Abstract:
A resonant line driver for driving capacitive-loads includes a driver series-coupled to an energy transfer inductor L1, driving signal energy at a signal frequency through L1. A switch array is controlled to switch L1 between multiple electrodes according to a switching sequence, each electrode characterized by a load capacitance CL. L1 and CL form a resonator circuit in which signal energy cycles between L1 and CL at the signal frequency. The switch array switches L1 between a current electrode and a next electrode at a zero_crossing when signal energy in the energy transfer inductor is at a maximum and signal energy in the load capacitance of the current electrode is at a minimum. An amplitude control loop controls signal energy delivered to the L1CL resonator circuit, and a frequency control loop controls signal frequency/phase. In an example application, the resonant driver provides line drive for a mutual capacitance touch screen.
Abstract:
Receiver circuits and methods of processing received signals are disclosed herein. An embodiment of a receiver circuit includes a differential input having a first input and a second input and a differential output having a first output and a second output. A first feedback loop is connected to the input and the output, wherein the first feedback loop centers a differential output voltage around a common mode output voltage so that the differential sum is zero centered on the common mode output voltage. The circuit also includes a second feedback loop, wherein the second feedback loop centers the voltage at the first input and the voltage at the second input to a reference voltage.
Abstract:
In circuitry for measuring a voltage at a node, a capacitive divider is coupled to the node, wherein the capacitive divider provides a first output. A resistive divider is coupled to the node, wherein the resistive divider provides a second output.
Abstract:
In described examples, bootstrap diode circuits include a first diode having a first diode input coupled to a voltage supply and a first diode output. Described bootstrap diode circuits additionally include a second diode having a second diode input coupled to the first diode output and a second diode output and a plurality of zener diodes coupled in series. The series-coupled zener diodes are further coupled in parallel with the second diode.
Abstract:
A first amplifier has an input to receive a Hall-signal output current from a first Hall element and has an output to output feedback current in response to the received Hall-signal output current. The Hall-signal output current is impeded by an impedance of the first Hall element. The feedback current is coupled to counterpoise the Hall-signal output current at the input, and a voltage at the output is an amplified Hall output signal. A second amplifier generates a high-frequency portion output signal in response to a difference between the amplified Hall output signal and a Hall-signal output signal from a second Hall element. A filter reduces high-frequency content of the high-frequency portion output signal and generates an offset correction signal. A third amplifier generates a corrected Hall signal in response to a difference between the amplified Hall output signal and the offset correction signal.
Abstract:
An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.
Abstract:
An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.
Abstract:
A method and device for providing isolated power transfer to a low-power load across a capacitor of a series resonance circuit are shown. The method includes comparing an output voltage received via a feedback loop with a desired output voltage. Responsive to determining that the output voltage is not equal to the desired output voltage, the method determines a sub-harmonic order of the resonant frequency of the series resonance circuit to use as a switching frequency and switches the series resonance circuit at substantially the determined subharmonic order of the resonant frequency.
Abstract:
In a described example, an integrated circuit includes: a semiconductor substrate having a first surface and an opposite second surface; at least one dielectric layer overlying the first surface of the semiconductor substrate; at least one inductor coil in the at least one dielectric layer with a plurality of coil windings separated by coil spaces, the at least one inductor coil lying in a plane oriented in a first direction parallel to the first surface of the semiconductor substrate, the at least one inductor coil electrically isolated from the semiconductor substrate by a portion of the at least one dielectric layer; and trenches extending into the semiconductor substrate in a second direction at an angle with respect to the first direction, the trenches underlying the inductor coil and filled with dielectric replacement material.
Abstract:
A switched driver for a power supply includes a high-side switch and a low-side switch coupled to the high-side switch. An output is coupled between the high-side switch and the low-side switch. A switch controller is coupled to either the high-side switch or the low-side switch and has a switch controller input for receiving a switch control signal and an output for controlling a switch. The switch controller initially reduces the resistance of the switch, increases the resistance of the switch, and then reduces the resistance of the switch in response to a signal received at the input.