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公开(公告)号：US20230044343A1
公开(公告)日：2023-02-09
申请号：US17395029
申请日：2021-08-05
Inventor： Shailesh N. Joshi , Gaurav Singhal , Paul Vannest Braun , Danny J. Lohan , Kai-Wei Lan
Abstract: A method to form a three-dimensional photonic crystal template with a gradient structure involves irradiating a photoresist composition of a thickness of at least 15 μm from at least four laser beams to yield a periodic patterned with a percolating matrix of mass in constructive volumes of a cured photoresist composition and destructive volumes of voids free of condensed matter where the proportion of constructive volume displays a gradient from the irradiated surface to the substrate after development. For a given light intensity, photoinitiator concentration in the photoresist composition, and a given thickness, by irradiating for a relatively short period, a three-dimensional photonic crystal template displaying a gradient having greater constructive volume proximal the air interface forms and a relatively long irradiation period results in a gradient having greater constructive volume proximal the substrate.
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公开(公告)号：US11545874B2
公开(公告)日：2023-01-03
申请号：US16719264
申请日：2019-12-18
Inventor： Shailesh N. Joshi , Shohei Suenaga
IPC: H02K9/00 , H01L23/373 , H05K1/11 , H05K7/20 , H01L23/367
Abstract: An electronic assembly includes a flexible printed circuit board (PCB) circumferentially disposed around a motor and a thermal management assembly (TMA) thermally connected to the flexible PCB. One or more switching semiconductor devices are disposed on a first surface of the flexible PCB. The TMA includes a cooling jacket, at least one jacket manifold formed through the cooling jacket and a thermal compensation base layer thermally coupled to the cooling jacket. The cooling jacket is mounted around a circumference of the motor and has a mounting surface concentric with the circumference of the motor. The mounting surface is coupled to the first surface of the flexible PCB. The at least one jacket manifold has a fluid inlet and a fluid outlet defining a fluid flow area therebetween. The thermal compensation base layer is thermally coupled to the cooling jacket and the one or more switching semiconductor devices.
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13.发明授权公开(公告)号：US11533012B2
公开(公告)日：2022-12-20
申请号：US16906523
申请日：2020-06-19
Inventor： Shohei Suenaga , Shailesh N. Joshi , Danny J. Lohan , Yanghe Liu
Abstract: An integrated power control assembly mounted on an axial end of a three-phase motor includes a substrate, two input busbars each of positive and negative polarities alternatively spaced apart on the substrate, a plurality of sets of paired devices, and three output busbars corresponding to the three phases of the motor, wherein a set of paired devices includes a switching semiconductor and a diode. An inner input busbar has edges adjacent to an inner input busbar of opposite polarity and an outer input busbar of opposite polarity and configured to have at least twice as many devices as the outer input busbars. One or more sets of paired devices are disposed axially on outer input busbars and on inner input busbars along the edges. An individual output busbar is disposed over and electrically coupled to one or more sets of paired devices disposed on adjacent input busbars of opposite polarity.
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公开(公告)号：US11476737B2
公开(公告)日：2022-10-18
申请号：US16818559
申请日：2020-03-13
Inventor： Shailesh N. Joshi , Yanghe Liu , Fa Chen
Abstract: An integrated power control assembly configured as an inverter for a motor is mounted directly on an axial end of the motor. The integrated power control assembly includes one or more power plates, one or more cooling plates coaxially disposed on and thermally connected to the one or more power plates, and one or more circuit boards circumferentially disposed around the one or more power plates. An individual power plate has a power card having one or more switching semiconductor devices corresponding to individual phases of the motor. The individual power card is electrically coupled to the motor through one or more busbars. An individual circuit board is electrically coupled to an individual power card corresponding to an individual phase of the motor. The individual circuit board has a first surface electrically coupled to the one or more power plates and a second surface opposite to the first surface.
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公开(公告)号：US20220319956A1
公开(公告)日：2022-10-06
申请号：US17217348
申请日：2021-03-30
Inventor： Shailesh N. Joshi , Ercan Mehmet Dede , Feng Zhou , Hiroshi Ukegawa , Danny Lohan
IPC: H01L23/427 , H01L23/528 , H01L23/06 , H01L23/373 , H01L25/07
Abstract: A power device assembly includes a heat-generating device, one or more porous bonding layers, and one or more cap layers. The one or more porous bonding layers are formed on a surface of the heat-generating device and define a plurality of embedded vapor channels. The one or more cap layers are engaged with a porous bonding layer of the one or more porous bonding layers opposite the heat-generating device. The one or more cap layer comprise a plurality of liquid feed channels for feeding cooling fluid to the heat-generating device via the porous bonding layer.
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Patent Agency Ranking
公开(公告)号：US20220314211A1
公开(公告)日：2022-10-06
申请号：US17218345
申请日：2021-03-31
Inventor： Yuyang Song , Shailesh N. Joshi , Piran R. Kidambi , Peifu Cheng
Abstract: A method of fabricating a carbon nanotube (“CNT”) array includes providing a substrate with a CNT catalyst disposed on a surface of the substrate, heating the CNT catalyst to an annealing temperature, exposing the CNT catalyst to a CNT precursor for an exposure period to pre-load the CNT catalyst, and exposing the pre-loaded CNT catalyst to a carbon source for a growth period to form the CNT array. The formed CNT array comprises a plurality of CNT bundles that are aligned with one another in an alignment direction. At least one of the plurality of bundles comprises an average structural factor of 1.5 or less along an entirety of the length thereof.
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17.发明授权公开(公告)号：US11380604B2
公开(公告)日：2022-07-05
申请号：US16696120
申请日：2019-11-26
Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. , The Board of Trustees of the University of Illinois
Inventor： Shailesh N. Joshi , Paul Braun , Julia Kohanek , Gaurav Singhal
IPC: H01L23/427 , F28D15/02 , H01L21/48
Abstract: A method of forming a textured surface layer along a substrate that includes disposing a plurality of polymer spheres on a surface of the metal substrate, and electroplating the metal substrate at a current density to deposit a metal layer along a body of each of the plurality of polymer spheres disposed on the surface of the metal substrate. The metal layer does not extend above a top surface of the plurality of polymer spheres. The method further includes removing the plurality of polymer spheres from the metal layer to form the textured surface defined by a size and shape of the plurality of polymer spheres.
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18.发明申请公开(公告)号：US20220192060A1
公开(公告)日：2022-06-16
申请号：US17166652
申请日：2021-02-03
Inventor： Shailesh N. Joshi , Danny J. Lohan
Abstract: A two-phase cold plate that includes a manifold body having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway housed within the manifold body and a vaporization structure housed within the manifold body such that the fluid pathway is disposed over the vaporization structure. The vaporization structure includes a cavity cover, a porous surface, a vapor cavity disposed between the cavity cover and the porous surface, and one or more porous feeding posts extending between the cavity cover and the porous surface. The one or more porous feeding posts fluidly coupled the fluid pathway with the porous surface of the vaporization structure and the porous surface includes a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the vaporization structure.
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公开(公告)号：US20210368652A1
公开(公告)日：2021-11-25
申请号：US16880202
申请日：2020-05-21
Inventor： Shailesh N. Joshi , Danny J. Lohan
Abstract: In various embodiments, a cooling assembly includes a heat-generating device, a metal inverse opal (MIO) layer, a shared coolant reservoir, a passive heat exchange circuit, and an active heat exchange circuit. The MIO layer is bonded to the heat-generating device. The shared coolant reservoir contains a coolant fluid. The passive heat exchange circuit directs coolant fluid from the shared coolant reservoir through the MIO layer and back to the shared coolant reservoir. The active heat exchange circuit includes a pump and a heat exchanger, wherein the active heat exchange circuit draws the coolant fluid from the shared coolant reservoir through the heat exchanger and returns the coolant fluid to the shared coolant reservoir.
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公开(公告)号：US11093315B2
公开(公告)日：2021-08-17
申请号：US16361780
申请日：2019-03-22
Inventor： Donald McMenemy , Weiqiang Chen , Ali M. Bazzi , Krishna R. Pattipati , Shailesh N. Joshi
IPC: G06F11/07
Abstract: Systems and methods for detecting a fault or model mismatch are disclosed. A system includes a processor, a memory, and one or more sensors. The sensors may detect data associated with an electronic device. The memory may store processor executable instructions to: compute T2 and Q statistics, over a time period, and apply a model mismatch and fault detection logic based on the T2 and Q statistics. The model mismatch and fault detection logic may: count consecutive instances where a T2 statistic exceeds a T2 threshold via a T2 counter, update a probability of fault based on the T2 counter, count consecutive instances where a Q statistic exceeds a Q threshold via a Q counter, update a probability of model mismatch based on the Q counter, and detect one of a fault or a model mismatch based on a probability of fault threshold and a probability of model mismatch threshold.
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