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公开(公告)号：US20110155328A1
公开(公告)日：2011-06-30
申请号：US13060925
申请日：2009-07-22
IPC分类号： B32B38/10
CPC分类号： H01L21/67132 , Y10S156/93 , Y10S156/941 , Y10T156/1105 , Y10T156/1174 , Y10T156/1906 , Y10T156/1978
摘要： A sheet peeling apparatus 10 includes: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a tape sticking means 14 for sticking a peeling tape T to the adhesive sheet S; a pulling means 13 for pulling the peeling tape T; a peeling assisting means 15 including an endless member 45 which is positioned on the adhesive sheet S, and wound on a guide member 41; and a sandwiching means 16 for sandwiching the adhesive sheet S between the endless member 45 and the sandwiching means 16. In the sheet peeling apparatus 10, the adhesive sheet S is peeled off due to the relative movement of the pulling means 13 and the supporting means 11 in a state that the adhesive sheet S is sandwiched between the peeling assisting means 15 and the sandwiching means 16.
摘要翻译： 片剥离装置10包括：支撑装置11，用于支撑粘贴有粘合片S的半导体晶片W; 用于将剥离带T粘贴到粘合片S上的胶带粘贴装置14; 用于拉动剥离带T的拉动装置13; 剥离辅助装置15，其包括定位在粘合片S上的环形构件45，并缠绕在引导构件41上; 以及用于将粘合片S夹在环形构件45和夹持装置16之间的夹持装置16.在片材剥离装置10中，由于拉动装置13和支撑装置的相对运动，粘合片S被剥离 在粘合片S夹在剥离辅助装置15和夹持装置16之间的状态下，
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公开(公告)号：US06238515B1
公开(公告)日：2001-05-29
申请号：US09376996
申请日：1999-08-18
IPC分类号： H01L2178
CPC分类号： H01L21/67132 , H01L21/68 , H01L2221/6839 , Y10S414/137 , Y10S414/141 , Y10T156/1705 , Y10T156/1983
摘要： A wafer transfer apparatus for sticking a wafer, which is divided into a multiplicity of chips and which has its surface stuck with a protective tape, to a ring frame by a transfer tape, includes: a positioning unit capable of disposing the protective tape stuck wafer on a positioning table and capable of performing a position adjustment of the wafer in longitudinal, lateral and rotational directions, so that the wafer is located in a reference position; a transfer tape mount unit capable of disposing the protective tape stuck wafer, which has been located in the reference position by the positioning unit, on a transfer tape mount table, and capable of sticking a transfer tape to both a ring frame disposed round periphery of the wafer and back of the wafer, so that the wafer and the ring frame are stuck to each other and integrated; and a protective tape peeling unit capable of disposing the wafer, which has its back covered with the transfer tape and which has been integrated with the ring frame by the transfer tape mount unit, on a protective tape peeling table, and capable of bonding an end of a peeling tape to an end of the protective tape stuck to the wafer surface, and capable of pulling the peeling tape so that the protective tape is peeled from the wafer surface.
摘要翻译： 将通过转印带将被分割为多个芯片并且其表面粘贴有保护带的晶片的晶片传送装置包括：能够将保护带粘贴的晶片 并且能够在纵向，横向和旋转方向上执行晶片的位置调整，使得晶片位于参考位置; 一种转印带安装单元，其能够将位于参考位置的定位单元的保护带粘贴的晶片放置在转印带安装台上，并且能够将转印带粘附到设置在圆周周围的环形框架 晶片和晶片的背面，使得晶片和环形框架彼此粘合并集成; 以及保护带剥离单元，其能够将其后面被转印带覆盖并且通过转印带安装单元与环形框架一体化的晶片设置在保护带剥离台上，并且能够将端部 剥离胶带粘附到保护胶带的端部，粘贴在晶片表面上，并且能够拉动剥离带使得保护带从晶片表面剥离。
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13.发明授权公开(公告)号：US06176966B1
公开(公告)日：2001-01-23
申请号：US09095739
申请日：1998-06-11
申请人： Masaki Tsujimoto , Kenji Kobayashi
发明人： Masaki Tsujimoto , Kenji Kobayashi
IPC分类号： B32B3500
CPC分类号： H01L21/6836 , H01L21/67132 , H01L2221/68327 , Y10S156/941 , Y10T29/49819 , Y10T29/49821 , Y10T29/49822 , Y10T156/11 , Y10T156/1132 , Y10T156/19
摘要： A method of die bonding electronic components. A wafer is mounted on a dicing tape (17) comprising at least one layer of shrink film and a pressure sensitive adhesive layer so that the wafer is stuck thereto by the pressure sensitive adhesive layer. The wafer is then diced so that the wafer is cut apart into a multiplicity of chips (16). The dicing tape (17) having the multiplicity of chips stuck thereto is placed on a table equipped with heating means. This is followed by shrinking the shrink film forming part of the dicing tape by the heating means (3, 7) so that an area of adhesion and adhesive strength between the chips and the adhesive layer are decreased and so that the chips are arranged with predetermined spacings. The final step is suctioning the chips (16) arranged with predetermined spacings one at a time by a suction collet (19) disposed above the chips so that the chips are separated from each other. This method enables effective die bonding without damaging the chips. Apparatus for effecting the method is also provided.
摘要翻译： 一种将电子元件贴合的方法。 将晶片安装在包括至少一层收缩膜和压敏粘合剂层的切割带（17）上，使得晶片通过压敏粘合剂层粘附到其上。 然后对晶片进行切割，使得晶片被切割成多个芯片（16）。 将具有多个芯片的切割胶带（17）放置在装有加热装置的工作台上。 然后，通过加热装置（3,7）使形成切割带的部分的收缩膜收缩，使得芯片和粘合剂层之间的粘附面积和粘合强度降低，使得芯片以预定的方式排列 间距。 最后一步是通过设置在芯片上方的吸入夹头（19）一次抽吸以预定间隔布置的芯片（16），使得芯片彼此分离。 该方法能够有效地进行裸片接合而不损坏芯片。 还提供了用于实现该方法的装置。
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公开(公告)号：US20070235131A1
公开(公告)日：2007-10-11
申请号：US11587854
申请日：2005-04-27
IPC分类号： B32B33/00
CPC分类号： H01L21/68714 , B29C63/0013 , H01L21/67092 , H01L21/67132 , H01L2221/6834 , H01L2221/68395 , H01L2224/16 , H01L2924/01004 , H01L2924/01078 , Y10T156/1168 , Y10T156/1174 , Y10T156/195 , Y10T156/1978
摘要： A peeling apparatus 10 includes a peeling table 11 supporting a wafer W on which a sheet S is stuck and a sheet peeling unit 12 disposed above the peeling table 11, in which sheet S can be peeled off with relative movement of the sheet peeling unit 12 and the peeling table 11. The peeling apparatus 10 includes a support roll 20 of peeling tape PT, first and second rolls 30, 31 bonding the peeling tape PT to the sheet S surface, and a winding roll 21 of the peeling tape PT. Peeling-off is performed in a state of forming an initial peeling angle a1 such that a peeling tape PT is folded in an aperture C formed between the second roll 31 and the sheet S, and afterwards the sheet S is peeled off at subsequent peeling angle a2 corresponding to a diameter of the second roll 31.
摘要翻译： 剥离装置10包括：支撑粘贴有片材S的晶片W的剥离台11和设置在剥离台11上方的片材剥离单元12，其中片材S可以通过片材剥离单元12的相对运动而被剥离 和剥离台11.剥离装置10包括剥离带PT的支撑辊20，将剥离带PT粘合到片材S表面的第一和第二辊30,31以及剥离带PT的卷绕辊21。 在形成初始剥离角度a 1的状态下进行剥离，使得剥离带PT在形成在第二辊31和片材S之间的孔C中折叠，然后片材S随后剥离而剥离 角度α2对应于第二辊31的直径。
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公开(公告)号：US06616799B2
公开(公告)日：2003-09-09
申请号：US09755384
申请日：2001-01-03
IPC分类号： B32B3500
CPC分类号： H01L21/67132 , Y10T156/1168 , Y10T156/1179 , Y10T156/19 , Y10T156/1983
摘要： A protecting sheet applied to a wafer is removed by using an adhesive tape with a prescribed length, by bonding the adhesive tape to an edge portion of the protecting sheet and then pulling the adhesive tape. During pulling, a guide roller is held in contact with the protecting sheet and, while the guide roller is held in a fixed position, a peeling head portion and a table are moved in the opposite direction with each other to thereby remove the protecting sheet.
摘要翻译： 通过使用具有规定长度的粘合带，将粘合带粘合到保护片的边缘部分，然后拉动粘合带，去除施加到晶片上的保护片。 在牵引期间，引导辊与保护片保持接触，并且当引导辊保持在固定位置时，剥离头部和台沿彼此相反的方向移动，从而移除保护片。
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公开(公告)号：US6149758A
公开(公告)日：2000-11-21
申请号：US90762
申请日：1998-06-04
CPC分类号： H01L21/67132 , Y10S156/942 , Y10T156/11 , Y10T156/1179 , Y10T156/1978
摘要： In an apparatus and method of using an adhesive tape to remove a protecting sheet applied to a semiconductor wafer, a heat-sensitive adhesive tape is thermocompressively bonded by a heat tool to an edge portion of the protecting sheet, after which a cutting blade cuts the adhesive sheet to a prescribed length, and then a tape peeling head grasps the cut adhesive tape and moves in a direction to pull the adhesive tape so as to remove the protecting sheet of the semiconductor wafer, with the removed sheet then being disposed of together with the adhesive tape into a disposal box.
摘要翻译： 在使用粘合带除去施加到半导体晶片的保护片的装置和方法中，将热敏粘合带通过热工具热压粘合到保护片的边缘部分，之后切割刀切割 粘合片到规定长度，然后带剥离头抓住切割的胶带并沿着拉动粘合带的方向移动，以移除半导体晶片的保护片，然后将去除的片与 胶带进入处理箱。
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公开(公告)号：US09450439B2
公开(公告)日：2016-09-20
申请号：US14237909
申请日：2012-06-13
申请人： Hiroo Hongo , Koji Kudo , Kenichi Ishii , Kenji Kobayashi , Takayuki Nyu
发明人： Hiroo Hongo , Koji Kudo , Kenichi Ishii , Kenji Kobayashi , Takayuki Nyu
IPC分类号： H02J7/00 , H01M10/44 , H01M4/505 , H01M10/052 , H01M10/42
CPC分类号： H02J7/0068 , H01M4/505 , H01M10/052 , H01M10/44 , H01M2010/4271 , Y02E60/122 , Y02P70/54 , Y02T10/7011
摘要： A secondary battery has a progressively deteriorating SOC in which battery performance deteriorates when the secondary battery is stored, and is charged and discharged by a control device. An information processing device stores a preset first threshold smaller than the progressively deteriorating SOC of the secondary battery and a preset second threshold greater than the progressively deteriorating SOC, and separates the range from the minimum SOC to the maximum SOC of the secondary battery into, at least, two regions by setting the section from the first threshold to the second threshold as a boundary to thereby cause the control device to charge or discharge the secondary battery within any of the above regions.
摘要翻译： 二次电池在存储二次电池时电池性能恶化的SOC逐渐恶化，并且通过控制装置进行充放电。 信息处理装置存储比二次电池的逐渐劣化的SOC小的预设的第一阈值和大于逐渐恶化的SOC的预设的第二阈值，并且将从最小SOC到最小SOC的范围分离成 至少两个区域通过将从第一阈值到第二阈值的部分设置为边界，从而使得控制装置在任何上述区域内对二次电池进行充电或放电。
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公开(公告)号：US09047219B2
公开(公告)日：2015-06-02
申请号：US13570398
申请日：2012-08-09
申请人： Hidejirou Daikokuya , Kazuhiko Ikeuchi , Takeshi Watanabe , Norihide Kubota , Atsushi Igashira , Kenji Kobayashi , Ryota Tsukahara
发明人： Hidejirou Daikokuya , Kazuhiko Ikeuchi , Takeshi Watanabe , Norihide Kubota , Atsushi Igashira , Kenji Kobayashi , Ryota Tsukahara
CPC分类号： G06F11/1092 , G06F11/0727 , G06F11/076 , G06F11/0772 , G06F11/2094
摘要： A control device manages a plurality of storage devices so that data to be recorded is redundantly recorded in different storage devices. An error monitoring unit monitors an occurrence of an error in each of the plurality of storage devices to register information indicative of error occurrence conditions in an error information storage unit for each storage device. When the use of one of the plurality of storage devices is stopped, a rebuild controller determines a timing to perform rebuild processing based on past error occurrence conditions in the storage devices other than the one storage device of the plurality of storage devices by referring to information registered in the error information storage unit.
摘要翻译： 控制装置管理多个存储装置，使得要记录的数据被冗余地记录在不同的存储装置中。 错误监视单元监视多个存储设备中的每一个中的错误的发生，以在每个存储设备的错误信息存储单元中注册表示错误发生状况的信息。 当停止使用多个存储装置中的一个时，重建控制器通过参考信息，基于多个存储装置中的一个存储装置以外的存储装置中的过去的错误发生状况来确定执行重建处理的定时 登记在错误信息存储单元中。
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公开(公告)号：US09028461B2
公开(公告)日：2015-05-12
申请号：US13976847
申请日：2011-12-22
IPC分类号： A61F13/496 , A61F13/514 , A61F13/49 , A61F13/15
CPC分类号： A61F13/49012 , A61F13/15593 , A61F13/15699 , A61F13/49011 , A61F13/4902 , A61F13/496 , Y10T156/1064
摘要： A pull-on wear article having a front portion that is adapted to be worn around the front side of a wearer, a crotch portion that is adapted to be worn along the wearer's crotch region, and a rear portion that is adapted to be worn around the wearer's rear side, which is formed into a pants form by bonding lateral side edges of the front portion and lateral side edges of the rear portion, wherein the front portion and the rear portion are each constituted by an outer cover in which an inner layer material and an outer layer material are laminated, the outer cover has plural single layer areas that are formed of the inner layer material or the outer layer material at intervals in the direction of length of the outer cover, and the laminate areas where the inner layer material and outer layer material are laminated have elasticity in the waist-surrounding direction of the outer cover.
摘要翻译： 具有适于佩戴在穿戴者的前侧的前部的穿着物品，适于沿着穿着者裆部区域佩戴的裆部和适于佩戴在周围的后部 穿戴者的后侧通过粘合后部的前部和侧边缘的侧边缘而形成裤形，其中前部和后部各自由外盖构成，其中内层 材料和外层材料层叠，外盖具有由外层材料或外层材料沿着外盖的长度方向间隔地形成的多个单层区域，其中内层 层压材料和外层材料在外罩的腰围方向具有弹性。
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公开(公告)号：US08930748B2
公开(公告)日：2015-01-06
申请号：US13371503
申请日：2012-02-13
申请人： Kazuhiko Ikeuchi , Hidejirou Daikokuya , Chikashi Maeda , Norihide Kubota , Atsushi Igashira , Kenji Kobayashi , Ryouta Tsukahara
发明人： Kazuhiko Ikeuchi , Hidejirou Daikokuya , Chikashi Maeda , Norihide Kubota , Atsushi Igashira , Kenji Kobayashi , Ryouta Tsukahara
CPC分类号： G11B27/36 , G06F11/2082 , G06F11/2094 , G11B27/002
摘要： A storage apparatus includes a plurality of first storage mediums in which data is redundantly stored and a controller. The controller includes a formatting section which performs formatting in each of the plurality of first storage mediums, a detection section which detects a failure that has occurred in the plurality of first storage mediums, a control section which makes the formatting section stop the formatting at the time of the detection of the failure by the detection section and which rebuilds the data stored in the plurality of first storage mediums in which the failure has occurred in a second storage medium other than the plurality of first storage mediums, and a rebuild processing section which rebuilds the data stored in the plurality of first storage mediums in the second storage medium in accordance with instructions from the control section.
摘要翻译： 存储装置包括冗余存储数据的多个第一存储介质和控制器。 控制器包括格式化部分，其在多个第一存储介质中的每一个中执行格式化;检测部分，其检测在多个第一存储介质中发生的故障;控制部分，其使格式化部分停止在 检测部分检测到故障的时间，以及重建存储在其中发生故障的多个第一存储介质中的数据在除了多个第一存储介质之外的第二存储介质中的数据;以及重建处理部分， 根据来自控制部分的指令重建存储在第二存储介质中的多个第一存储介质中的数据。
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