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公开(公告)号：US20180162720A1
公开(公告)日：2018-06-14
申请号：US15833072
申请日：2017-12-06
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yu-Jui Cheng , I-Shi Wang , Ren-Dou Lee , Jen-Hao Liu
CPC classification number: B81B7/007 , B81B7/0077 , B81B7/02 , B81C1/00238 , B81C1/00269 , B81C3/005 , B81C3/008 , B81C2203/019 , B81C2203/054 , B81C2203/0735 , B81C2203/075
Abstract: A method includes: providing a first substrate on which a plurality of first semiconductor devices is formed; providing a second substrate on which a plurality of second semiconductor devices is formed; and coupling the first and second substrates by contacting respective dummy pads of the first and second substrates, wherein at least one of the dummy pads of the first and second substrates comprises plural peaks and valleys.
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12.发明申请公开(公告)号：US20250062274A1
公开(公告)日：2025-02-20
申请号：US18451982
申请日：2023-08-18
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Jen-Hao Liu , Amram Eitan , Chih-Yuan Chiu , Chi-Chun Peng , Yu-Hong Du
IPC: H01L23/00
Abstract: A bonding apparatus with a bonding head having vacuum channels and switchable channels, and the method of forming the same are provided. The bonding apparatus may include a vacuum pump, a blower, a controller communicatively coupled to the vacuum pump and the blower, and a bonding head. The bonding head may include a main body, a first vacuum channel in the main body, wherein the first vacuum channel is connected to the vacuum pump, and a first switchable channel in the main body, wherein the first switchable channel is connected to the vacuum pump and the blower.
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公开(公告)号：US11192775B2
公开(公告)日：2021-12-07
申请号：US16386993
申请日：2019-04-17
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Hang Chang , I-Shi Wang , Jen-Hao Liu
IPC: B81B3/00
Abstract: A microelectromechanical systems (MEMS) package with roughness for high quality anti-stiction is provided. A device substrate is arranged over a support device. The device substrate comprises a movable element with a lower surface that is rough and that is arranged within a cavity. A dielectric layer is arranged between the support device and the device substrate. The dielectric layer laterally encloses the cavity. An anti-stiction layer lines the lower surface of the movable element. A method for manufacturing the MEMS package is also provided.
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公开(公告)号：US20200223689A1
公开(公告)日：2020-07-16
申请号：US16829196
申请日：2020-03-25
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Hang Chang , I-Shi Wang , Jen-Hao Liu
Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first wafer comprising a first face and a second face opposite the first face and having a plurality of predetermined die areas. A plurality of recesses are disposed in the first face of the first wafer. A first recess of the plurality of recesses extends in a direction substantially parallel to a first edge of at least one of the plurality of predetermined die areas and laterally surrounds the at least one of the plurality of predetermined die areas. A second wafer is bonded to the second face of the first wafer.
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公开(公告)号：US10112826B2
公开(公告)日：2018-10-30
申请号：US15456271
申请日：2017-03-10
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Hang Chang , Jen-Hao Liu , I-Shi Wang
Abstract: A method for forming a micro-electro-mechanical system (MEMS) device structure is provided. The method includes forming a recess in a first substrate and forming a dielectric layer on the first substrate and in the recess. The method also includes forming a second substrate on the dielectric layer and etching a portion of the second substrate to form a MEMS structure. The MEMS structure has a plurality of openings. The method further includes etching a portion of the dielectric layer to form a cavity below the openings.
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Patent Agency Ranking
公开(公告)号：US20170225948A1
公开(公告)日：2017-08-10
申请号：US15016527
申请日：2016-02-05
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chien-Ning Hsin , I-Shi Wang , Jen-Hao Liu , Chih-Hang Chang
IPC: B81C1/00
CPC classification number: B81C1/00357 , B81C1/00269 , B81C2203/036 , B81C2203/037 , H01L21/02334 , H01L21/02337 , H01L21/2007 , H01L21/3105
Abstract: A method for fusion bonding a pair of substrates together with silane preconditioning is provided. A surface of a first oxide layer or a surface of a second oxide layer is preconditioned with silane. The first and second oxide layers are respectively arranged on first and second semiconductor substrates. Water is applied to the surface of the first or second oxide layer. The surfaces of the first and second oxide layers are brought in direct contact. The first and second oxide layers are annealed. A method for manufacturing a microelectromechanical systems (MEMS) package using the fusion bonding is also provided.
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公开(公告)号：US11211354B2
公开(公告)日：2021-12-28
申请号：US16203366
申请日：2018-11-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Hang Chang , Richard Huang , I-shi Wang , Yin-Tun Chou , Jen-Hao Liu
Abstract: In an embodiment, a system includes: a circular frame comprising a first side and a second side opposite the first side, wherein the circular frame comprises an aperture formed therethrough; an insert disposed within the aperture; a first wafer disposed over the insert; a second wafer disposed over the first wafer, wherein both the first wafer and the second wafer are configured for eutectic bonding when heated; two clamps disposed on the first side along the circular frame, wherein the two clamps are configured to contact the second wafer at respective clamp locations; and a plurality of pieces configured to secure the insert within the aperture, the plurality of pieces comprising both fixed and flexible pieces, the plurality of pieces comprising two fixed pieces disposed respectively adjacent to the clamp locations along the second side of the circular frame.
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公开(公告)号：US10759654B2
公开(公告)日：2020-09-01
申请号：US16229902
申请日：2018-12-21
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yu-Jui Chen , I-Shi Wang , Ren-Dou Lee , Jen-Hao Liu
Abstract: The present disclosure relates to a method for manufacturing a microelectromechanical systems (MEMS) package. The method comprises providing a CMOS IC including CMOS devices arranged within a CMOS substrate. The method further comprises forming and patterning a metal layer over the CMOS substrate to form an anti-stiction layer and a fixed electrode plate and forming a rough top surface for the anti-stiction layer. The method further comprises providing a MEMS IC comprising a moveable mass arranged within a recess of a MEMS substrate and bonding the CMOS IC to the MEMS IC to enclose a cavity between the moveable mass and the fixed electrode plate and the anti-stiction layer.
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公开(公告)号：US20200270121A1
公开(公告)日：2020-08-27
申请号：US15930605
申请日：2020-05-13
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Chien Yang , Ming-Lun Shih , Ren-Dou Lee , Jen-Hao Liu
Abstract: A multi-layer sealing film for high seal yield is provided. In some embodiments, a substrate comprises a vent opening extending through the substrate, from an upper side of the substrate to a lower side of the substrate. The upper side of the substrate has a first pressure, and the lower side of the substrate has a second pressure different than the first pressure. The multi-layer sealing film covers and seals the vent opening to prevent the first pressure from equalizing with the second pressure through the vent opening. Further, the multi-layer sealing film comprises a pair of metal layers and a barrier layer sandwiched between metal layers. Also provided is a microelectromechanical systems (MEMS) package comprising the multilayer sealing film, and a method for manufacturing the multi-layer sealing film.
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公开(公告)号：US10676343B2
公开(公告)日：2020-06-09
申请号：US16202444
申请日：2018-11-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chih-Chien Yang , Ming-Lun Shih , Ren-Dou Lee , Jen-Hao Liu
Abstract: A multi-layer sealing film for high seal yield is provided. In some embodiments, a substrate comprises a vent opening extending through the substrate, from an upper side of the substrate to a lower side of the substrate. The upper side of the substrate has a first pressure, and the lower side of the substrate has a second pressure different than the first pressure. The multi-layer sealing film covers and seals the vent opening to prevent the first pressure from equalizing with the second pressure through the vent opening. Further, the multi-layer sealing film comprises a pair of metal layers and a barrier layer sandwiched between metal layers. Also provided is a microelectromechanical systems (MEMS) package comprising the multilayer sealing film, and a method for manufacturing the multi-layer sealing film.
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