公开(公告)号：US20190094697A1

公开(公告)日：2019-03-28

申请号：US15903879

申请日：2018-02-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Hao Wang ,  Chia-Chi Chung ,  Han-Chih Chung ,  Yu-Xiang Lin ,  Yu-Shine Lin ,  Yu-Hen Wu ,  Han Wen Hsu

IPC: G03F7/20 ,  H01L21/027 ,  H01L21/67 ,  H01L21/02 ,  H01L21/687 ,  H01L33/00

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.

公开(公告)号：US20170117227A1

公开(公告)日：2017-04-27

申请号：US15154181

申请日：2016-05-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hu-Wei Lin ,  Chih-Hsien Hsu ,  Yu-Wei Chiu ,  Hai-Yin Chen ,  Ying-Hao Wang ,  Yu-Hen Wu

IPC: H01L23/544 ,  G03F7/20 ,  H01L21/67 ,  H01L21/027 ,  H01L21/308

CPC classification number: H01L23/544 ,  G03F7/70141 ,  G03F7/70541 ,  H01L21/0274 ,  H01L21/3086 ,  H01L21/67282 ,  H01L2223/54426 ,  H01L2223/54433

Abstract: In some embodiments, the present disclosure relates a lithographic substrate marking tool. The lithographic substrate marking tool has a first lithographic exposure tool arranged within a shared housing and configured to generate a first type of electromagnetic radiation during a plurality of exposures. A mobile reticle has a plurality of different reticle fields respectively configured to block a portion of the first type of electromagnetic radiation to expose a substrate identification mark within a photosensitive material overlying a semiconductor substrate. A transversal element is configured to move the mobile reticle so that separate ones of the plurality of reticle fields are exposed onto the photosensitive material during separate ones of the plurality of exposures. The mobile reticle therefore allows for different strings of substrate identification marks to be formed within the photoresistive material using a same reticle, thereby economically providing the benefits of lithographic substrate marking.