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公开(公告)号：US11916297B2
公开(公告)日：2024-02-27
申请号：US17668179
申请日：2022-02-09
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Zhenyu Jia , Kerui Xi , Baiquan Lin , Xiaonan Han , Zuocai Yang , Donghua Wang , Yukun Huang , Feng Qin
CPC classification number: H01Q21/0075 , H01Q1/48 , H01Q21/0087 , H01Q3/36
Abstract: A liquid crystal antenna and a method for forming a liquid crystal antenna are provided. The liquid crystal antenna includes a first substrate; a second substrate opposite to the first substrate; and a liquid crystal layer disposed between the first substrate and the second substrate. A first conductive layer is disposed on a side of the first substrate facing toward the second substrate; a second conductive layer is disposed on a side of the second substrate facing toward the first substrate; the second conductive layer at least includes a plurality of radiation electrodes; an external metal layer is disposed on a side of the first substrate facing away from the liquid crystal layer; and the external metal layer is connected to a fixed potential.
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公开(公告)号：US11764181B2
公开(公告)日：2023-09-19
申请号：US17829619
申请日：2022-06-01
Inventor： Feng Qin , Kerui Xi , Tingting Cui , Jie Zhang , Xuhui Peng
CPC classification number: H01L24/19 , H01L21/561 , H01L23/3121 , H01L24/11 , H01L24/13 , H01L24/20 , H01L24/81 , H01L24/96 , H01L24/97 , H01L2224/2101 , H01L2924/37001
Abstract: Provided are a semiconductor package and a method for fabricating the semiconductor package. The method includes the followings steps: a first workpiece is provided, where the first workpiece includes a first substrate and multiple first rewiring structures arranged on the first substrate at intervals, and each first rewiring structure includes at least two first rewiring layers; an encapsulation layer is formed on the first rewiring structures, where the encapsulation layer is provided with multiple first through holes, and the first through holes expose one first rewiring layer; at least two second rewiring layers are disposed on a side of the encapsulation layer facing away from the first rewiring layer; multiple semiconductor elements are provided, where the semiconductor elements are arranged on a side of the first rewiring structures facing away from the encapsulation layer, where the first rewiring layers are electrically connected to pins of the semiconductor elements.
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公开(公告)号：US20220077596A1
公开(公告)日：2022-03-10
申请号：US17530425
申请日：2021-11-18
Inventor： Kerui Xi , Xuhui Peng , Feng Qin , Tingting Cui , Zhenyu Jia
Abstract: Disclosed antenna unit includes first substrate and second substrate opposite to each other, phase shifting units and driver circuit. Region facing the first substrate and the second substrate form phase shifting region. In first direction, the first substrate formed with first step region, and used for connecting radio-frequency signal terminal; in second direction, the second substrate formed with second step region, and included angle between the first direction and the second direction greater than or equal to 0° and smaller than 180°. At least part of the first step region does not overlap at least part of the second step region. Phase shifting units used for radiating radio-frequency signal and distributed in phase shifting region, each phase shifting unit. At least part of the driver circuit disposed in the second step region and the driver circuit electrically connected to each phase shifting unit to adjust radio-frequency signal.
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公开(公告)号：US20210351150A1
公开(公告)日：2021-11-11
申请号：US16917155
申请日：2020-06-30
Inventor： Feng Qin , Kerui Xi , Tingting Cui , Jie Zhang , Xuhui Peng
Abstract: Provided are a semiconductor package and a method for fabricating the semiconductor package. The method includes followings steps: a first workpiece is provided, where the first workpiece includes a first substrate and multiple first rewiring structures arranged on the first substrate at intervals, and each first rewiring structure includes at least two first rewiring layers; an encapsulation layer is formed on the first rewiring structures, where the encapsulation layer is provided with multiple first through holes, and the first through holes exposes one first rewiring layer; at least two second rewiring layers are disposed on a side of the encapsulation layer facing away from the first rewiring layer; multiple semiconductor elements are provided, where the semiconductor elements are arranged on a side of the first rewiring structures facing away from the encapsulation layer, where the first rewiring layers are electrically connected to pins of the semiconductor elements.
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公开(公告)号：US10921651B2
公开(公告)日：2021-02-16
申请号：US16186577
申请日：2018-11-11
Applicant: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
Inventor： Lei Wang , Mingwei Zhang , Xiangjian Kong , Jin'e Liu , Feng Qin
IPC: G02F1/1339 , G02F1/1368 , H01L27/12 , G02F1/1362 , G02F1/1335
Abstract: A display panel, a display device, and a method for manufacturing a display panel are provided. The display panel includes an array substrate, a color film substrate, and support pillars located between the array substrate and the color filter substrate. The array substrate includes sub-pixels, multiple gate lines, multiple data lines and a common electrode line. The common electrode line includes a first wire portion extending in a first direction and located between two adjacent sub-pixels. The data lines include multiple support sections each located at an intersection of the data line with the first wire portion. An orthographic projection of each of the support sections on the base substrate is a support region. A side of the support pillar close to the array substrate is located in the support region.
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Patent Agency Ranking
公开(公告)号：US10795075B2
公开(公告)日：2020-10-06
申请号：US16295191
申请日：2019-03-07
Applicant: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
Inventor： Feng Qin , Wanchun Du , Lu Yao
IPC: F21V8/00
Abstract: Backlight module and display device are provided. The backlight module includes an accommodation frame including a base and an extending part, a first light guide plate, a second light guide plate; a first reflector, a first light source, and a second light source. The first light guide plate and the second light guide plate are disposed sequentially along a direction perpendicular to a plane of the base in an accommodation space formed by the base and the extending part, and are controlled independently. The first light source has a wavelength λ1 of 780 nm
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17.发明授权公开(公告)号：US10650716B2
公开(公告)日：2020-05-12
申请号：US15826176
申请日：2017-11-29
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Abstract: A gate shift register unit comprises an activation signal terminal, a deactivation signal terminal, a reset signal terminal, a first level signal terminal, a second level signal terminal, a first control terminal, a first clock signal terminal, a second clock signal terminal, an output terminal, a first node, a second node, a first node control unit, a second node control unit, a reset unit, and an output unit. The first node control unit is connected to the first control terminal, the activation signal terminal, the first level signal terminal, the second level signal terminal, the deactivation signal terminal, the first node, and the second node, and configured to transfer a signal at the first level signal terminal or the second level signal terminal to the first node under a control of potential signals at the activation signal terminal, the deactivation signal terminal, the first control terminal, and the second node.
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18.发明申请公开(公告)号：US20190392771A1
公开(公告)日：2019-12-26
申请号：US16188528
申请日：2018-11-13
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Zuzhao Xu , Kerui Xi , Baiquan Lin , Xiaohe Li , Jine Liu , Feng Qin , Qiongqin Mao , Tinghai Wang , Mingwei Zhang
IPC: G09G3/34
Abstract: Provided are an array substrate, an electronic paper display panel and a drive method thereof and a display device. A display area includes a plurality of sub-display areas, a plurality of data lines in each sub-display area are electrically insulated from each other, corresponding data lines in different sub-display areas are electrically connected to each other, and a control signal line is configured to control display time of each sub-display area. When a control chip and a flexible circuit board are employed, only a small number of control chips and flexible circuit boards may drive the plurality of sub-display areas to display pictures.
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公开(公告)号：US11929313B2
公开(公告)日：2024-03-12
申请号：US17532248
申请日：2021-11-22
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Mingyu Wang , Kerui Xi , Xuhui Peng , Feng Qin , Jie Zhang
CPC classification number: H01L23/49816 , H01L23/15 , H01L23/32 , H01L23/49838 , H01L24/16 , H01L24/73 , H01L24/81 , H01L31/02002 , H04N23/54 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204
Abstract: A chip package structure, manufacturing method thereof, and module are described. In an embodiment, the chip package structure includes: a substrate, a wiring layer, a chip, and a second conductive bump, wherein, in an embodiment, the substrate includes a first region and a second region surrounding the first region, and the wiring layer is located on side of the substrate and includes metal wire, wherein at least part of a metal wire is in contact with the substrate in direction perpendicular to the substrate, and the metal wire overlaps with the second region, wherein the chip is located on side of the wiring layer facing away from the substrate, and the chip corresponds to the first region. In an embodiment, a first conductive bump is provided on side of the chip facing away from the substrate and is electrically connected to the metal wire.
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公开(公告)号：US11909118B2
公开(公告)日：2024-02-20
申请号：US17547647
申请日：2021-12-10
Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
Inventor： Zhenyu Jia , Kerui Xi , Baiquan Lin , Linzhi Wang , Qinyi Duan , Zuocai Yang , Feng Qin
CPC classification number: H01Q21/0075 , H01Q3/44 , H01Q9/0457 , H01Q21/0087 , H01Q21/065
Abstract: Provided is an antenna. The antenna includes a first metal electrode, a second metal electrode, and a dielectric functional layer. The first metal electrode and the second metal electrode are located on two opposite sides of the dielectric functional layer, respectively; and the first metal electrode includes a plurality of transmission electrodes. The antenna further includes a flexible coplanar waveguide and a feed network. The flexible coplanar waveguide is electrically connected to the feed network and configured to feed an electrical signal to the feed network.
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