公开(公告)号：US20230253446A1

公开(公告)日：2023-08-10

申请号：US18012809

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Yoshihiko YANO ,  Daiki ISHII ,  Kenichi YOSHIDA ,  Yuki YAMASHITA

IPC: H01G4/33 ,  H01G4/008

CPC classification number: H01L28/75 ,  H01L28/84 ,  H01G4/008 ,  H01G4/33

Abstract: To provide a thin film capacitor having high adhesion performance with respect to a multilayer substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. A height of the first electrode layer is lower than a height of the second electrode layer. This enhances adhesion performance when the thin film capacitor is embedded in a multilayer substrate and improves ESR characteristics.

公开(公告)号：US20220085147A1

公开(公告)日：2022-03-17

申请号：US17470338

申请日：2021-09-09

Applicant: TDK CORPORATION

Inventor： Yasunori HARADA ,  Daiki ISHII ,  Yoshihiko YANO

IPC: H01L49/02

Abstract: A dielectric thin film element including a first electrode layer, a dielectric layer, and a second electrode layer located in this order from a substrate side. A relationship of 0.75≤Rsk1≤5.0 is satisfied, in which skewness of a roughness curve of the first electrode layer on the dielectric layer side is set as Rsk1.

公开(公告)号：US20210304968A1

公开(公告)日：2021-09-30

申请号：US17207212

申请日：2021-03-19

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Eiko WAKATA

IPC: H01G4/30 ,  H01G4/248 ,  H01G4/232 ,  H01G2/06

Abstract: Disclosed herein is a multilayer capacitor that includes a capacitor layer having a plurality of odd-numbered electrode layers which are positioned at odd-numbered rows and a plurality of even-numbered electrode layers which are positioned at even-numbered rows. The capacitor layer includes a first side surface to which the odd-numbered electrode layers are exposed, a second side surface to which the even-numbered electrode layers are exposed, and a first planar region. The first external terminal covers the first side surface so as to be connected to the odd-numbered electrode layers. The second external terminal covers the second side surface so as to be connected to the even-numbered electrode layers. The first external terminal covers also the first planar region and is connected to the first internal electrode layer through a first via conductor extending in a stacking direction.

公开(公告)号：US20250069814A1

公开(公告)日：2025-02-27

申请号：US18841735

申请日：2023-01-26

Applicant: TDK CORPORATION

Inventor： Miyu HASEGAWA ,  Daiki ISHII

IPC: H01G4/33 ,  H01G2/06 ,  H01G4/232

Abstract: To provide a thin film capacitor having a large capacitance. A thin film capacitor includes a metal foil having roughened main surfaces, a dielectric film covering the main surfaces, an electrode layer contacting the metal foil through an opening formed in the dielectric film and having a surface formed as a metal terminal, an electrode layer contacting the dielectric film without contacting the metal foil and having a surface formed as a metal terminal, and an electrode layer contacting the dielectric film without contacting the metal foil. The electrode layers include a conductive polymer layer contacting the dielectric film.

公开(公告)号：US20230268133A1

公开(公告)日：2023-08-24

申请号：US18012135

申请日：2020-12-24

Applicant: TDK Corporation

Inventor： Daiki ISHII ,  Yoshihiko YANO ,  Kenichi YOSHIDA ,  Tetsuhiro TAKAHASHI ,  Yuki YAMASHITA

IPC: H01G4/33 ,  H01G4/10 ,  H01G4/008 ,  H01G4/228 ,  H01G2/06

CPC classification number: H01G4/33 ,  H01G2/065 ,  H01G4/008 ,  H01G4/10 ,  H01G4/228

Abstract: To provide a thin film capacitor in which peeling-off of an electrode layer is less likely to occur. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening and further contacting the dielectric film, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, the first electrode layer contacts not only the metal foil but also the dielectric film, making peeling of the first electrode layer less likely to occur.