公开(公告)号：US20190206770A1

公开(公告)日：2019-07-04

申请号：US15858643

申请日：2017-12-29

Applicant: Texas Instruments Incorporated

Inventor： Bin Abdul Aziz Anis Fauzi ,  Wei Fen Sueann Lim ,  Lee Han Meng@Eugene Lee

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49555 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49503 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2924/14 ,  H01L2924/35121

Abstract: In a described example, a packaged integrated circuit (IC) includes a lead frame with a lead and with an IC chip mount pad. A portion of the lead adjacent to the IC chip mount pad is mechanically deformed to form a lead lock. An integrated circuit chip is mounted on a first side of the IC chip mount pad; and the integrated circuit chip, the IC chip mount pad, and the portion are covered in molding compound.

公开(公告)号：US20170358523A1

公开(公告)日：2017-12-14

申请号：US15688227

申请日：2017-08-28

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@Eugene Lee ,  Anis Fauzi bin Abdul Aziz ,  Wei Fen Sueann Lim

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/78 ,  H01L21/48

CPC classification number: H01L23/49565 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49551 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A leadframe strip for use in making leaded integrated circuit packages includes a plurality of integrally connected leadframes that each have a die attach pad and first and second dam bars located adjacent to opposite first and second sides of the die attach pad, respectively. A plurality of continuous lead structures extend, uninterrupted by other structure, between opposing ones of the dam bars of horizontally adjacent leadframes. The plurality of integrally connected leadframes are arranged in a plurality of vertical columns, wherein die attach pads in one vertical column are vertically offset from die attach pads in adjacent vertical columns.

公开(公告)号：US20170345743A1

公开(公告)日：2017-11-30

申请号：US15680499

申请日：2017-08-18

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@Eugene Lee ,  Anis Fauzi bin Abdul Aziz ,  Wei Fen Sueann Lim

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/78 ,  H01L21/48

Abstract: A leadframe strip for use in making leaded integrated circuit packages includes a plurality of integrally connected leadframes that each have a die attach pad and first and second dam bars located adjacent to opposite first and second sides of the die attach pad, respectively. A plurality of continuous lead structures extend, uninterrupted by other structure, between opposing ones of the dam bars of horizontally adjacent leadframes. The plurality of integrally connected leadframes are arranged in a plurality of vertical columns, wherein die attach pads in one vertical column are vertically offset from die attach pads in adjacent vertical columns.

公开(公告)号：US10784190B2

公开(公告)日：2020-09-22

申请号：US15680499

申请日：2017-08-18

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@Eugene Lee ,  Anis Fauzi bin Abdul Aziz ,  Wei Fen Sueann Lim

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A leadframe strip for use in making leaded integrated circuit packages includes a plurality of integrally connected leadframes that each have a die attach pad and first and second dam bars located adjacent to opposite first and second sides of the die attach pad, respectively. A plurality of continuous lead structures extend, uninterrupted by other structure, between opposing ones of the dam bars of horizontally adjacent leadframes. The plurality of integrally connected leadframes are arranged in a plurality of vertical columns, wherein die attach pads in one vertical column are vertically offset from die attach pads in adjacent vertical columns.

公开(公告)号：US20200235042A1

公开(公告)日：2020-07-23

申请号：US16254853

申请日：2019-01-23

Applicant: Texas Instruments Incorporated

Inventor： Anis Fauzi Bin Abdul Aziz ,  Lee Han Meng@Eugene Lee ,  Wei Fen Sueann Lim ,  Siew Kee Lee

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56

Abstract: An electronic device, a lead frame, and a method, including providing a lead frame with a Y-shaped feature having branch portions connected to a dam bar in a prospective gap in an equally spaced repeating lead pitch pattern, and a set of first leads extending parallel to one another along a first direction and spaced apart from one another along a second direction in lead locations of the repeating lead pitch pattern, attaching a semiconductor die to a die attach pad of the lead frame, attaching bond wires between bond pads of the semiconductor die, and the first leads, enclosing first portions of the first leads, the die attach pad, and a portion of the semiconductor die in a package structure, and performing a dam bar cut process that cuts through portions of the dam bar between the lead locations of the repeating lead pitch pattern.

公开(公告)号：US09741643B2

公开(公告)日：2017-08-22

申请号：US15004208

申请日：2016-01-22

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@Eugene Lee ,  Anis Fauzi bin Abdul Aziz ,  Sueann Lim Wei Fen

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L23/49565 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49551 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A leadframe strip for use in making leaded integrated circuit packages includes a plurality of integrally connected leadframes that each have a die attach pad and first and second dam bars located adjacent to opposite first and second sides of the die attach pad, respectively. A plurality of continuous lead structures extend, uninterrupted by other structure, between opposing ones of the dam bars of horizontally adjacent leadframes. The plurality of integrally connected leadframes are arranged in a plurality of vertical columns, wherein die attach pads in one vertical column are vertically offset from die attach pads in adjacent vertical columns.

公开(公告)号：US20170213784A1

公开(公告)日：2017-07-27

申请号：US15004208

申请日：2016-01-22

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@Eugene Lee ,  Anis Fauzi bin Abdul Aziz ,  Sueann Lim Wei Fen

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/78 ,  H01L21/48

CPC classification number: H01L23/49565 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49551 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A leadframe strip for use in making leaded integrated circuit packages includes a plurality of integrally connected leadframes that each have a die attach pad and first and second dam bars located adjacent to opposite first and second sides of the die attach pad, respectively. A plurality of continuous lead structures extend, uninterrupted by other structure, between opposing ones of the dam bars of horizontally adjacent leadframes. The plurality of integrally connected leadframes are arranged in a plurality of vertical columns, wherein die attach pads in one vertical column are vertically offset from die attach pads in adjacent vertical columns.

公开(公告)号：US08884414B2

公开(公告)日：2014-11-11

申请号：US13737697

申请日：2013-01-09

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@Eugene Lee ,  Anis Fauzi bin Abdul Aziz ,  Susan Goh Geok Ling ,  Ng Swee Tiang

IPC: H01L23/495 ,  H01L23/34 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L21/56 ,  H01L21/565 ,  H01L21/82 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49551 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/80 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/08245 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/73251 ,  H01L2224/80904 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/92222 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/80 ,  H01L2224/16 ,  H01L2224/08 ,  H01L2924/00

Abstract: An integrated circuit module including a generally flat die attachment pad (DAP) positioned substantially in a first plane; and a generally flat lead bar positioned substantially in a second plane above and parallel to said first plane and having at least one downwardly and outwardly extending lead bar lead projecting therefrom and terminating substantially in the first plane; a top leadframe having a plurality of generally flat contact pads positioned substantially in a third plane above and parallel to the second plane and a plurality of leads having proximal end portions connected to the pad portions and having downwardly and outwardly extending distal end portions terminating substantially in said first plane; an IC die connected to the top leadframe, and the DAP; and encapsulation material encapsulating at least portions of the DAP, the lead bar, the top lead frame, and the IC die.

Abstract translation: 一种集成电路模块，包括基本上位于第一平面中的大致平坦的芯片附接焊盘（DAP）; 以及大致平坦的引线条，其基本上位于第二平面的上方并平行于所述第一平面，并且具有至少一个向下和向外延伸的引导杆引线，其从所述第一平面突出并基本上终止在所述第一平面内; 顶部引线框架具有多个基本上平坦的接触焊盘，其基本上位于第三平面中并且平行于第二平面，并且多个引线具有连接到焊盘部分的近端部分，并且具有向下和向外延伸的远端部分，其基本上终止于 第一架飞机 连接到顶部引线框架的IC管芯和DAP; 以及封装材料，其封装DAP，引线条，顶部引线框架和IC管芯的至少一部分。

公开(公告)号：US11791170B2

公开(公告)日：2023-10-17

申请号：US17238151

申请日：2021-04-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Anis Fauzi Bin Abdul Aziz ,  Chong Han Lim ,  Lee Han Meng@Eugene Lee ,  Wei Fen Sueann Lim

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/495 ,  H01L23/31 ,  B29C45/14 ,  B29C33/44 ,  B29C33/00

CPC classification number: H01L21/565 ,  B29C33/0022 ,  B29C33/44 ,  B29C45/14467 ,  H01L21/4821 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49555 ,  H01L2924/1815

Abstract: A method of making semiconductor packages includes providing a first lead frame having a first plurality of semiconductor dies arranged along a first longitudinal axis, each of the first plurality of semiconductor dies having a first number of metal contacts; providing a second lead frame having a second plurality of semiconductor dies arranged along a second longitudinal axis, each of the second plurality of semiconductor dies having a second number of metal contacts, the second number of metal contacts different than the first number of metal contacts; and covering the first plurality of semiconductor dies in a first mold using a common semiconductor die cavity; covering the second plurality of semiconductor dies in a second mold using the common semiconductor die cavity.

公开(公告)号：US11569152B2

公开(公告)日：2023-01-31

申请号：US16254853

申请日：2019-01-23

Applicant: Texas Instruments Incorporated

Inventor： Anis Fauzi Bin Abdul Aziz ,  Lee Han Meng@Eugene Lee ,  Wei Fen Sueann Lim ,  Siew Kee Lee

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31

Abstract: An electronic device, a lead frame, and a method, including providing a lead frame with a Y-shaped feature having branch portions connected to a dam bar in a prospective gap in an equally spaced repeating lead pitch pattern, and a set of first leads extending parallel to one another along a first direction and spaced apart from one another along a second direction in lead locations of the repeating lead pitch pattern, attaching a semiconductor die to a die attach pad of the lead frame, attaching bond wires between bond pads of the semiconductor die, and the first leads, enclosing first portions of the first leads, the die attach pad, and a portion of the semiconductor die in a package structure, and performing a dam bar cut process that cuts through portions of the dam bar between the lead locations of the repeating lead pitch pattern.