,  Tae Won Heo ,  Don Sik Kim

    IPC分类号： H02J1/10

    CPC分类号： H02J1/102 ,  H02M2001/007 ,  Y10T307/414 ,  Y10T307/50

    摘要： The present invention relates to a load sharing device and a parallel power supply therewith. There is provided a parallel power supply, including: a plurality of power supply modules each connected to a single load in parallel to provide balanced output currents to the single load; a common voltage control signal output unit that generates a common voltage control signal from output voltages of the plurality of power supply modules and outputs the common voltage control signals to the plurality of power supply modules; and output voltage control units that are provided in the respective plurality of power supply modules to detect output currents of the plurality of power supply modules and to control output voltages of the plurality of power supply modules according to the detected signals, controlling the output voltages to be in a predetermined voltage range according to the common voltage control signals.

    摘要翻译： 本发明涉及一种负载共享装置及其并联电源。 提供并联电源，包括：多个电源模块，每个电源模块并联连接到单个负载以向单个负载提供平衡的输出电流; 公共电压控制信号输出单元，其从多个电源模块的输出电压产生公共电压控制信号，并将公共电压控制信号输出到多个电源模块; 以及输出电压控制单元，其设置在相应的多个电源模块中，以检测多个电源模块的输出电流，并根据检测到的信号控制多个电源模块的输出电压，控制输出电压 根据公共电压控制信号在预定电压范围内。

    Transformer having resonant inductance
    18.
    发明授权
    Transformer having resonant inductance 有权
    具有谐振电感的变压器

    公开(公告)号：US07742319B2

    公开(公告)日：2010-06-22

    申请号：US12212123

    申请日：2008-09-17

    申请人： Don Sik Kim ,  Gun Woo Moon ,  Kyu Min Cho ,  Young Do Kim ,  In Ho Cho ,  Hak Ryong Kim ,  Jong Pil Kim ,  Dong Joong Kim ,  Tae Won Heo ,  Sang Cheol Bong

    发明人： Don Sik Kim ,  Gun Woo Moon ,  Kyu Min Cho ,  Young Do Kim ,  In Ho Cho ,  Hak Ryong Kim ,  Jong Pil Kim ,  Dong Joong Kim ,  Tae Won Heo ,  Sang Cheol Bong

    IPC分类号： H02M3/335 ,  H02M7/06 ,  H02M7/5387

    CPC分类号： H02M3/337 ,  H01F27/38 ,  H02M2007/4811 ,  Y02B70/1433

    摘要： Provided is a transformer having resonant inductance, the transformer including a core that includes a first leg formed in one side thereof, a second leg which is formed in the other side thereof so as to be electromagnetically coupled to the first leg, and a third leg which is formed between the first and second legs so as to be electromagnetically coupled to the first and second legs; a primary winding that is wound around one side of the third leg; a secondary winding that is wound around the other side of the third leg so as to induce power through electromagnetic induction with the primary winding; and a resonant inductance winding that is wound around the outside of the core so as not to be magnetically induced by magnetic fluxes generated from the primary and secondary windings.

    摘要翻译： 提供一种具有谐振电感的变压器，该变压器包括一芯部，该芯部包括形成在其一侧的第一支脚，另一侧形成为与第一支脚电磁耦合的第二支脚;以及第三支脚 其形成在第一和第二腿之间，以便电磁耦合到第一和第二腿; 缠绕在第三条腿一侧的初级绕组; 缠绕在第三腿的另一侧的次级绕组，以便通过与初级绕组的电磁感应来引起电力; 以及缠绕在芯的外侧的谐振电感绕组，以便不被从初级和次级绕组产生的磁通磁感应。

    Adjuvant for CMP slurry
    19.
    发明申请
    Adjuvant for CMP slurry 有权
    CMP浆料的辅料

    公开(公告)号：US20070243710A1

    公开(公告)日：2007-10-18

    申请号：US11783742

    申请日：2007-04-11

    申请人： Gi Ra Yi ,  Jong Pil Kim ,  Young Jun Hong

    发明人： Gi Ra Yi ,  Jong Pil Kim ,  Young Jun Hong

    IPC分类号： H01L21/461 ,  C09K13/00

    CPC分类号： H01L21/31053 ,  C09G1/02 ,  C09K3/1463

    摘要： Disclosed is an adjuvant in use for a process of polishing a cationically charged material and an anionically charged material at the same time with abrasive particles, which is absorbed onto the cationically charged material thereby to restrain the cationically charged material from being polished, resulting in raising a polishing selectivity of the anionically charged material, wherein the adjuvant comprises polymer particles having a core-shell structure with a nano-scale particle size smaller than that of the abrasive particles, surfaces of which are anionically charged. CMP (chemical mechanical polishing) slurry comprising the above adjuvant and abrasive particles is also disclosed.

    摘要翻译： 公开了一种用于对阳离子充电材料和阴离子充电材料同时研磨磨料颗粒的方法的辅助剂，其被吸收到阳离子充电材料上，从而限制阳离子充电材料的抛光，从而提高 阴离子充电材料的抛光选择性，其中所述助剂包含具有小于磨料颗粒的纳米级粒度的核 - 壳结构的聚合物颗粒，其表面是阴离子充电的。 还公开了包含上述助剂和磨料颗粒的CMP（化学机械抛光）浆料。