公开(公告)号：US11732160B2

公开(公告)日：2023-08-22

申请号：US17106211

申请日：2020-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chun-Chi Hsu ,  Chun-Ting Lai ,  Chih-Wei Lin

IPC: C09J7/38 ,  C09J7/25 ,  H01L33/00

CPC classification number: C09J7/38 ,  C09J7/25 ,  C09J7/383 ,  C09J7/385 ,  H01L33/0095 ,  C09J2203/326 ,  C09J2301/1242 ,  C09J2301/312 ,  C09J2433/00 ,  C09J2479/086

Abstract: A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.

公开(公告)号：US20160060404A1

公开(公告)日：2016-03-03

申请号：US14839654

申请日：2015-08-28

Applicant: Taimide Technology Incorporation

Inventor： Chih-Wei Lin ,  Chun-Ting Lai ,  Yen-Po HUANG

IPC: C08J5/18 ,  B32B37/16 ,  B05D7/04 ,  B29C65/00 ,  B05D3/02 ,  B05D3/12 ,  B32B27/28 ,  B32B38/10

CPC classification number: B32B27/281 ,  B29D7/01 ,  B32B3/10 ,  B32B7/12 ,  B32B15/08 ,  B32B27/20 ,  B32B37/144 ,  B32B38/10 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2260/02 ,  B32B2264/0242 ,  B32B2307/518 ,  B32B2379/08 ,  B32B2457/08 ,  H05K3/281

Abstract: A polyimide film arrangement (e.g., a polyimide film) includes a polyimide layer having a first and a second surface opposite to each other, and a base layer peelably adhered to the first surface of the polyimide layer and containing a polyimide. The polyimide layer or the base layer includes a filler having a surface energy less than about 35 dyne/cm. Moreover, the present application also describes a method of fabricating the polyimide film arrangement, and its assembly on a substrate.

Abstract translation: 聚酰亚胺膜布置（例如，聚酰亚胺膜）包括具有彼此相反的第一和第二表面的聚酰亚胺层和可剥离地粘附到聚酰亚胺层的第一表面并含有聚酰亚胺的基层。 聚酰亚胺层或基层包括表面能小于约35达因/厘米的填料。 此外，本申请还描述了一种制造聚酰亚胺膜装置的方法及其在基板上的组装。