公开(公告)号：US20190198990A1

公开(公告)日：2019-06-27

申请号：US16290137

申请日：2019-03-01

申请人： Skyworks Solutions, Inc.

发明人： Hoang Mong Nguyen ,  Anthony James LoBianco ,  Gregory Edward Babcock ,  Darren Roger Frenette ,  George Khoury ,  René Rodríguez

IPC分类号： H01Q1/52 ,  H01L21/268 ,  H01L21/027 ,  H01Q1/22 ,  H01Q9/42 ,  H01Q1/38 ,  H01L21/285 ,  H01L23/552 ,  H01L23/498 ,  H01L21/78 ,  H01L21/3205 ,  H01L23/66

摘要： Aspects of this disclosure relate to selectively shielded radio frequency modules. A radio frequency module can include a package substrate, a radio frequency component on the package substrate, a multi-layer antenna, a radio frequency shielding structure configured to provide shielding between the multi-layer antenna and the radio frequency component. The radio frequency shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.

公开(公告)号：US20190043837A1

公开(公告)日：2019-02-07

申请号：US16047446

申请日：2018-07-27

申请人： Skyworks Solutions, Inc.

发明人： Darren Roger Frenette ,  George Khoury ,  Leslie Paul Wallis

IPC分类号： H01L25/065 ,  H01L23/66 ,  H01L23/498

摘要： A packaged module for use in a wireless communication device has a substrate supporting a crystal and a first die that includes at least a microprocessor and one or more of radio frequency transmitter circuitry and radio frequency receiver circuitry. The first die is disposed between the crystal and the substrate. An overmold encloses the first die and the crystal. The substrate also supports a second die that includes at least a power amplifier for amplifying a radio frequency input signal, where the second die is disposed on an opposite side of the substrate from the first die and the crystal.

公开(公告)号：US20170301986A1

公开(公告)日：2017-10-19

申请号：US15490436

申请日：2017-04-18

申请人： Skyworks Solutions, Inc.

发明人： Hoang Mong Nguyen ,  Anthony James LoBianco ,  Gregory Edward Babcock ,  Darren Roger Frenette ,  George Khoury ,  René Rodriguez

IPC分类号： H01Q1/52 ,  H01Q1/22 ,  H01Q1/38

CPC分类号： H01Q1/526 ,  H01L21/027 ,  H01L21/268 ,  H01L21/2855 ,  H01L21/28568 ,  H01L21/32051 ,  H01L21/78 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/1421 ,  H01Q1/2283 ,  H01Q1/2291 ,  H01Q1/38 ,  H01Q9/42

摘要： Aspects of this disclosure relate to selectively shielded radio frequency modules. A radio frequency module can include a package substrate, a radio frequency component on the package substrate, a multi-layer antenna, a radio frequency shielding structure configured to provide shielding between the multi-layer antenna and the radio frequency component. The radio frequency shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.

公开(公告)号：US20170301985A1

公开(公告)日：2017-10-19

申请号：US15490346

申请日：2017-04-18

申请人： Skyworks Solutions, Inc.

发明人： Hoang Mong Nguyen ,  Anthony James LoBianco ,  Gregory Edward Babcock ,  Darren Roger Frenette ,  George Khoury

IPC分类号： H01Q1/52 ,  H01Q1/38 ,  H01Q1/22

CPC分类号： H01Q1/526 ,  H01L21/027 ,  H01L21/268 ,  H01L21/2855 ,  H01L21/28568 ,  H01L21/32051 ,  H01L21/78 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/1421 ,  H01Q1/2283 ,  H01Q1/2291 ,  H01Q1/38 ,  H01Q9/42

摘要： Aspects of this disclosure relate to selectively shielded radio frequency modules. A radio frequency module can include a package substrate, a radio frequency shielding structure extending above the package substrate, a radio frequency component over the package substrate and in an interior of the radio frequency shielding structure, and an antenna on the package substrate external to the radio frequency shielding structure. The shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.

公开(公告)号：US09768790B2

公开(公告)日：2017-09-19

申请号：US15151198

申请日：2016-05-10

申请人： Skyworks Solutions, Inc.

发明人： Ardeshir Namdar-Mehdiabadi ,  Darren Roger Frenette ,  John William Mitchell Rogers

IPC分类号： H03D3/24 ,  H03L7/197 ,  H04L7/00 ,  H03L7/093 ,  H03L7/087 ,  H03L7/099 ,  H03L7/089 ,  H04W56/00 ,  H04W88/02

CPC分类号： H03L7/1974 ,  H03L7/087 ,  H03L7/0891 ,  H03L7/0895 ,  H03L7/0898 ,  H03L7/093 ,  H03L7/099 ,  H03L7/197 ,  H03L7/1976 ,  H03L7/1978 ,  H04L7/0016 ,  H04L7/0045 ,  H04W56/0035 ,  H04W88/02

摘要： Disclosed are circuits and method for reducing or eliminating reference spurs in frequency synthesizers. In some implementations, a phase-locked loop (PLL) such as a Frac-N PLL of a frequency synthesizer can include a phase frequency detector (PFD) configured to receive a reference signal and a feedback signal. The PFD can be configured to generate a first signal representative of a phase difference between the reference signal and the feedback signal. The PLL can further include a compensation circuit configured to generate a compensation signal based on the first signal. The PLL can further includes a voltage-controlled oscillator (VCO) configured to generate an output signal based on the compensation signal. The compensation signal can include at least one feature for substantially eliminating one or more reference spurs associated with the PLL.

公开(公告)号：US11043466B2

公开(公告)日：2021-06-22

申请号：US16678154

申请日：2019-11-08

申请人： Skyworks Solutions, Inc.

发明人： Gregory Edward Babcock ,  Lori Ann DeOrio ,  Darren Roger Frenette ,  George Khoury ,  Anthony James LoBianco ,  Hoang Mong Nguyen ,  Leslie Paul Wallis

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L23/66 ,  H04B1/40 ,  H01L25/18 ,  H01L23/498 ,  H01L23/13

摘要： Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.

公开(公告)号：US20200058619A1

公开(公告)日：2020-02-20

申请号：US16555077

申请日：2019-08-29

申请人： Skyworks Solutions, Inc.

发明人： Darren Roger Frenette ,  George Khoury ,  Leslie Paul Wallis

IPC分类号： H01L25/065 ,  H01L23/66 ,  H01L23/498

摘要： A packaged module for use in a wireless communication device has a substrate supporting a crystal and a first die that includes at least a microprocessor and one or more of radio frequency transmitter circuitry and radio frequency receiver circuitry. The first die is disposed between the crystal and the substrate. An overmold encloses the first die and the crystal. The substrate also supports a second die that includes at least a power amplifier for amplifying a radio frequency input signal, where the second die is disposed on an opposite side of the substrate from the first die and the crystal.

公开(公告)号：US10548223B2

公开(公告)日：2020-01-28

申请号：US16256837

申请日：2019-01-24

申请人： Skyworks Solutions, Inc.

发明人： Darren Roger Frenette ,  George Khoury ,  Leslie Paul Wallis ,  Lori Ann DeOrio

IPC分类号： H05K1/14 ,  H05K1/18 ,  H01G4/30 ,  H03F3/195 ,  H03F3/213 ,  H03H7/06 ,  H01L25/18 ,  H01L23/31 ,  H01L23/00 ,  H01L23/66 ,  H04B1/40 ,  H01L41/053 ,  H01L25/16 ,  H01L41/047 ,  H01L41/113 ,  H03B5/32 ,  H03H1/00 ,  H03H9/05

摘要： A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.

公开(公告)号：US10515924B2

公开(公告)日：2019-12-24

申请号：US15916571

申请日：2018-03-09

申请人： Skyworks Solutions, Inc.

发明人： Gregory Edward Babcock ,  Lori Ann DeOrio ,  Darren Roger Frenette ,  George Khoury ,  Anthony James LoBianco ,  Hoang Mong Nguyen ,  Leslie Paul Wallis

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L23/66 ,  H04B1/40 ,  H01L25/18

摘要： Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.

公开(公告)号：US10320071B2

公开(公告)日：2019-06-11

申请号：US15490349

申请日：2017-04-18

申请人： Skyworks Solutions, Inc.

发明人： Hoang Mong Nguyen ,  Anthony James LoBianco ,  Gregory Edward Babcock ,  Darren Roger Frenette ,  George Khoury

IPC分类号： H01L23/552 ,  H01Q1/52 ,  H01Q1/22 ,  H01Q1/38 ,  H01L21/027 ,  H01L21/268 ,  H01L21/285 ,  H01L21/3205 ,  H01L21/78 ,  H01L23/498 ,  H01L23/66 ,  H01Q9/42 ,  H01L23/00

摘要： Aspects of this disclosure relate to methods of selectively shielded radio frequency modules. A radio frequency module can be provided with a radio frequency component and an antenna. A shielding layer can be formed over a portion of the radio frequency module such that the radio frequency component is shielded by the shielding layer and the antenna is unshielded by the shielding layer.