公开(公告)号：US12198982B2

公开(公告)日：2025-01-14

申请号：US17960568

申请日：2022-10-05

Applicant: Texas Instruments Incorporated

Inventor： Michael Todd Wyant ,  Dave Charles Stepniak ,  Matthew John Sherbin ,  Sada Hiroyuki ,  Shoichi Iriguchi ,  Genki Yano

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/67 ,  H01L21/683 ,  H01L23/58

Abstract: In a described example, a method includes: applying a dicing tape over a metal layer covering a portion of a surface of scribe streets on a device side of a semiconductor wafer that includes semiconductor device dies formed thereon separated from one another by the scribe streets; and placing the semiconductor wafer with the device side facing away from a laser in a stealth dicing machine. A power of a laser beam is adjusted to a first power level. The laser beam is focused through the non-device side of the semiconductor wafer to a first focal depth in the metal layer. The laser beam scans across the scribe streets and ablates the metal layer in the scribe streets. The method continues by singulating the semiconductor device dies using stealth dicing along the scribe streets in the stealth dicing machine.

公开(公告)号：US11664276B2

公开(公告)日：2023-05-30

申请号：US16205692

申请日：2018-11-30

Applicant: Texas Instruments Incorporated

Inventor： Matthew John Sherbin ,  Michael Todd Wyant ,  Christopher Daniel Manack ,  Hiroyuki Sada ,  Shoichi Iriguchi ,  Genki Yano ,  Ming Zhu ,  Joseph O. Liu

IPC: H01L23/544 ,  H01L21/78 ,  B23K26/364 ,  H01L23/00 ,  H01L21/268

CPC classification number: H01L21/78 ,  B23K26/364 ,  H01L21/268 ,  H01L23/562

Abstract: A semiconductor die includes a substrate having a semiconductor surface layer bon a front side with active circuitry including at last one transistor therein and a back side. The sidewall edges of the semiconductor die have at least one damage region pair including an angled damage feature region relative to a surface normal of the semiconductor die that is above a damage region that is more normal to the surface normal of the die as compared to the angled damage feature region.

公开(公告)号：US11482442B2

公开(公告)日：2022-10-25

申请号：US17184553

申请日：2021-02-24

Applicant: Texas Instruments Incorporated

Inventor： Matthew John Sherbin ,  Michael Todd Wyant ,  Dave Charles Stepniak ,  Sada Hiroyuki ,  Shoichi Iriguchi ,  Genki Yano

IPC: H01L21/683 ,  H01L21/687

Abstract: A subring for holding tape connected to semiconductor dies and spanning a passage in a frame having a first diameter includes a base. An opening extends through the base and has a second diameter at least as large as the first diameter. A projection extends from the base to ends positioned on opposite sides of the base. The projection is adapted to clamp the tape to the frame and adapted to prevent relative movement between the tape, the subring, and the frame.

公开(公告)号：US20210183683A1

公开(公告)日：2021-06-17

申请号：US17184553

申请日：2021-02-24

Applicant: Texas Instruments Incorporated

Inventor： Matthew John Sherbin ,  Michael Todd Wyant ,  Dave Charles Stepniak ,  Sada Hiroyuki ,  Shoichi Iriguchi ,  Genki Yano

IPC: H01L21/683 ,  H01L21/687

Abstract: A subring for holding tape connected to semiconductor dies and spanning a passage in a frame having a first diameter includes a base. An opening extends through the base and has a second diameter at least as large as the first diameter. A projection extends from the base to ends positioned on opposite sides of the base. The projection is adapted to clamp the tape to the frame and adapted to prevent relative movement between the tape, the subring, and the frame.

公开(公告)号：US10763230B2

公开(公告)日：2020-09-01

申请号：US16228962

申请日：2018-12-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hiroyuki Sada ,  Shoichi Iriguchi ,  Genki Yano ,  Luu Thanh Nguyen ,  Ashok Prabhu ,  Anindya Poddar ,  Yi Yan ,  Hau Nguyen

IPC: H01L21/78 ,  H01L21/683 ,  H01L23/00 ,  H01L23/495

Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.

公开(公告)号：US10658240B1

公开(公告)日：2020-05-19

申请号：US16291995

申请日：2019-03-04

Applicant: Texas Instruments Incorporated

Inventor： Shoichi Iriguchi ,  Hiroyuki Sada ,  Genki Yano

IPC: H01L21/78 ,  H01L21/683 ,  H01L23/00 ,  H01L21/56 ,  B23K26/364 ,  B23K101/40

Abstract: In a described example, a method includes: forming stress induced dislocations along scribe lanes between semiconductor dies on a semiconductor wafer using a laser; mounting a first side of the semiconductor wafer on the first side of a first dicing tape; removing a backgrinding tape from the semiconductor wafer; attaching a second dicing tape to a second side of the semiconductor wafer opposite the first side, the second dicing tape adhering to portions of the first dicing tape that are spaced from the semiconductor wafer, forming a dual taped wafer dicing assembly; separating the semiconductor dies by stretching the first dicing tape and stretching the second dicing tape; removing the second dicing tape from the semiconductor dies; and removing the semiconductor dies from the first dicing tape.

公开(公告)号：US11498831B2

公开(公告)日：2022-11-15

申请号：US16941138

申请日：2020-07-28

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/31 ,  H01L23/495

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US11469141B2

公开(公告)日：2022-10-11

申请号：US16057126

申请日：2018-08-07

Applicant: Texas Instruments Incorporated

Inventor： Michael Todd Wyant ,  Dave Charles Stepniak ,  Matthew John Sherbin ,  Sada Hiroyuki ,  Shoichi Iriguchi ,  Genki Yano

IPC: H01L21/78 ,  H01L23/58 ,  H01L21/683 ,  H01L21/67 ,  H01L21/268

Abstract: In a described example, a method includes: applying a dicing tape over a metal layer covering a portion of a surface of scribe streets on a device side of a semiconductor wafer that includes semiconductor device dies formed thereon separated from one another by the scribe streets; and placing the semiconductor wafer with the device side facing away from a laser in a stealth dicing machine. A power of a laser beam is adjusted to a first power level. The laser beam is focused through the non-device side of the semiconductor wafer to a first focal depth in the metal layer. The laser beam scans across the scribe streets and ablates the metal layer in the scribe streets. The method continues by singulating the semiconductor device dies using stealth dicing along the scribe streets in the stealth dicing machine.

公开(公告)号：US11171031B2

公开(公告)日：2021-11-09

申请号：US16041888

申请日：2018-07-23

Applicant: Texas Instruments Incorporated

Inventor： Matthew John Sherbin ,  Michael Todd Wyant ,  Dave Charles Stepniak ,  Hiroyuki Sada ,  Shoichi Iriguchi ,  Genki Yano

IPC: H01L21/683 ,  B28D5/00 ,  H01L21/78 ,  H01L21/687

Abstract: A die matrix expander includes a subring including ≥3 pieces, and a wafer frame supporting a dicing tape having an indentation for receiving pieces of the subring. The subring prior to expansion sits below a level of the wafer frame and has an outer diameter

公开(公告)号：US10723616B2

公开(公告)日：2020-07-28

申请号：US16266227

申请日：2019-02-04

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81B1/00 ,  H01L23/31 ,  B81C1/00 ,  H01L23/495

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.