公开(公告)号：US20190043655A1

公开(公告)日：2019-02-07

申请号：US16046563

申请日：2018-07-26

Applicant: TDK CORPORATION

Inventor： Hajime KATO ,  Yuto SHIGA ,  Kazuya TOBITA ,  Youichi KAZUTA ,  Yuya ISHIMA ,  Satoru OKAMOTO ,  Shunji AOKI

IPC: H01F27/28

Abstract: A laminated coil component includes an element body, a coil, and a pair of conductors. The pair of conductors is disposed on the element body. Each of the pair of conductors has an L shape when viewed from the third direction. Each of the pair of conductors includes a first conductor portion and a second conductor portion. The first conductor portion is disposed on one of first side faces. The second conductor portion is disposed on a pair of end faces. The coil includes a first coil portion and a second coil portion. The first coil portion includes a first straight portion and a pair of second straight portions. The pair of second straight portions is connected to both ends of the first straight portion. The second coil portion is curved as a whole.

公开(公告)号：US20190006084A1

公开(公告)日：2019-01-03

申请号：US16021983

申请日：2018-06-28

Applicant: TDK CORPORATION

Inventor： Yuto SHIGA ,  Hajime KATO ,  Kazuya TOBITA ,  Youichi KAZUTA ,  Yuya ISHIMA ,  Satoru OKAMOTO ,  Shunji AOKI

IPC: H01F27/28 ,  H01F27/29

Abstract: A laminated electronic component includes an element body and a conductor. The element body is formed by laminating a plurality of element-body layers. The element body has a first face, a second face, and a pair of third faces. The conductor is disposed on the element body and has an L shape. The conductor has an exposed face exposed on the first face and the second face. The exposed face includes a plurality of divided regions divided by the element body. The length of each divided region in a dividing direction is longer than a distance with which the plurality of divided regions is separated from each other and longer than a distance with which the exposed face and the pair of third faces are separated from each other.

公开(公告)号：US20180342341A1

公开(公告)日：2018-11-29

申请号：US15988101

申请日：2018-05-24

Applicant: TDK CORPORATION

Inventor： Shunji AOKI ,  Yuya ISHIMA ,  Hajime KATO ,  Yuto SHIGA ,  Kazuya TOBITA ,  Youichi KAZUTA ,  Satoru OKAMOTO

IPC: H01F17/00 ,  H01G4/30 ,  H01F27/29 ,  H01G4/12

Abstract: A laminated electronic component includes an element body and a pair of conductors. The element body is formed by laminating a plurality of element-body layers in a first direction. The pair of conductors is formed by laminating a plurality of conductor layers in the first direction. The pair of conductors is provided to the element body in such a way as to be separated from each other in a second direction orthogonal to the first direction. At a cross section orthogonal to the first direction, the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors.

公开(公告)号：US20180240591A1

公开(公告)日：2018-08-23

申请号：US15892784

申请日：2018-02-09

Applicant: TDK CORPORATION

Inventor： Yuya ISHIMA ,  Yasushi MATSUYAMA ,  Yuto SHIGA ,  Shunji AOKI ,  Shinichi KONDO

IPC: H01F41/04 ,  H01F27/28 ,  H01F27/32

CPC classification number: H01F41/04 ,  H01F17/0013 ,  H01F27/28 ,  H01F27/292 ,  H01F27/323

Abstract: An electronic component includes an element provided with a first recess, and a mounting conductor including a first conductor portion disposed in the first recess. The first conductor portion has a first face opposed to a bottom face of the first recess, a second face opposed to the first face, and a third face connecting the first face and the second face. The third face has a region overlapping with the second face as viewed from an opposing direction of the bottom face of the first recess and the first face.

公开(公告)号：US20180233262A1

公开(公告)日：2018-08-16

申请号：US15895567

申请日：2018-02-13

Applicant: TDK CORPORATION

Inventor： Yuusuke NAGAI ,  Takashi SUZUKI ,  Kouichi KAKUDA ,  Kunihiko KAWASAKI ,  Shinichi KONDO ,  Yuya ISHIMA ,  Shinichi SATO ,  Masaki TAKAHASHI ,  Takashi ENDO

IPC: H01F17/00 ,  H01F27/29

Abstract: In a multilayer coil component, an end of a lower coil layer and an end of a connecting part are directly overlapped, and the end of the lower coil layer includes a contact edge positioned on a side of the connecting part and being in contact with the connecting part and a non-contact edge positioned on a side opposite to the connecting part and not being in contact with the connecting part. Then, the contact edge and the non-contact edge are not overlapped when viewed from a laminated direction. Consequently, a propagation distance of a crack becomes longer as compared with the case where an end face is parallel to the laminated direction, effectively suppressing advance of the crack. Suppressed advance of a crack in this manner makes the multilayer coil component provide a high component strength as a whole.

公开(公告)号：US20240242883A1

公开(公告)日：2024-07-18

申请号：US18410188

申请日：2024-01-11

Applicant: TDK Corporation

Inventor： Yuya ISHIMA ,  Kenji KOMORITA ,  Shingo HATTORI ,  Yoji TOZAWA ,  Masaki TAKAHASHI ,  Hidenobu UMEDA ,  Yusuke NAGAI ,  Akihiko OIDE

IPC: H01F41/076 ,  H01F41/12

CPC classification number: H01F41/076 ,  H01F41/122

Abstract: A method for manufacturing a coil component including an element body, and a coil disposed inside the element body and including a first coil conductor and a second coil conductor having different shapes, the method comprises: applying a first photosensitive conductive paste on a substrate and exposing the first photosensitive conductive paste to light with a pattern corresponding to the first coil conductor to form a first curing pattern; after the forming of the first curing pattern, applying a second photosensitive conductive paste on the first photosensitive conductive paste and exposing the second photosensitive conductive paste to light with a pattern corresponding to the second coil conductor to form a second curing pattern; after the forming of the second curing pattern, developing portions of the first photosensitive conductive paste and the second photosensitive conductive paste that were not exposed; and after the developing, adding an insulating material on the substrate.

公开(公告)号：US20230230742A1

公开(公告)日：2023-07-20

申请号：US18085983

申请日：2022-12-21

Applicant: TDK CORPORATION

Inventor： Yusuke NAGAI ,  Kazuhiro EBINA ,  Kunihiko KAWASAKI ,  Shinichi KONDO ,  Yuya ISHIMA ,  Shinichi SATO ,  Seiichi NAKAGAWA ,  Kosuke ITO ,  Keito YASUDA ,  Youhei IIDA

IPC: H01F17/00 ,  H01F27/29 ,  H01F27/02 ,  H01F1/36

CPC classification number: H01F17/0013 ,  H01F27/292 ,  H01F27/022 ,  H01F1/36

Abstract: A multilayer coil component includes an element body including an end surface, a coil disposed in the element body, and an external electrode disposed on an end portion of the element body and connected to the coil. The external electrode includes a conductive resin layer. The conductive resin layer includes resin and a plurality of metal particles and is in contact with the end surface. The conductive resin layer includes a metal particle group. The metal particle group consists a plurality of first metal particles included in the plurality of metal particles, and the plurality of first metal particles is adjacent to the end surface and separated from the end surface.

公开(公告)号：US20230215616A1

公开(公告)日：2023-07-06

申请号：US18090240

申请日：2022-12-28

Applicant: TDK CORPORATION

Inventor： Yusuke NAGAI ,  Kazuhiro EBINA ,  Kunihiko KAWASAKI ,  Shinichi KONDO ,  Yuya ISHIMA ,  Shinichi SATO ,  Kosuke ITO

IPC: H01F27/29 ,  H01F17/00 ,  H01F1/24

CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F1/24

Abstract: A coil component includes: an element body; a coil including a plurality of coil conductors disposed in the element body and electrically connected to each other; an external electrode disposed on the element body; and a connection conductor that connects the coil and the external electrode. The connection conductor has an end portion exposed from an outer surface of the element body and connected to the external electrode. The end portion has a shape extending outward over an entire circumference.

公开(公告)号：US20220277879A1

公开(公告)日：2022-09-01

申请号：US17666170

申请日：2022-02-07

Applicant: TDK CORPORATION

Inventor： Yusuke NAGAI ,  Hidekazu SATO ,  Kazuhiro EBINA ,  Kunihiko KAWASAKI ,  Takahiro SATO ,  Kouichi KAKUDA ,  Yuya ISHIMA ,  Shinichi KONDO ,  Shinichi SATO ,  Masaki TAKAHASHI

IPC: H01F17/00 ,  H01F27/29

Abstract: In a multilayer coil component, first and second conductor patterns respectively have parallel parts that overlap in a lamination direction and non-parallel parts that do not overlap. The parallel parts of the first and second conductor patterns of one set are interconnected by a first through hole. The non-parallel parts of the first and second conductor patterns of sets adjacent to each other in the lamination direction are interconnected by a second through hole.

公开(公告)号：US20210074474A1

公开(公告)日：2021-03-11

申请号：US17010427

申请日：2020-09-02

Applicant: TDK CORPORATION

Inventor： Yuya ISHIMA ,  Shinichi KONDO ,  Kosuke ITO ,  Shingo HATTORI

IPC: H01F41/04 ,  H01F17/00 ,  H01F27/29 ,  H05K3/46 ,  H05K1/16

Abstract: A method for manufacturing an electronic-component includes a step of forming a laminate substrate including a plurality of laminates disposed in a direction intersecting with a lamination direction via a division portion by laminating a plurality of insulator layers, and a step of singulating the plurality of laminates by removing the division portion. The step of forming the laminate substrate includes a step of forming an insulator resist layer containing an insulating material on a base material, the insulating material being a constituent material of each of the insulator layers and a step of forming the insulator layer by curing the insulator resist layer by exposure, except for at least an insulator resist portion corresponding to the division portion. The division portion including the insulator resist portion is removed by development in the step of singulating.