MULTILAYER CERAMIC CAPACITOR
    13.
    发明申请

    公开(公告)号:US20190237264A1

    公开(公告)日:2019-08-01

    申请号:US16250911

    申请日:2019-01-17

    CPC classification number: H01G4/30 H01G4/008 H01G4/1245

    Abstract: The object of the present invention is to provide the multilayer ceramic capacitor having no deterioration of dielectric properties even in case an inhibitor of an internal electrode layer is pushed out to a dielectric layer when sintering. The multilayer ceramic capacitor 1 including a capacitor element body 10 comprising a dielectric layer 2 and an internal electrode layer 3 stacked in an alternating manner, wherein when Za represents Zr concentration of an dielectric particle in a center part 6 of the dielectric layer 2 and Zb represents Zr concentration of a dielectric particle near the internal electrode layer, 0

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    17.
    发明申请

    公开(公告)号:US20200043657A1

    公开(公告)日:2020-02-06

    申请号:US16511030

    申请日:2019-07-15

    Abstract: The object of the present invention is to provide a multilayer ceramic electronic component having improved highly accelerated lifetime and specific permittivity. A multilayer ceramic electronic component comprising a multilayer body in which an internal electrode layer and a dielectric layer are stacked in alternating manner, wherein the dielectric layer comprises a dielectric ceramic composition having a main component expressed by a general formula ABO3 (A is Ba and the like, and B is Ti and the like) and a rare earth component R, a segregation phase including the rare earth component R exists in the dielectric layer, an area ratio of the segregation phases in a cross section along a stacking direction is 104 ppm to 961 ppm, and 96% or more of a total area of the segregation phases contact with the internal electrode layer.

    METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
    19.
    发明申请
    METHOD OF MANUFACTURING AN ELECTRONIC DEVICE 有权
    制造电子设备的方法

    公开(公告)号:US20140209664A1

    公开(公告)日:2014-07-31

    申请号:US13750499

    申请日:2013-01-25

    Abstract: A method of manufacturing an electronic device includes a positioning step of positioning a first member supporting a laser diode with respect to a second member having a waveguide, a bonding step of bonding the first member and the second member together, and a checking step of checking the accuracy of positioning of the first member with respect to the second member. In the positioning step, the laser diode is energized to allow laser light to be emitted, and the laser light is allowed to be incident on the incidence end of the waveguide. In the bonding step, a bonding material is melted by irradiating the first member with heating light while the laser diode is not energized. In the checking step, the laser diode is energized again.

    Abstract translation: 一种电子装置的制造方法,其特征在于,包括:定位步骤,使相对于具有波导的第二构件支撑激光二极管的第一构件,将所述第一构件和所述第二构件接合在一起的接合工序;以及检查步骤 第一构件相对于第二构件的定位精度。 在定位步骤中,对激光二极管通电以允许发射激光,并允许激光入射到波导的入射端。 在接合步骤中,当激光二极管未通电时,通过用加热光照射第一构件来熔化接合材料。 在检查步骤中,激光二极管再次通电。

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