Abstract:
The disclosure relates to a method of forming a resistive film on a substrate formed of a metal having a coating of a ceramic oxide of the metal by the controlled heating and/or application of oxygen to the film producing system. Chromium is heated in a reduced pressure air atmosphere, containing the normal ratio of oxygen found in air, to a temperature at which the chromium will atomize. The chromium, which is electrically conductive and has a positive temperature coefficient of resistance, along with a chromium sub-oxide which is somewhat electrically conductive and has a negative temperature coefficient of resistance will deposit on ceramic substrates which are being continually rotated within a tumbler or the like within the partially evacuated system. The chromium sub-oxide along with small amounts of chromium will deposit on the ceramic with the ratio of chromium sub-oxide to chromium metal continually changing in favor of the metal as the oxygen in the atmosphere is used up. At a more elevated temperature, mainly chromium will deposit as the metal on the ceramic substrate after the oxygen has been substantially depleted. The amount of chromium metal deposited on the substrate is controlled by the temperature to which the chromium is heated as well as the length of time at which the chromium is above the temperature required for deposition thereof onto the ceramic substrate. In accordance with another embodiment, the amount of oxygen in the evacuated area can be controlled from an external source to control the amount of chromium sub-oxide which can be deposited upon the ceramic substrate. Also disclosed is the meta substrate having the ceramic oxide of the metal thereon. Aluminum with an anodized outer surface is specifically set forth. In addition, a flexible ceramic substrate is disclosed for use in the procedure for forming resistive coatings.