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公开(公告)号：US11056462B2
公开(公告)日：2021-07-06
申请号：US15645272
申请日：2017-07-10
IPC分类号： H05K1/11 , H05K1/18 , H01L23/00 , H01L23/495
摘要： A method of assembling a flip chip on a leadframe package. A locking dual leadframe (LDLF) includes a top metal frame portion including protruding features and a die pad and a bottom metal frame portion having apertures positioned lateral to the die pad. The protruding features and apertures are similarly sized and alignable. A flipped integrated circuit (IC) die having a bottomside and a topside including circuitry connected to bond pads having solder balls on the bond pads is mounted with its topside onto the top metal frame portion. The top metal frame portion is aligned to the bottom metal frame portion so that the protruding features are aligned to the apertures. The bottomside of the IC die is pressed with respect to a top surface of the bottom frame portion, wherein the protruding features penetrate into the apertures.
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公开(公告)号：US20210005540A1
公开(公告)日：2021-01-07
申请号：US17028843
申请日：2020-09-22
IPC分类号： H01L23/495 , H01L21/48 , H01L21/56 , H01L21/78
摘要： A leadframe strip for use in making leaded integrated circuit packages includes a plurality of integrally connected leadframes that each have a die attach pad and first and second dam bars located adjacent to opposite first and second sides of the die attach pad, respectively. A plurality of continuous lead structures extend, uninterrupted by other structure, between opposing ones of the dam bars of horizontally adjacent leadframes. The plurality of integrally connected leadframes are arranged in a plurality of vertical columns, wherein die attach pads in one vertical column are vertically offset from die attach pads in adjacent vertical columns.
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公开(公告)号：US10541225B2
公开(公告)日：2020-01-21
申请号：US15674983
申请日：2017-08-11
IPC分类号： H01R43/00 , H01L23/00 , H01L23/495
摘要： A method of assembling a flip chip on a leadframe package. A locking dual leadframe (LDLF) includes a top metal frame portion including protruding features and a die pad and a bottom metal frame portion having apertures positioned lateral to the die pad. The protruding features and apertures are similarly sized and alignable. A flipped integrated circuit (IC) die having a bottomside and a topside including circuitry connected to bond pads having solder balls on the bond pads is mounted with its topside onto the top metal frame portion. The top metal frame portion is aligned to the bottom metal frame portion so that the protruding features are aligned to the apertures. The bottomside of the IC die is pressed with respect to a top surface of the bottom frame portion, wherein the protruding features penetrate into the apertures.
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4.发明授权公开(公告)号：US11742263B2
公开(公告)日：2023-08-29
申请号：US16953189
申请日：2020-11-19
CPC分类号： H01L23/49551 , H01L21/4842 , H01L21/565 , H01L21/78 , H01L23/3114 , H01L23/49503 , H01L23/49537 , H01L23/49555 , H01L23/49568 , H10K71/00 , H01L23/49586 , H01L23/49589 , H01L2224/97
摘要： A leadframe for electronic systems comprising a first sub-leadframe connected by links to a second sub-leadframe, the first and second sub-leadframe connected by tiebars to a frame; and each link having a neck suitable for bending the link, the necks arrayed in a line operable as the axis for bending the second sub-leadframe towards the first sub-leadframe with the necks operable as rotation pivots.
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公开(公告)号：US10784190B2
公开(公告)日：2020-09-22
申请号：US15680499
申请日：2017-08-18
IPC分类号： H01L23/495 , H01L21/48 , H01L21/56 , H01L21/78
摘要： A leadframe strip for use in making leaded integrated circuit packages includes a plurality of integrally connected leadframes that each have a die attach pad and first and second dam bars located adjacent to opposite first and second sides of the die attach pad, respectively. A plurality of continuous lead structures extend, uninterrupted by other structure, between opposing ones of the dam bars of horizontally adjacent leadframes. The plurality of integrally connected leadframes are arranged in a plurality of vertical columns, wherein die attach pads in one vertical column are vertically offset from die attach pads in adjacent vertical columns.
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公开(公告)号：US20200235042A1
公开(公告)日：2020-07-23
申请号：US16254853
申请日：2019-01-23
IPC分类号： H01L23/495 , H01L23/31 , H01L21/56
摘要： An electronic device, a lead frame, and a method, including providing a lead frame with a Y-shaped feature having branch portions connected to a dam bar in a prospective gap in an equally spaced repeating lead pitch pattern, and a set of first leads extending parallel to one another along a first direction and spaced apart from one another along a second direction in lead locations of the repeating lead pitch pattern, attaching a semiconductor die to a die attach pad of the lead frame, attaching bond wires between bond pads of the semiconductor die, and the first leads, enclosing first portions of the first leads, the die attach pad, and a portion of the semiconductor die in a package structure, and performing a dam bar cut process that cuts through portions of the dam bar between the lead locations of the repeating lead pitch pattern.
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公开(公告)号：US11626350B2
公开(公告)日：2023-04-11
申请号：US16839216
申请日：2020-04-03
发明人： Chong Han Lim , Lee Han Meng@Eugene Lee , Anis Fauzi Bin Abdul Aziz , Wei Fen Sueann Lim , Siew Kee Lee
IPC分类号： H01L23/495 , H01L21/56 , H01L21/78 , H01L23/31 , H01L21/00 , H01L25/075 , H01L21/60
摘要： A method includes forming a leadframe assembly to have a pair of opposing sides, and having semiconductor die receiving portions extending between the opposing sides. The method also includes placing semiconductor dies on the leadframe assembly in the die receiving portions. Each die has a row of leads on each of two opposing sides of the die and a longitudinal axis parallel to the rows of leads. The longitudinal axis of each die is orthogonal to the opposing sides of the leadframe assembly. The method further includes applying mold compound to the semiconductor dies. The method includes punching through the leadframe assembly between the opposing sides using a first tool having a first tool longitudinal axis parallel to longitudinal axes of the dies.
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公开(公告)号：US11502045B2
公开(公告)日：2022-11-15
申请号：US16254718
申请日：2019-01-23
摘要： An electronic device includes a semiconductor die, an enclosure, leads extending outwardly from the enclosure and electrically connected to the semiconductor die, and wherein the leads have a reduced cross-sectional area along a longitudinal length of the lead. The electronic device is designed to reduce the occurrence of crack formation between the leads and a printed circuit board.
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9.发明授权公开(公告)号：US10115660B2
公开(公告)日：2018-10-30
申请号：US15688227
申请日：2017-08-28
IPC分类号： H01L23/495 , H01L21/48 , H01L21/56 , H01L21/78
摘要： A leadframe strip for use in making leaded integrated circuit packages includes a plurality of integrally connected leadframes that each have a die attach pad and first and second dam bars located adjacent to opposite first and second sides of the die attach pad, respectively. A plurality of continuous lead structures extend, uninterrupted by other structure, between opposing ones of the dam bars of horizontally adjacent leadframes. The plurality of integrally connected leadframes are arranged in a plurality of vertical columns, wherein die attach pads in one vertical column are vertically offset from die attach pads in adjacent vertical columns.
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公开(公告)号：US09892936B2
公开(公告)日：2018-02-13
申请号：US15340837
申请日：2016-11-01
CPC分类号： H01L21/561 , H01L21/4825 , H01L21/4842 , H01L21/563 , H01L21/78 , H01L23/3107 , H01L23/3114 , H01L23/49503 , H01L23/49541 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/32245 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/48257 , H01L2224/49052 , H01L2224/49113 , H01L2224/49175 , H01L2224/49433 , H01L2224/73265 , H01L2224/83424 , H01L2224/83447 , H01L2224/8346 , H01L2224/85439 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/181 , H01L2924/3512 , H01L2924/35121 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/01028 , H01L2924/01027 , H01L2224/85 , H01L2224/83
摘要： A semiconductor device has a leadframe with a first (401a) and a parallel second surface, and an assembly pad (410) bordered by two opposing sides, which include a plurality of through-holes (420) from the first to the second pad surface. Another pad side includes one or more elongated windows (421) between the pad surfaces. The second pad surface includes a plurality of grooves. The leadframe further has a plurality of leads (430) with opposite elongated sides castellated by indents (431). Layers (440) of bondable metals are restricted to localized areas surrounding bond spots. A semiconductor chip (450) is attached to the pad and wire-bonded (460) to the bond spots. A package (470) encapsulates the chip, wires, pad, and lead portions, and secures the leadframe into the package by filling the through-holes, windows, grooves, and indents.
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