摘要:
When performing the device type changing operation with the change of the board type to undergo mounting, the component mounting device, which has a first mounting lane and a second mounting lane and which is structured so as to be able to select either an independent mounting mode or an alternate mounting mode, moves a mounting head of the mounting lane to and thereafter positions and fixes to a previously-set predetermined withdraw position [P] where entry of a portion of a body of an operator by way of an opening (19) formed in a protective cover (18a) can be prevented and where safety of the operator is not impaired even if a mounting head of a mounting lane on the other side has undergone collision.
摘要:
In a component mounting device (1) which includes a first mounting lane (L1) and a second mounting lane (L2) and for which an independence mounting mode and an alternation mounting mode are selectable, a first limited movable area (R1A) and a first limited movable area (R1 B) in which the movements in the horizontal direction of a first mounting head (13A) and a second mounting head (13B) of the mounting lanes are permitted in the independence mounting mode, are set as areas different from second limited movable areas in the alternation mounting mode, to prevent the mounting head of the mounting lane which is continuously operating from entering into the area of the mounting lanes for which the device type changing operation is being performed.
摘要:
In the operation execution step wherein the operation switches are clicked to execute the operation related to product-type switching, if the substrate presence/absence detecting sensors S1, S2 that detect the presence/absence of substrates in the front-side substrate transporting mechanism 11A and rear-side substrate transporting mechanism 11B detect the presence of substrates, it is judged that the manufacturing operation of the corresponding substrate type has not ended, and the input control processing is executed so that the input operation by the operation switch for executing the operation related to product-type switching is prohibited. As a result, it is possible to prevent the problems related to reloading of the mounting program before the manufacturing has ended.
摘要:
An electronic component mounting system configured by linking together a plurality of inspecting-coating machines (M1) and a plurality of electronic component mounting apparatuses (M2) to (M4), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out processing pertinent to any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the inspecting-coating machine (M1) equipped with an inspection head (15) and a coating head (16) is brought into the second operation mode.
摘要:
The component mounter (100) includes a component return determination apparatus (503) being a computer device for determining whether the electronic component picked up by a suction nozzle is a component to be returned to the component supply unit based on a component type. The component return determination apparatus (503) has: a data storage unit (506) into which pick-up position information (506a), the number of remaining components (506b), component return flag information (506c) are stored; a reuse judgment unit (507) which judges whether the electronic component currently picked up by the suction nozzle is the component to be returned to the component supply unit for reuse; and a component return control unit (508) which obtains pick-up position information of the picked-up component from the pick-up position information (506a) stored in the data storage unit (506) and controls an XY robot so that the component is returned to the pick-up position.
摘要:
A component data distribution method which is executed by a server device (10) and allows distribution of component data between a plurality of terminal devices (20) when a component is mounted on a board includes: a component data collecting step of collecting component data and evaluation data indicating a degree of an operation required to achieve actual production using the component data from a first terminal device; and a component data accumulating step of accumulating the collected component data with the collected evaluation data so as to provide the collected component data for a second terminal device different from the first terminal device.
摘要:
An object of the present invention is to provide a component mounting apparatus and a component mounting method in which a movement time of a nozzle can be shortened so that production efficiency can be improved. There is provided a control means for controlling movement positions and movement timings of a nozzle elevating means and a nozzle moving means. The control means stores positions and heights of obstacles located between a component supply unit and a circuit board in advance. The control means moves down a nozzle in sync with the time when the nozzle has finished passing over each obstacle after an electronic component has been photographed by a component camera. Alternatively, the control means moves the nozzle in a path to avoid the obstacles. In addition, in a component mounting region, the nozzle moves at a component mounting region movement height and the component is mounted by the nozzle moved down from the component mounting region movement height. Accordingly, it is possible to shorten an elevating stroke of the nozzle (5). In addition, the nozzle can be elevated in an arc trajectory.
摘要:
A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.
摘要:
An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M2) to (M5*), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all of a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the two electronic component mounting apparatuses (M5*) each of which is equipped with a tray feeder (30) is brought into the second operation mode.
摘要:
A method of mounting supply components includes the step of inserting dish-like members into a base. Each dish-like member holds components. One dish-like member can stay inserted in the base while the other dish-like member is removed from the base and refilled with components.