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公开(公告)号：US06616799B2
公开(公告)日：2003-09-09
申请号：US09755384
申请日：2001-01-03
IPC分类号： B32B3500
CPC分类号： H01L21/67132 , Y10T156/1168 , Y10T156/1179 , Y10T156/19 , Y10T156/1983
摘要： A protecting sheet applied to a wafer is removed by using an adhesive tape with a prescribed length, by bonding the adhesive tape to an edge portion of the protecting sheet and then pulling the adhesive tape. During pulling, a guide roller is held in contact with the protecting sheet and, while the guide roller is held in a fixed position, a peeling head portion and a table are moved in the opposite direction with each other to thereby remove the protecting sheet.
摘要翻译： 通过使用具有规定长度的粘合带，将粘合带粘合到保护片的边缘部分，然后拉动粘合带，去除施加到晶片上的保护片。 在牵引期间，引导辊与保护片保持接触，并且当引导辊保持在固定位置时，剥离头部和台沿彼此相反的方向移动，从而移除保护片。
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公开(公告)号：US08196632B2
公开(公告)日：2012-06-12
申请号：US10574847
申请日：2004-09-29
CPC分类号： H01L21/6836 , H01L21/67132 , H01L2221/68327 , Y10T156/1062 , Y10T156/1075 , Y10T156/1085 , Y10T156/1322 , Y10T156/1339 , Y10T156/1352
摘要： There is provided a mounting apparatus capable of forming dicing tapes in the process of feeding-out a strip material, and sticking the dicing tape to a ring frame to fix a semiconductor wafer.The mounting apparatus 10 sticks the dicing tape to the ring frame RF to fix the semiconductor wafer to the ring frame in a state that the ring frame RF and the semiconductor wafer W are disposed on a table 11. The mounting apparatus 10 includes a pre-cut means 13 for forming a cut L in a state of half cut in a film FL of a strip material A to form a dicing tape T in the process of feeding out the strip material A and a sticking means 34 for peeling off the dicing tape from a base sheet S to stick the dicing tape to the ring frame RF.
摘要翻译： 提供一种能够在送出带状材料的过程中形成切割带并将切割带粘贴到环形框架上以固定半导体晶片的安装装置。 安装装置10将切割带粘贴到环形框架RF上，以将环形框架RF和半导体晶片W设置在工作台11上的状态将半导体晶片固定到环形框架上。安装装置10包括： 切割装置13，用于在条带材料A的膜FL中形成半切状态的切割L，以在送出条带材料A的过程中形成切割条T.以及用于剥离切割带的粘贴装置34 从基片S将切割带粘贴到环形框架RF上。
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公开(公告)号：US07798195B2
公开(公告)日：2010-09-21
申请号：US11578990
申请日：2005-04-20
CPC分类号： H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68395 , H01L2924/3025 , Y10T156/1132 , Y10T156/1168 , Y10T156/19 , Y10T156/1944 , Y10T156/1978
摘要： A wafer W is supported on the rear surface side thereof by a ring frame R by means of a dicing tape T, and a protection tape H is stuck on the front surface side the wafer W. A suction unit 12 includes a table 16 having a suction face 15 in the upper face. The suction face 15 sucks the dicing tape T to hold the wafer W through performing a predetermined suction. At least in a partial area along the periphery of the suction face 15, a groove 24 is formed. By sucking through the suction face 15, the inside of the groove 24 becomes negative pressure and the dicing tape T is sunk therein.
摘要翻译： 晶片W通过环形框架R通过切割带T支撑在其后表面侧，保护带H粘贴在晶片W的正面侧。抽吸单元12包括具有 吸力面15在上面。 抽吸面15通过执行预定的吸力吸附切割带T以保持晶片W。 至少在沿着吸附面15的周边的局部区域中形成有槽24。 通过从吸附面15吸引，槽24的内部成为负压，切割带T下沉。
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公开(公告)号：US07846289B2
公开(公告)日：2010-12-07
申请号：US11587854
申请日：2005-04-27
IPC分类号： B32B38/10
CPC分类号： H01L21/68714 , B29C63/0013 , H01L21/67092 , H01L21/67132 , H01L2221/6834 , H01L2221/68395 , H01L2224/16 , H01L2924/01004 , H01L2924/01078 , Y10T156/1168 , Y10T156/1174 , Y10T156/195 , Y10T156/1978
摘要： A peeling apparatus 10 includes a peeling table 11 supporting a wafer W on which a sheet S is stuck and a sheet peeling unit 12 disposed above the peeling table 11, in which sheet S can be peeled off with relative movement of the sheet peeling unit 12 and the peeling table 11. The peeling apparatus 10 includes a support roll 20 of peeling tape PT, first and second rolls 30, 31 bonding the peeling tape PT to the sheet S surface, and a winding roll 21 of the peeling tape PT. Peeling-off is performed in a state of forming an initial peeling angle a1 such that a peeling tape PT is folded in an aperture C formed between the second roll 31 and the sheet S, and afterwards the sheet S is peeled off at subsequent peeling angle a2 corresponding to a diameter of the second roll 31.
摘要翻译： 剥离装置10包括：支撑粘贴有片材S的晶片W的剥离台11和设置在剥离台11上方的片材剥离单元12，其中片材S可以通过片材剥离单元12的相对运动而被剥离 和剥离台11.剥离装置10包括剥离带PT的支撑辊20，将剥离带PT粘合到片材S表面的第一和第二辊30,31以及剥离带PT的卷绕辊21。 在形成初始剥离角度a1的状态下执行剥离，使得剥离带PT在形成在第二辊31和片材S之间的孔C中折叠，然后在随后的剥离角度剥离片材S a2对应于第二辊31的直径。
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公开(公告)号：US20100096090A1
公开(公告)日：2010-04-22
申请号：US11914903
申请日：2006-04-24
IPC分类号： B32B41/00
CPC分类号： B29C63/02 , B29C63/0095 , B29C65/4825 , B29C65/5057 , B29C65/5092 , B29C65/526 , B29C65/7861 , B29C65/7867 , B29C66/1122 , B29C66/452 , B29C66/8223 , B29C66/8242 , B29C66/83411 , B29L2017/005 , B32B37/025 , B32B2457/14 , H01L21/00 , H01L21/67132 , H01L21/68 , H01L21/6835 , H01L24/27 , H01L24/743 , H01L24/83 , H01L2224/274 , H01L2224/743 , H01L2224/83191 , H01L2924/01004 , H01L2924/01029 , B29C65/00 , H01L2924/00
摘要： A sticking apparatus includes a sticking table 21 for supporting a semiconductor wafer W and a sticking unit 24 that peels off an adhesive sheet S1 from a release liner PS and sticks the adhesive sheet to the semiconductor wafer W. The sticking unit 24 has a detector 60. The detector 60 is disposed above a feed-out path of a raw strip sheet L for detecting a displacement amount S of the adhesive sheet S1 in the lateral direction perpendicular to the feed-out direction thereof. When the displacement amount S is detected, a displacement correction device 51 is activated and the sticking table 21 is moved by a distance corresponding to the displacement amount S, thereby the adhesive sheet S1 can be stuck onto the semiconductor wafer W in accordance with the outer shape thereof. The adhesive sheet S1 is stuck onto the wafer W by a sticking roll 61, which is brought into a contact with the release liner PS to impart a pressing force thereto.
摘要翻译： 粘贴装置包括用于支撑半导体晶片W的粘贴台21和从剥离衬垫PS剥离粘合片S1的粘贴单元24，并将粘合片粘贴到半导体晶片W.粘贴单元24具有检测器60 检测器60设置在用于检测粘合片S1在与其输出方向垂直的横向方向上的位移量S的原纸片材L的送出路径的上方。 当检测到位移量S时，位移校正装置51被启动，并且粘贴台21移动与位移量S相对应的距离，从而粘合片S1可以根据外部粘合剂粘贴到半导体晶片W上 形状。 粘合片S1通过与剥离衬垫PS接触以对其施加压力的粘着辊61粘附在晶片W上。
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公开(公告)号：US07611600B2
公开(公告)日：2009-11-03
申请号：US11587853
申请日：2005-04-27
CPC分类号： H01L21/67132 , Y10T156/108 , Y10T156/11 , Y10T156/1195 , Y10T156/12 , Y10T156/16 , Y10T156/17 , Y10T156/19 , Y10T156/1994
摘要： A sticking apparatus 10 includes a sticking table 11 supporting a semiconductor wafer W and a sticking unit 12 sticking a heat sensitive adhesive sheet S to the semiconductor wafer W. The sticking unit 12 includes a peeling section that, when paying out a raw sheet L having adhesive sheet S laminated to one side face of a release liner PS, peels off the release liner PS and the adhesive sheet S and a sheet preliminary peeling unit 40 provided at an upstream side of the peeling section in a pay-out direction of the raw sheet. The sheet preliminary peeling unit 40 includes a moving member 50 that moves to and from in a state of being pinched between the release liner PS and the adhesive sheet S. The preliminarily peeled-off release liner PS and adhesive sheet S are temporarily re-bonded by a temporary re-bonding unit 41, enabling to stick the adhesive sheet S on the wafer W.
摘要翻译： 粘贴装置10包括支撑半导体晶片W的粘贴台11和将热敏粘合片S粘贴到半导体晶片W的粘贴单元12.粘贴单元12包括：剥离部，当将具有 将剥离衬垫PS的一个侧面层合的粘合片S剥离剥离衬垫PS和粘合片S，以及在原料的放出方向上设置在剥离部的上游侧的片材预剥离部40 片。 片材预剥离单元40包括在被剥离衬垫PS和粘合片S之间夹持的状态下移动的移动构件50.预先剥离的剥离衬垫PS和粘合片S暂时重新粘合 通过临时重新接合单元41，能够将粘合片S粘合在晶片W上。
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公开(公告)号：US20070169895A1
公开(公告)日：2007-07-26
申请号：US11578990
申请日：2005-04-20
IPC分类号： H01L21/304 , B29C63/00
CPC分类号： H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68395 , H01L2924/3025 , Y10T156/1132 , Y10T156/1168 , Y10T156/19 , Y10T156/1944 , Y10T156/1978
摘要： A wafer W is supported on the rear surface side thereof by a ring frame R by means of a dicing tape T, and a protection tape H is stuck on the front surface side the wafer W. A suction unit 12 includes a table 16 having a suction face 15 in the upper face. The suction face 15 sucks the dicing tape T to hold the wafer W through performing a predetermined suction. At least in a partial area along the periphery of the suction face 15, a groove 24 is formed. By sucking through the suction face 15, the inside of the groove 24 becomes negative pressure and the dicing tape T is sunk therein.
摘要翻译： 晶片W通过环形框架R通过切割带T支撑在其后表面侧，保护带H粘贴在晶片W的正面侧。抽吸单元12包括具有 吸力面15在上面。 抽吸面15通过执行预定的吸力吸附切割带T以保持晶片W。 至少在沿着吸附面15的周边的局部区域中形成有槽24。 通过从吸附面15吸引，槽24的内部成为负压，切割带T下沉。
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公开(公告)号：US06238515B1
公开(公告)日：2001-05-29
申请号：US09376996
申请日：1999-08-18
IPC分类号： H01L2178
CPC分类号： H01L21/67132 , H01L21/68 , H01L2221/6839 , Y10S414/137 , Y10S414/141 , Y10T156/1705 , Y10T156/1983
摘要： A wafer transfer apparatus for sticking a wafer, which is divided into a multiplicity of chips and which has its surface stuck with a protective tape, to a ring frame by a transfer tape, includes: a positioning unit capable of disposing the protective tape stuck wafer on a positioning table and capable of performing a position adjustment of the wafer in longitudinal, lateral and rotational directions, so that the wafer is located in a reference position; a transfer tape mount unit capable of disposing the protective tape stuck wafer, which has been located in the reference position by the positioning unit, on a transfer tape mount table, and capable of sticking a transfer tape to both a ring frame disposed round periphery of the wafer and back of the wafer, so that the wafer and the ring frame are stuck to each other and integrated; and a protective tape peeling unit capable of disposing the wafer, which has its back covered with the transfer tape and which has been integrated with the ring frame by the transfer tape mount unit, on a protective tape peeling table, and capable of bonding an end of a peeling tape to an end of the protective tape stuck to the wafer surface, and capable of pulling the peeling tape so that the protective tape is peeled from the wafer surface.
摘要翻译： 将通过转印带将被分割为多个芯片并且其表面粘贴有保护带的晶片的晶片传送装置包括：能够将保护带粘贴的晶片 并且能够在纵向，横向和旋转方向上执行晶片的位置调整，使得晶片位于参考位置; 一种转印带安装单元，其能够将位于参考位置的定位单元的保护带粘贴的晶片放置在转印带安装台上，并且能够将转印带粘附到设置在圆周周围的环形框架 晶片和晶片的背面，使得晶片和环形框架彼此粘合并集成; 以及保护带剥离单元，其能够将其后面被转印带覆盖并且通过转印带安装单元与环形框架一体化的晶片设置在保护带剥离台上，并且能够将端部 剥离胶带粘附到保护胶带的端部，粘贴在晶片表面上，并且能够拉动剥离带使得保护带从晶片表面剥离。
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9.发明授权公开(公告)号：US06176966B1
公开(公告)日：2001-01-23
申请号：US09095739
申请日：1998-06-11
申请人： Masaki Tsujimoto , Kenji Kobayashi
发明人： Masaki Tsujimoto , Kenji Kobayashi
IPC分类号： B32B3500
CPC分类号： H01L21/6836 , H01L21/67132 , H01L2221/68327 , Y10S156/941 , Y10T29/49819 , Y10T29/49821 , Y10T29/49822 , Y10T156/11 , Y10T156/1132 , Y10T156/19
摘要： A method of die bonding electronic components. A wafer is mounted on a dicing tape (17) comprising at least one layer of shrink film and a pressure sensitive adhesive layer so that the wafer is stuck thereto by the pressure sensitive adhesive layer. The wafer is then diced so that the wafer is cut apart into a multiplicity of chips (16). The dicing tape (17) having the multiplicity of chips stuck thereto is placed on a table equipped with heating means. This is followed by shrinking the shrink film forming part of the dicing tape by the heating means (3, 7) so that an area of adhesion and adhesive strength between the chips and the adhesive layer are decreased and so that the chips are arranged with predetermined spacings. The final step is suctioning the chips (16) arranged with predetermined spacings one at a time by a suction collet (19) disposed above the chips so that the chips are separated from each other. This method enables effective die bonding without damaging the chips. Apparatus for effecting the method is also provided.
摘要翻译： 一种将电子元件贴合的方法。 将晶片安装在包括至少一层收缩膜和压敏粘合剂层的切割带（17）上，使得晶片通过压敏粘合剂层粘附到其上。 然后对晶片进行切割，使得晶片被切割成多个芯片（16）。 将具有多个芯片的切割胶带（17）放置在装有加热装置的工作台上。 然后，通过加热装置（3,7）使形成切割带的部分的收缩膜收缩，使得芯片和粘合剂层之间的粘附面积和粘合强度降低，使得芯片以预定的方式排列 间距。 最后一步是通过设置在芯片上方的吸入夹头（19）一次抽吸以预定间隔布置的芯片（16），使得芯片彼此分离。 该方法能够有效地进行裸片接合而不损坏芯片。 还提供了用于实现该方法的装置。
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公开(公告)号：US20080011412A1
公开(公告)日：2008-01-17
申请号：US11629863
申请日：2005-06-22
IPC分类号： H01L21/68
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68395 , H01L2224/274 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/07802 , Y10T156/1978
摘要： A sheet peeling apparatus 50 which, after sticking a web material LS laminated with heat sensitive adhesive type adhesive sheet S on a release liner PS to a semiconductor wafer W, cuts the web material along the periphery of a semiconductor wafer and peels off a release liner PS portion positioned on the semiconductor wafer and a web material portion S1 positioned at the periphery side around the semiconductor wafer. The apparatus is equipped with a roll 135 capable of performing a relative movement with respect to the table 47 supporting the wafer W, and is arranged to stick a peeling tape ST to the web material LS with the roll, and then winds to peel off the tape; thus, only the adhesive sheet S is left on the wafer W.
摘要翻译： 在剥离衬垫PS上粘合有热敏粘合型粘合片S的纤维网材料LS粘贴到半导体晶片W之后，将片材材料沿着半导体晶片的周边切割并剥离剥离衬垫 位于半导体晶片上的PS部分和位于半导体晶片周围的周边侧的幅材材料部分S1。 该装置配备有能够相对于支撑晶片W的工作台47执行相对移动的辊135，并且布置成将剥离带ST粘贴到具有辊的卷材LS上，然后卷绕 胶带; 因此，只有粘合片S留在晶片W.
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