公开(公告)号：US20220326296A1

公开(公告)日：2022-10-13

申请号：US17226924

申请日：2021-04-09

Applicant: Texas Instruments Incorporated

Inventor： Nathan Richard Schemm

IPC: G01R31/26 ,  H03K5/24 ,  H03K17/687

Abstract: A fault detection circuit includes a short circuit comparison circuit which has a first input connected to the source of the second NFET, a second input, and an output. The circuit includes an over-current comparison circuit which has a first input connected to the source of the second NFET, a second input, and an output. The circuit includes a voltage divider circuit which has a first terminal connected to first input of the short circuit comparison circuit, a second terminal connected to the first input of the over-current comparison circuit, and a third terminal connected to a ground terminal. The circuit includes a delay circuit which has an input connected to the output of the over-current comparison circuit and has an output.

公开(公告)号：US20220037873A1

公开(公告)日：2022-02-03

申请号：US17505757

申请日：2021-10-20

Applicant: Texas Instruments Incorporated

Inventor： Serkan Dusmez ,  Nathan Richard Schemm ,  Salil Chellappan

IPC: H02H5/04 ,  H02H1/00 ,  H02H7/12

Abstract: Methods, systems, and apparatus to facilitate a fault triggered diode emulation mode of a transistor. An example apparatus includes a driver to output a control signal to a gate terminal of a transistor of a power converter; and a diode emulation control circuit to, in response to determining a fault corresponding to the transistor, enable the transistor when current flows in a direction from a source terminal of the transistor to a drain terminal of the transistor.

公开(公告)号：US20150372645A1

公开(公告)日：2015-12-24

申请号：US14312239

申请日：2014-06-23

Applicant: Texas Instruments Incorporated

Inventor： Aritra Banerjee ,  Joonhoi Hur ,  Baher Haroun ,  Nathan Richard Schemm ,  Rahmi Hezar ,  Lei Ding

IPC: H03F1/02 ,  H03F3/217 ,  H03F3/21 ,  H03F3/193

CPC classification number: H03F1/0205 ,  H03F1/0294 ,  H03F3/193 ,  H03F3/211 ,  H03F3/217 ,  H03F3/2171 ,  H03F3/2173 ,  H03F3/2176 ,  H03F3/45179 ,  H03F2200/391 ,  H03F2200/451 ,  H03F2203/21139 ,  H03F2203/21142

Abstract: An outphasing amplifier includes a first class-E power amplifier (16-1) having an output coupled to a first conductor (31-1) and an input receiving a first RF drive signal (S1(t)). A first reactive element (CA-1) is coupled between the first conductor and a second conductor (30-1). A second reactive element (LA-1) is coupled between the second conductor and a third conductor (32-1). A second class-E power amplifier (17-1) includes an output coupled to a fourth conductor (31-2) and an input coupled to a second RF drive signal (S2(t)), a third reactive element (CA-3) coupled between the second and fourth conductors. Outputs of the first and second power amplifiers are combined by the first, second and third reactive elements to produce an output current in a load (R). An efficiency enhancement circuit (LEEC-1) is coupled between the first and fourth conductors to improve power efficiency at back-off power levels. Power enhancement circuits (20-1,2) are coupled to the first and fourth conductors, respectively.

Abstract translation: 外相放大器包括具有耦合到第一导体（31-1）的输出的第一E类功率放大器（16-1）和接收第一RF驱动信号（S1（t））的输入。 第一电抗元件（CA-1）耦合在第一导体和第二导体（30-1）之间。 第二电抗元件（LA-1）耦合在第二导体和第三导体（32-1）之间。 第二类E功率放大器（17-1）包括耦合到第四导体（31-2）的输出和耦合到第二RF驱动信号（S2（t））的输入，第三反应元件（CA-3 ）耦合在第二和第四导体之间。 第一和第二功率放大器的输出由第一，第二和第三无功元件组合以在负载（R）中产生输出电流。 效率增强电路（LEEC-1）耦合在第一和第四导体之间，以提高退避功率电平的功率效率。 功率增强电路（20-1,2）分别耦合到第一和第四导体。

公开(公告)号：US20210199515A1

公开(公告)日：2021-07-01

申请号：US16731910

申请日：2019-12-31

Applicant: Texas Instruments Incorporated

Inventor： Nathan Richard Schemm

IPC: G01K15/00 ,  G01K7/16 ,  G05B11/01

Abstract: Methods, apparatus, systems and articles of manufacture to trim temperature sensors are disclosed. An example method includes: sampling a first value indicative of a temperature of a first die of a multi-chip module (MCM) with a first temperature sensor, the first die including a first transistor having a channel including a first material; and calibrating a second temperature sensor configured to sample a second value indicative of a temperature of a second die including a second transistor have a second channel including a second material, the calibrating based on the first value.

公开(公告)号：US10193508B2

公开(公告)日：2019-01-29

申请号：US14255164

申请日：2014-04-17

Applicant: Texas Instruments Incorporated

Inventor： Aritra Banerjee ,  Rahmi Hezar ,  Lei Ding ,  Nathan Richard Schemm

IPC: H03F3/217 ,  H03F3/193 ,  H03F1/02 ,  H03F1/22 ,  H03F3/21 ,  H03F3/24 ,  H03F3/72

Abstract: A multi-level, multi-branch outphasing amplifier (20-1) includes a first branch group circuit (22-1) including a first branch circuit (11) receiving a first RF input signal (S1(t)) and first control information (S11_Ctrl=VDD) and a second branch circuit (12) receiving the first input signal and second control information (S12_Ctrl). Each of the first (11) and second (12) branch circuits includes a power amplifier. The second control information enables the second branch circuit to be switched on or off while the first branch circuit (12) remains on. A second branch group circuit (22-2) includes a third branch circuit (21) receiving a second RF input signal (S2(t)) and third control information (S21_Ctrl=VDD) and a fourth branch circuit (22) receiving the second input signal (S2(t)) and fourth control information (S22_Ctrl). Each of the third and fourth branch circuits includes a power amplifier. The fourth control information enables the fourth branch circuit to be switched on or off while the third branch circuit remains on. A combiner (24) combines output signals of the power amplifiers to produce an output signal (SOUT(t)).

公开(公告)号：US20180358968A1

公开(公告)日：2018-12-13

申请号：US16108246

申请日：2018-08-22

Applicant: Texas Instruments Incorporated

Inventor： Nathan Richard Schemm

IPC: H03K19/0185

CPC classification number: H03K19/018507

Abstract: A level shifter includes a signal generator that generates differential signals on a first output and a second output. A first capacitor is coupled between the first output and a first node and a second capacitor is coupled between the second output and a second node. A third capacitor is coupled between the first node and a first voltage potential, wherein the capacitance of the third capacitor is variable. A fourth capacitor is coupled between the second node and the first voltage potential, wherein the capacitance of the fourth capacitor is variable.

公开(公告)号：US10097183B2

公开(公告)日：2018-10-09

申请号：US15463404

申请日：2017-03-20

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Nathan Richard Schemm

IPC: H03L5/00 ,  H03K19/0185

Abstract: A level shifter includes a signal generator that generates differential signals on a first output and a second output. A first capacitor is coupled between the first output and a first node and a second capacitor is coupled between the second output and a second node. A third capacitor is coupled between the first node and a first voltage potential, wherein the capacitance of the third capacitor is variable. A fourth capacitor is coupled between the second node and the first voltage potential, wherein the capacitance of the fourth capacitor is variable.

公开(公告)号：US20160268974A1

公开(公告)日：2016-09-15

申请号：US15165339

申请日：2016-05-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Aritra Banerjee ,  Joonhoi Hur ,  Baher Haroun ,  Nathan Richard Schemm ,  Rahmi Hezar ,  Lei Ding

IPC: H03F1/02 ,  H03F3/45 ,  H03F3/217 ,  H03F3/21 ,  H03F3/193

CPC classification number: H03F1/0205 ,  H03F1/0294 ,  H03F3/193 ,  H03F3/211 ,  H03F3/217 ,  H03F3/2171 ,  H03F3/2173 ,  H03F3/2176 ,  H03F3/45179 ,  H03F2200/391 ,  H03F2200/451 ,  H03F2203/21139 ,  H03F2203/21142

Abstract: An outphasing amplifier includes a first class-E power amplifier (16-1) having an output coupled to a first conductor (31-1) and an input receiving a first RF drive signal (S1(t)). A first reactive element (CA-1) is coupled between the first conductor and a second conductor (30-1). A second reactive element (LA-1) is coupled between the second conductor and a third conductor (32-1). A second class-E power amplifier (17-1) includes an output coupled to a fourth conductor (31-2) and an input coupled to a second RF drive signal (S2(t)), a third reactive element (CA-3) coupled between the second and fourth conductors. Outputs of the first and second power amplifiers are combined by the first, second and third reactive elements to produce an output current in a load (R). An efficiency enhancement circuit (LEEC-1) is coupled between the first and fourth conductors to improve power efficiency at back-off power levels. Power enhancement circuits (20-1,2) are coupled to the first and fourth conductors, respectively.

Abstract translation: 外相放大器包括具有耦合到第一导体（31-1）的输出的第一E类功率放大器（16-1）和接收第一RF驱动信号（S1（t））的输入。 第一电抗元件（CA-1）耦合在第一导体和第二导体（30-1）之间。 第二电抗元件（LA-1）耦合在第二导体和第三导体（32-1）之间。 第二类E功率放大器（17-1）包括耦合到第四导体（31-2）的输出和耦合到第二RF驱动信号（S2（t））的输入，第三反应元件（CA-3 ）耦合在第二和第四导体之间。 第一和第二功率放大器的输出由第一，第二和第三无功元件组合以在负载（R）中产生输出电流。 效率增强电路（LEEC-1）耦合在第一和第四导体之间，以提高退避功率电平的功率效率。 功率增强电路（20-1,2）分别耦合到第一和第四导体。

公开(公告)号：US20150303961A1

公开(公告)日：2015-10-22

申请号：US14255164

申请日：2014-04-17

Applicant: Texas Instruments Incorporated

Inventor： Aritra Banerjee ,  Rahmi Hezar ,  Lei Ding ,  Nathan Richard Schemm

IPC: H04B1/16 ,  H04B1/12 ,  H04B1/18

CPC classification number: H03F3/193 ,  H03F1/0277 ,  H03F1/0294 ,  H03F1/223 ,  H03F3/211 ,  H03F3/245 ,  H03F3/72 ,  H03F2200/411 ,  H03F2200/511 ,  H03F2200/541 ,  H03F2203/21136 ,  H03F2203/21142 ,  H03F2203/7215 ,  H03F2203/7236

Abstract: A multi-level, multi-branch outphasing amplifier (20-1) includes a first branch group circuit (22-1) including a first branch circuit (11) receiving a first RF input signal (S1(t)) and first control information (S11—Ctrl=VDD) and a second branch circuit (12) receiving the first input signal and second control information (S12—Ctrl). Each of the first (11) and second (12) branch circuits includes a power amplifier. The second control information enables the second branch circuit to be switched on or off while the first branch circuit (12) remains on. A second branch group circuit (22-2) includes a third branch circuit (21) receiving a second RF input signal (S2(t)) and third control information (S21—Ctrl=VDD) and a fourth branch circuit (22) receiving the second input signal (S2(t)) and fourth control information (S22—Ctrl). Each of the third and fourth branch circuits includes a power amplifier. The fourth control information enables the fourth branch circuit to be switched on or off while the third branch circuit remains on. A combiner (24) combines output signals of the power amplifiers to produce an output signal (SOUT(t)).

Abstract translation: 多级多分支外延放大器（20-1）包括：第一分支组电路（22-1），包括接收第一RF输入信号（S1（t））的第一分支电路（11）和第一分支组电路 （S11-Ctrl = VDD）和接收第一输入信号的第二分支电路（12）和第二控制信息（S12-Ctrl）。 第一（11）和第二（12）分支电路中的每一个包括功率放大器。 第二控制信息使第二分支电路在第一分支电路（12）保持接通时被接通或断开。 第二分支组电路（22-2）包括接收第二RF输入信号（S2（t））和第三控制信息（S21-Ctrl = VDD）的第三分支电路（21）和接收第二分支电路 第二输入信号（S2（t））和第四控制信息（S22-Ctrl）。 第三和第四分支电路中的每一个包括功率放大器。 第四控制信息使第四分支电路在第三分支电路保持接通时被接通或断开。 组合器（24）组合功率放大器的输出信号以产生输出信号（SOUT（t））。

公开(公告)号：US12235168B2

公开(公告)日：2025-02-25

申请号：US18206684

申请日：2023-06-07

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Nathan Richard Schemm

IPC: G01K15/00 ,  G01K7/01 ,  G01K7/16 ,  G05B11/01 ,  H01L23/34

Abstract: Methods, apparatus, systems and articles of manufacture to trim temperature sensors are disclosed. An example method includes: sampling a first value indicative of a temperature of a first die of a multi-chip module (MCM) with a first temperature sensor, the first die including a first transistor having a channel including a first material; and calibrating a second temperature sensor configured to sample a second value indicative of a temperature of a second die including a second transistor have a second channel including a second material, the calibrating based on the first value.