公开(公告)号：US09871325B2

公开(公告)日：2018-01-16

申请号：US14996692

申请日：2016-01-15

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Sandeep Patel ,  Bruce Allen Champion ,  Linda Ellen Shields ,  Michael John Phillips ,  Thomas Taake de Boer ,  John Joseph Consoli

IPC: H01R13/66 ,  H01R13/6473 ,  H01R12/72

CPC classification number: H01R13/6473 ,  H01R12/721 ,  H01R12/724 ,  H01R13/6471 ,  H01R24/60 ,  H05K1/0233 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/086 ,  H05K2201/10189

Abstract: An interconnect system includes a circuit board including a substrate having a first surface and a second surface opposite the first surface, a plurality of signal conductors and a plurality of ground conductors including respective contact pads in a mating area of the substrate for engaging corresponding contacts of an electrical connector, and a plurality of ground vias extending at least partially through the substrate between the first and second surfaces. The ground vias are coupled to corresponding ground conductors. The ground vias include lossy plugs at least partially filling the ground vias. The lossy plugs are manufactured from lossy material capable of absorbing electrical resonance propagating through the substrate.

公开(公告)号：US20170207579A1

公开(公告)日：2017-07-20

申请号：US14996692

申请日：2016-01-15

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Sandeep Patel ,  Bruce Allen Champion ,  Linda Ellen Shields ,  Michael John Phillips ,  Thomas Taake de Boer ,  John Joseph Consoli

IPC: H01R13/6473 ,  H01R12/72

CPC classification number: H01R13/6473 ,  H01R12/721 ,  H01R12/724 ,  H01R13/6471 ,  H01R24/60 ,  H05K1/0233 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/086 ,  H05K2201/10189

Abstract: An interconnect system includes a circuit board including a substrate having a first surface and a second surface opposite the first surface, a plurality of signal conductors and a plurality of ground conductors including respective contact pads in a mating area of the substrate for engaging corresponding contacts of an electrical connector, and a plurality of ground vias extending at least partially through the substrate between the first and second surfaces. The ground vias are coupled to corresponding ground conductors. The ground vias include lossy plugs at least partially filling the ground vias. The lossy plugs are manufactured from lossy material capable of absorbing electrical resonance propagating through the substrate.

公开(公告)号：US20170170606A1

公开(公告)日：2017-06-15

申请号：US14967605

申请日：2015-12-14

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Michael John Phillips ,  Thomas Taake de Boer ,  Bruce Allen Champion ,  John Joseph Consoli ,  Sandeep Patel ,  Linda Ellen Shields

IPC: H01R13/6471 ,  H01R12/70 ,  H01R13/6585

CPC classification number: H01R13/6471 ,  H01R12/7005 ,  H01R12/721 ,  H01R12/725 ,  H01R12/735 ,  H01R13/405 ,  H01R13/6585

Abstract: An electrical connector includes a housing having a first end and a second end with a mating slot formed between the first and second ends configured to receive a mating connector having contact pads. A leadframe assembly is disposed in the housing. The leadframe assembly has a contact array including ground contacts and signal contacts interspersed between corresponding ground contacts. The leadframe assembly has an overmold body supporting the ground and signal contacts. The overmold body has lossy ground absorbers coupled to corresponding ground contacts. The lossy ground absorbers are manufactured from lossy material absorbing electrical resonance propagating through the leadframe assembly.

公开(公告)号：US09490587B1

公开(公告)日：2016-11-08

申请号：US14967563

申请日：2015-12-14

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Michael John Phillips ,  Thomas Taake de Boer ,  Bruce Allen Champion ,  John Joseph Consoli ,  Sandeep Patel ,  Linda Ellen Shields

IPC: H01R9/03 ,  H01R13/6586 ,  H01R13/6599 ,  H01R13/6587

CPC classification number: H01R13/6586 ,  H01R13/6587 ,  H01R13/6599

Abstract: A contact module stack includes signal contact modules and ground contact modules flanking the signal contact modules in a ground-signal-signal-ground contact module arrangement. The signal contact modules each include signal leadframes and signal dielectric bodies. The ground contact modules each include ground leadframes and ground dielectric bodies. The ground leadframes each have at least one ground contact. Each ground dielectric body has a low loss layer on a first side of the ground leadframe and a lossy layer on a second side of the ground leadframe. The lossy layer and the low loss layer substantially enclose a transition portion of the ground contact. The lossy layers are manufactured from lossy material having conductive particles in a dielectric binder material. The lossy layers absorb electrical resonance propagating through the contact module stack.

Abstract translation: 触点模块堆叠包括接地信号 - 接地触头模块装置中的信号触头模块侧面的信号触点模块和接地触头模块。 信号触点模块各自包括信号引线框架和信号电介质体。 接地触头模块各自包括接地引线框架和接地绝缘体。 接地引线框架各自具有至少一个接地触点。 每个接地电介质体在接地引线框架的第一侧具有低损耗层，在接地引线框架的第二侧具有有损层。 有损层和低损耗层基本上包围接地触点的过渡部分。 有损层由介电粘合剂材料中具有导电颗粒的有损耗材料制成。 有损层吸收通过触点模块叠层传播的电谐振。

公开(公告)号：US09401569B2

公开(公告)日：2016-07-26

申请号：US14507231

申请日：2014-10-06

Applicant: Tyco Electronics Corporation

Inventor： Wayne Samuel Davis ,  Michael James Horning ,  John Joseph Consoli ,  Thomas Edward Messenger ,  Andrew Michael Homick ,  Daniel Briner Shreffler ,  Chad W. Morgan ,  Raymond D. Boyer ,  Vincent Ruminski ,  Masayuki Aizawa ,  Edward Lee Hengst

IPC: H01R13/648 ,  H01R13/6585

CPC classification number: H01R13/6585

Abstract: A header assembly of a mezzanine connector system may include a main housing defining signal channels extending through the main housing and ground channels extending into a first surface of the main housing, a plurality of signal modules, and a plurality of ground shields. At least a portion of each of the plurality of signal modules is retained within a respective one of the signal channels. At least a portion of each of the plurality of ground shields is retained within at least one of the ground channels.

Abstract translation: 夹层连接器系统的头部组件可以包括主壳体，其限定延伸穿过主壳体的信号通道和延伸到主壳体的第一表面的接地通道，多个信号模块和多个接地屏蔽。 多个信号模块中的每一个的至少一部分保持在相应的一个信号通道内。 多个接地屏蔽中的每一个的至少一部分保持在至少一个接地通道内。