公开(公告)号：US20210249372A1

公开(公告)日：2021-08-12

申请号：US16787020

申请日：2020-02-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sen-Kuei Hsu ,  Hsin-Yu Pan ,  Yi-Che Chiang

IPC: H01L23/00 ,  G01R31/28

Abstract: A manufacturing method of a semiconductor package includes the following steps. Semiconductor chips are disposed on a carrier. The semiconductor chips are grouped in a plurality of package units. The semiconductor chips are encapsulated in an encapsulant to form a reconstructed wafer. A redistribution structure is formed on the encapsulant. The redistribution structure electrically connects the semiconductor chips within a same package unit of the plurality of package units. The individual package units are separated by cutting through the reconstructed wafer along scribe line regions. In the reconstructed wafer, the plurality of package units are arranged so as to balance the number of scribe line regions extending across opposite halves of the reconstructed wafer in a first direction with respect to the number of scribe line regions extending across opposite halves of the reconstructed wafer in a second direction perpendicular to the first direction.

公开(公告)号：US10312203B2

公开(公告)日：2019-06-04

申请号：US15625678

申请日：2017-06-16

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.

Inventor： Yung-Ping Chiang ,  Nien-Fang Wu ,  Min-Chien Hsiao ,  Yi-Che Chiang ,  Chao-Wen Shih ,  Shou-Zen Chang ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H01L25/065 ,  H01L23/538 ,  H01L21/683 ,  H01L21/56

Abstract: Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive element and a first protective layer surrounding the semiconductor die. The chip package also includes a second protective layer over the semiconductor die and the first protective layer. The chip package further includes an antenna element over the second protective layer. The antenna element is electrically connected to the conductive element of the semiconductor die.

公开(公告)号：US10937719B2

公开(公告)日：2021-03-02

申请号：US15638386

申请日：2017-06-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Ping Chiang ,  Chao-Wen Shih ,  Min-Chien Hsiao ,  Nien-Fang Wu ,  Shou-Zen Chang ,  Yi-Che Chiang

IPC: H01L23/495 ,  H01L23/66 ,  H01L25/16 ,  H01P1/30 ,  H01P3/02 ,  H01L23/31 ,  H01L23/433 ,  H01Q21/06 ,  H01L21/56 ,  H01Q15/00 ,  H01Q1/22 ,  H01L21/683 ,  H01P1/20 ,  H01L23/538 ,  H01L23/498

Abstract: A package structure comprising a die, a first molding compound encapsulating the die, an antenna structure and a reflector pattern disposed above the die is provided. Through vias penetrating through the first molding compound are disposed around the die. The reflector pattern is disposed on the die and the through vias. The antenna structure is disposed on the reflector pattern and electrically connected with the reflector pattern and the die. The antenna structure is wrapped by a second molding compound disposed on the reflector pattern.

公开(公告)号：US10818588B2

公开(公告)日：2020-10-27

申请号：US16262924

申请日：2019-01-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sen-Kuei Hsu ,  Hsin-Yu Pan ,  Yi-Che Chiang

IPC: H01L23/10 ,  H01L23/34 ,  H01L23/522 ,  H01L23/31 ,  H01L23/36 ,  H01L23/00 ,  H01L23/528 ,  H01L21/48 ,  H01L21/56

Abstract: A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, a heat dissipation element and conductive balls. The insulating encapsulant is encapsulating the semiconductor die, and has a first surface and a second surface opposite to the first surface. The first redistribution layer is located on the first surface of the insulating encapsulant and includes at least one feed line and one ground plate. The second redistribution layer is located on the second surface of the insulating encapsulant and electrically connected to the semiconductor die and the first redistribution layer. The heat dissipation element is disposed on the first redistribution layer and includes a conductive base and antenna patterns, wherein the antenna patterns is electrically connected to the feed line and is electrically coupled to the ground plate of the first redistribution layer.

公开(公告)号：US20200251414A1

公开(公告)日：2020-08-06

申请号：US16262924

申请日：2019-01-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Sen-Kuei Hsu ,  Hsin-Yu Pan ,  Yi-Che Chiang

IPC: H01L23/522 ,  H01L23/31 ,  H01L23/36 ,  H01L23/00 ,  H01L23/528 ,  H01L21/48 ,  H01L21/56

Abstract: A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, a heat dissipation element and conductive balls. The insulating encapsulant is encapsulating the semiconductor die, and has a first surface and a second surface opposite to the first surface. The first redistribution layer is located on the first surface of the insulating encapsulant and includes at least one feed line and one ground plate. The second redistribution layer is located on the second surface of the insulating encapsulant and electrically connected to the semiconductor die and the first redistribution layer. The heat dissipation element is disposed on the first redistribution layer and includes a conductive base and antenna patterns, wherein the antenna patterns is electrically connected to the feed line and is electrically coupled to the ground plate of the first redistribution layer.

公开(公告)号：US20180269139A1

公开(公告)日：2018-09-20

申请号：US15638386

申请日：2017-06-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yung-Ping Chiang ,  Chao-Wen Shih ,  Min-Chien Hsiao ,  Nien-Fang Wu ,  Shou-Zen Chang ,  Yi-Che Chiang

IPC: H01L23/495 ,  H01L23/66 ,  H01L25/16 ,  H01P1/30 ,  H01P3/02 ,  H01L23/31 ,  H01L23/433

CPC classification number: H01L23/49548 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49575 ,  H01L23/49838 ,  H01L23/5389 ,  H01L23/66 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/18 ,  H01P1/2005 ,  H01P1/30 ,  H01P3/026 ,  H01Q1/2283 ,  H01Q15/0086 ,  H01Q21/062

Abstract: A package structure comprising a die, a first molding compound encapsulating the die, an antenna structure and a reflector pattern disposed above the die is provided. Through vias penetrating through the first molding compound are disposed around the die. The reflector pattern is disposed on the die and the through vias. The antenna structure is disposed on the reflector pattern and electrically connected with the reflector pattern and the die. The antenna structure is wrapped by a second molding compound disposed on the reflector pattern.