COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD
    11.
    发明申请
    COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD 有权
    组件安装设备和组件安装方法

    公开(公告)号:US20120324725A1

    公开(公告)日:2012-12-27

    申请号:US13581862

    申请日:2012-01-19

    IPC分类号: H05K3/30

    摘要: When performing the device type changing operation with the change of the board type to undergo mounting, the component mounting device, which has a first mounting lane and a second mounting lane and which is structured so as to be able to select either an independent mounting mode or an alternate mounting mode, moves a mounting head of the mounting lane to and thereafter positions and fixes to a previously-set predetermined withdraw position [P] where entry of a portion of a body of an operator by way of an opening (19) formed in a protective cover (18a) can be prevented and where safety of the operator is not impaired even if a mounting head of a mounting lane on the other side has undergone collision.

    摘要翻译: 当随着板类型的改变执行装置类型改变操作以进行安装时,具有第一安装通道和第二安装通道的部件安装装置,其被构造成能够选择独立的安装模式 或替代安装模式,将安装通道的安装头移动到之后,并且定位并固定到预先设定的预定撤回位置[P],其中通过开口(19)进入操作者的身体的一部分, 即使在另一侧的安装车道的安装头发生碰撞也能够防止形成在保护罩(18a)中并且操作者的安全性不受损害。

    COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD
    12.
    发明申请
    COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD 有权
    组件安装设备和组件安装方法

    公开(公告)号:US20120317803A1

    公开(公告)日:2012-12-20

    申请号:US13580029

    申请日:2012-01-19

    IPC分类号: H05K3/30

    摘要: In a component mounting device (1) which includes a first mounting lane (L1) and a second mounting lane (L2) and for which an independence mounting mode and an alternation mounting mode are selectable, a first limited movable area (R1A) and a first limited movable area (R1 B) in which the movements in the horizontal direction of a first mounting head (13A) and a second mounting head (13B) of the mounting lanes are permitted in the independence mounting mode, are set as areas different from second limited movable areas in the alternation mounting mode, to prevent the mounting head of the mounting lane which is continuously operating from entering into the area of the mounting lanes for which the device type changing operation is being performed.

    摘要翻译: 在包括第一安装通道(L1)和第二安装通道(L2)并且独立安装模式和交替安装模式可选择的部件安装装置(1)中,第一受限可移动区域(R1A)和 在独立安装模式下允许在第一安装头(13A)和第二安装头(13B)的水平方向上的移动被允许在独立安装模式下的第一受限可动区域(R1B)被设置为不同于 在交替安装模式中的第二受限可移动区域,以防止连续操作的安装车道的安装头进入进行装置类型改变操作的安装车道的区域。

    Component mounting device and product-type switching method
    13.
    发明授权
    Component mounting device and product-type switching method 有权
    组件安装装置和产品型切换方式

    公开(公告)号:US09545045B2

    公开(公告)日:2017-01-10

    申请号:US13579717

    申请日:2011-11-29

    IPC分类号: H05K7/14 H05K13/08 H05K13/00

    摘要: In the operation execution step wherein the operation switches are clicked to execute the operation related to product-type switching, if the substrate presence/absence detecting sensors S1, S2 that detect the presence/absence of substrates in the front-side substrate transporting mechanism 11A and rear-side substrate transporting mechanism 11B detect the presence of substrates, it is judged that the manufacturing operation of the corresponding substrate type has not ended, and the input control processing is executed so that the input operation by the operation switch for executing the operation related to product-type switching is prohibited. As a result, it is possible to prevent the problems related to reloading of the mounting program before the manufacturing has ended.

    摘要翻译: 在操作执行步骤中,单击操作开关以执行与产品型切换相关的操作,如果检测前侧基板传送机构11A中的基板的存在/不存在的基板存在/不存在检测传感器S1,S2 并且后侧基板输送机构11B检测基板的存在,判断对应的基板型的制造操作尚未结束,并且执行输入控制处理,使得通过操作开关执行操作的输入操作 与产品类型切换相关是禁止的。 结果,可以防止在制造结束之前与安装程序的重新加载有关的问题。

    ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
    14.
    发明申请
    ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD 审中-公开
    电子元件安装系统和电子元件安装方法

    公开(公告)号:US20130247370A1

    公开(公告)日:2013-09-26

    申请号:US13992462

    申请日:2011-12-07

    IPC分类号: H05K13/04

    摘要: An electronic component mounting system configured by linking together a plurality of inspecting-coating machines (M1) and a plurality of electronic component mounting apparatuses (M2) to (M4), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out processing pertinent to any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the inspecting-coating machine (M1) equipped with an inspection head (15) and a coating head (16) is brought into the second operation mode.

    摘要翻译: 一种电子部件安装系统,其通过将多个检查涂布机(M1)和多个电子部件安装装置(M2)〜(M4)连接在一起而构成,所述电子部件安装装置具有第一安装通道(L1)和第二安装 车道(L2)被构造成能够执行与从使一个操作执行机构执行操作性能的第一操作模式中选择的任何一个相关的处理,同时仅将基板输送机构的基板作为对象 操作性能机构和第二操作模式,其中一个操作执行机构可以在以多个基板输送机构输送的多个基板作为目标的同时执行操作性能,并且仅仅配备有检查涂布机(M1) 具有检查头(15)和涂覆头(16)进入第二操作模式。

    COMPONENT MOUNTING METHOD
    15.
    发明申请
    COMPONENT MOUNTING METHOD 审中-公开
    组件安装方法

    公开(公告)号:US20090088888A1

    公开(公告)日:2009-04-02

    申请号:US11995166

    申请日:2006-08-07

    IPC分类号: G06F19/00 B23P19/00

    摘要: The component mounter (100) includes a component return determination apparatus (503) being a computer device for determining whether the electronic component picked up by a suction nozzle is a component to be returned to the component supply unit based on a component type. The component return determination apparatus (503) has: a data storage unit (506) into which pick-up position information (506a), the number of remaining components (506b), component return flag information (506c) are stored; a reuse judgment unit (507) which judges whether the electronic component currently picked up by the suction nozzle is the component to be returned to the component supply unit for reuse; and a component return control unit (508) which obtains pick-up position information of the picked-up component from the pick-up position information (506a) stored in the data storage unit (506) and controls an XY robot so that the component is returned to the pick-up position.

    摘要翻译: 部件安装器(100)包括作为计算机装置的部件返回确定装置(503),用于基于部件类型来确定由吸嘴吸取的电子部件是否要返回到部件供应部件的部件。 分量返回确定装置(503)具有:拾取位置信息(506a),剩余分量数(506b),分量返回标志信息(506c)被存储到的数据存储单元(506) 判断当前由吸嘴吸取的电子部件是否要返回到部件供给部用于再利用的再生判定部(507) 以及从存储在数据存储单元(506)中的拾取位置信息(506a)中获取拾取组件的拾取位置信息的组件返回控制单元(508),并控制XY机器人,使得组件 返回到拾取位置。

    COMPONENT DATA DISTRIBUTION METHOD, COMPONENT DATA DISTRIBUTION APPARATUS, AND PROGRAM THEREOF
    16.
    发明申请
    COMPONENT DATA DISTRIBUTION METHOD, COMPONENT DATA DISTRIBUTION APPARATUS, AND PROGRAM THEREOF 审中-公开
    组件数据分配方法,组件数据分发设备及其程序

    公开(公告)号:US20090077106A1

    公开(公告)日:2009-03-19

    申请号:US12297359

    申请日:2007-06-05

    IPC分类号: G06F17/30

    摘要: A component data distribution method which is executed by a server device (10) and allows distribution of component data between a plurality of terminal devices (20) when a component is mounted on a board includes: a component data collecting step of collecting component data and evaluation data indicating a degree of an operation required to achieve actual production using the component data from a first terminal device; and a component data accumulating step of accumulating the collected component data with the collected evaluation data so as to provide the collected component data for a second terminal device different from the first terminal device.

    摘要翻译: 一种由服务器装置执行并且当部件安装在电路板上时允许在多个终端装置(20)之间分配组件数据的组件数据分配方法包括:组件数据收集步骤,用于收集组件数据和 评估数据,其指示使用来自第一终端设备的组件数据来实现实际生产所需的操作程度; 以及分量数据累积步骤,利用所收集的评估数据累积所收集的分量数据,以便为不同于第一终端设备的第二终端设备提供收集的分量数据。

    DEVICE AND METHOD FOR MOUNTING PART
    17.
    发明申请
    DEVICE AND METHOD FOR MOUNTING PART 有权
    用于安装零件的装置和方法

    公开(公告)号:US20070214629A1

    公开(公告)日:2007-09-20

    申请号:US11752631

    申请日:2007-05-23

    IPC分类号: H05K13/04

    摘要: An object of the present invention is to provide a component mounting apparatus and a component mounting method in which a movement time of a nozzle can be shortened so that production efficiency can be improved. There is provided a control means for controlling movement positions and movement timings of a nozzle elevating means and a nozzle moving means. The control means stores positions and heights of obstacles located between a component supply unit and a circuit board in advance. The control means moves down a nozzle in sync with the time when the nozzle has finished passing over each obstacle after an electronic component has been photographed by a component camera. Alternatively, the control means moves the nozzle in a path to avoid the obstacles. In addition, in a component mounting region, the nozzle moves at a component mounting region movement height and the component is mounted by the nozzle moved down from the component mounting region movement height. Accordingly, it is possible to shorten an elevating stroke of the nozzle (5). In addition, the nozzle can be elevated in an arc trajectory.

    摘要翻译: 本发明的目的是提供一种可以缩短喷嘴移动时间的部件安装装置和部件安装方法,从而可以提高生产效率。 提供了一种用于控制喷嘴升降装置和喷嘴移动装置的运动位置和运动定时的控制装置。 控制装置预先存储位于元件供应单元和电路板之间的障碍物的位置和高度。 控制装置与喷嘴在通过部件相机拍摄电子部件之后已经完成通过每个障碍物的时间同步地向下移动喷嘴。 或者,控制装置使喷嘴沿路径移动以避免障碍物。 此外,在部件安装区域中,喷嘴以部件安装区域移动高度移动,并且部件通过喷嘴从部件安装区域移动高度向下移动而安装。 因此,能够缩短喷嘴(5)的升降行程。 此外,喷嘴可以以弧形轨迹升高。

    Electronic component mounting system
    19.
    发明授权
    Electronic component mounting system 有权
    电子元件安装系统

    公开(公告)号:US09474194B2

    公开(公告)日:2016-10-18

    申请号:US13992060

    申请日:2011-12-07

    IPC分类号: H05K13/04 H05K13/08

    摘要: An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M2) to (M5*), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all of a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the two electronic component mounting apparatuses (M5*) each of which is equipped with a tray feeder (30) is brought into the second operation mode.

    摘要翻译: 通过将多个具有第一安装通道(L1)和第二安装通道(L2)的电子部件安装装置(M2)连接到(M5 *)而构成的电子部件安装系统被构造成 能够执行从使一个操作性能机构的第一操作模式中选择的任何一个执行操作性能,同时仅将作为对应于操作性能机构的基板传送机构的基板作为目标,并且其中一个 操作性能机构能够以多个基板输送机构输送的多个基板作为目标,并且只有两个电子部件安装装置(M5 *)分别配备有托盘进给器(30) )进入第二操作模式。