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11.Materials for and methods of manufacturing semiconductor devices 失效
Title translation: 材料和制造半导体器件的方法公开(公告)号:US3076253A
公开(公告)日:1963-02-05
申请号:US49347855
申请日:1955-03-10
Applicant: TEXAS INSTRUMENTS INC
Inventor: BOYD CORNELISON , JONES MORTON E , LINEBACK JAMES T , WOLFF JR ELMER A , BARCUS JR SAMUEL W , HORAK FRANK A , INCE NORMAN S
IPC: B23K35/30 , H01L21/00 , H01L23/488 , H01L23/495
CPC classification number: H01L24/93 , B23K35/3013 , H01L21/00 , H01L23/488 , H01L23/49562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/3011 , Y10T29/49169
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公开(公告)号:US2990501A
公开(公告)日:1961-06-27
申请号:US74770658
申请日:1958-07-10
Applicant: TEXAS INSTRUMENTS INC
Inventor: BOYD CORNELISON , EDDLESTON JAMES H , EVANS ARTHUR D , SHEPHERD JR MARK , TRENT ROBERT L , WOLFF JR ELMER A
CPC classification number: H05K3/306 , H01L23/041 , H01L2924/09701 , H01L2924/16152 , H05K2201/09127 , H05K2201/09954 , H05K2201/2036 , Y10T29/49121 , Y10T29/49139
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公开(公告)号:US2966720A
公开(公告)日:1961-01-03
申请号:US79841759
申请日:1959-03-10
Applicant: TEXAS INSTRUMENTS INC
Inventor: BOYD CORNELISON , WOLFF JR ELMER A
IPC: H01L21/00 , H01L21/24 , H01L21/302 , H01L21/304 , H01L29/02 , H01L29/06 , H01L29/73
CPC classification number: H01L29/06 , H01L21/00 , H01L21/24 , H01L21/302 , H01L21/304 , H01L29/02 , H01L29/73
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公开(公告)号:US2958021A
公开(公告)日:1960-10-25
申请号:US73039758
申请日:1958-04-23
Applicant: TEXAS INSTRUMENTS INC
Inventor: BOYD CORNELISON , WOLFF JR ELMER A
IPC: F28D15/02 , H01L23/427
CPC classification number: F28D15/02 , H01L23/427 , H01L24/01
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